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Response Surface Methodology and Artificial Neural Network-Based Models for Predicting Roughness of Cu coatings
(Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear angineering, 2020)
Copper coatings are produced on silicon wafer by electrodeposition (ED) in pulsating current (PC) regime. Electrodeposition was performed at various current density amplitudes in the range of 80−140 mA cm-2, frequency in ...
Morphology, Structure and Mechanical Properties of Copper Coatings Electrodeposited by Pulsating Current (PC) Regime on Si(111)
(MDPI, 2020)
Copper electrodeposition on (111)-oriented Si substrate was performed by the pulsating current (PC) regime at various average current densities in the range of 15–70 mA·cm−2, obtained by varying either the frequency (30, ...