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Formation of dish-like holes and a channel structure in electrodeposition of copper under hydrogen co-deposition
(Elsevier, 2007)
Copper electrodeposition from acid sulfate solutions at an overpotential of 1000 mV, which is about 250 mV outside the plateau of the limiting diffusion current density, was examined by the determination of the average ...
Influence of the magnetic field and magnetoresistance on the electrodeposition of Ni nanocontacts in thin films and microwires
(Elsevier, 2004)
We present a study of electrodeposition of Ni nanocontacts in thin film and microwires gaps under an external applied magnetic field. The study is performed in comparison with electrodeposition of Cu that is not a magnetic ...