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Response Surface Methodology and Artificial Neural Network-Based Models for Predicting Roughness of Cu coatings
(Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear angineering, 2020)
Copper coatings are produced on silicon wafer by electrodeposition (ED) in pulsating current (PC) regime. Electrodeposition was performed at various current density amplitudes in the range of 80−140 mA cm-2, frequency in ...