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Effect of parameters of pulsating current (PC) regimes on morphology of electrodeposited copper in hydrogen co-deposition range
(Serbian Chemical Society, Belgrade, 2010)
The most often employed electrolytes for the electrodeposition of copper are those based on aqueous solutions of sulfuric acid (H2SO4) and cupric sulfate (CuSO4). There is an ionic equilibrium of a lot of species in the ...