TY  - CONF
AU  - Lazić, Žarko
AU  - Smiljanić, Milče
AU  - Tanasković, Dragan
AU  - Rašljić Rafajilović, Milena
AU  - Cvetanović, Katarina
AU  - Milinković, Evgenija
AU  - Bošković, Marko V.
AU  - Andrić, Stevan
AU  - Poljak, Predrag
AU  - Frantlović, Miloš
PY  - 2023
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/7419
AB  - The existing instruments for aerodynamic pressure measurements are usually built around
an array of discrete pressure sensors, placed in the same housing together with a few discrete
temperature sensors. However, this approach is limiting, especially regarding miniaturization, sensor matching, and thermal coupling. In this work, we intend to overcome these limitations by proposing a novel MEMS multisensor chip, which has a monolithically integrated matrix of four piezoresistive MEMS pressure-sensing elements and two resistive temperature-sensing elements. After finishing the preliminary chip design, we performed computer simulations in order to assess its mechanical behavior when measured pressure is applied. Subsequently, the final chip design was completed, and the first batch was fabricated. The used technological processes included photolithography, thermal oxidation, diffusion, sputtering, micromachining (wet chemical etching), anodic bonding, and wafer dicing.
PB  - MDPI
C3  - Engineering proceedings
T1  - Development of a MEMS Multisensor Chip for Aerodynamic Pressure Measurements
VL  - 58
IS  - 1
SP  - 52
DO  - 10.3390/ecsa-10-16071
ER  - 

@conference{
author = "Lazić, Žarko and Smiljanić, Milče and Tanasković, Dragan and Rašljić Rafajilović, Milena and Cvetanović, Katarina and Milinković, Evgenija and Bošković, Marko V. and Andrić, Stevan and Poljak, Predrag and Frantlović, Miloš",
year = "2023",
abstract = "The existing instruments for aerodynamic pressure measurements are usually built around
an array of discrete pressure sensors, placed in the same housing together with a few discrete
temperature sensors. However, this approach is limiting, especially regarding miniaturization, sensor matching, and thermal coupling. In this work, we intend to overcome these limitations by proposing a novel MEMS multisensor chip, which has a monolithically integrated matrix of four piezoresistive MEMS pressure-sensing elements and two resistive temperature-sensing elements. After finishing the preliminary chip design, we performed computer simulations in order to assess its mechanical behavior when measured pressure is applied. Subsequently, the final chip design was completed, and the first batch was fabricated. The used technological processes included photolithography, thermal oxidation, diffusion, sputtering, micromachining (wet chemical etching), anodic bonding, and wafer dicing.",
publisher = "MDPI",
journal = "Engineering proceedings",
title = "Development of a MEMS Multisensor Chip for Aerodynamic Pressure Measurements",
volume = "58",
number = "1",
pages = "52",
doi = "10.3390/ecsa-10-16071"
}

Lazić, Ž., Smiljanić, M., Tanasković, D., Rašljić Rafajilović, M., Cvetanović, K., Milinković, E., Bošković, M. V., Andrić, S., Poljak, P.,& Frantlović, M.. (2023). Development of a MEMS Multisensor Chip for Aerodynamic Pressure Measurements. in Engineering proceedings
MDPI., 58(1), 52.
https://doi.org/10.3390/ecsa-10-16071

Lazić Ž, Smiljanić M, Tanasković D, Rašljić Rafajilović M, Cvetanović K, Milinković E, Bošković MV, Andrić S, Poljak P, Frantlović M. Development of a MEMS Multisensor Chip for Aerodynamic Pressure Measurements. in Engineering proceedings. 2023;58(1):52.
doi:10.3390/ecsa-10-16071 .

Lazić, Žarko, Smiljanić, Milče, Tanasković, Dragan, Rašljić Rafajilović, Milena, Cvetanović, Katarina, Milinković, Evgenija, Bošković, Marko V., Andrić, Stevan, Poljak, Predrag, Frantlović, Miloš, "Development of a MEMS Multisensor Chip for Aerodynamic Pressure Measurements" in Engineering proceedings, 58, no. 1 (2023):52,
https://doi.org/10.3390/ecsa-10-16071 . .