TY  - JOUR
AU  - Smiljanić, Milče M.
AU  - Lazić, Žarko
AU  - Jović, Vesna
AU  - Radjenović, Branislav
AU  - Radmilović-Radjenović, Marija
PY  - 2020
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/3490
AB  - This paper presents etching of convex corners with sides along <n10> and <100> crystallographic directions in a 25 wt% tetramethylammonium hydroxide (TMAH) water solution at 80 °C. We analyzed parallelograms as the mask patterns for anisotropic wet etching of Si (100). The sides of the parallelograms were designed along <n10> and <100> crystallographic directions (1 < n < 8). The acute corners of islands in the masking layer formed by <n10> and <100> crystallographic directions were smaller than 45°. All the crystallographic planes that appeared during etching in the experiment were determined. We found that the obtained types of 3D silicon shape sustain when n > 2. The convex corners were not distorted during etching. Therefore, no convex corner compensation is necessary. We fabricated three matrices of parallelograms with sides along crystallographic directions <310> and <100> as examples for possible applications. Additionally, the etching of matrices was simulated by the level set method. We obtained a good agreement between experiments and simulations.
PB  - MDPI
T2  - Micromachines
T1  - Etching of Uncompensated Convex Corners with Sides along <n10> and <100> in 25 wt% TMAH at 80 °C
VL  - 11
IS  - 3
SP  - 253
DO  - 10.3390/mi11030253
ER  - 

@article{
author = "Smiljanić, Milče M. and Lazić, Žarko and Jović, Vesna and Radjenović, Branislav and Radmilović-Radjenović, Marija",
year = "2020",
abstract = "This paper presents etching of convex corners with sides along <n10> and <100> crystallographic directions in a 25 wt% tetramethylammonium hydroxide (TMAH) water solution at 80 °C. We analyzed parallelograms as the mask patterns for anisotropic wet etching of Si (100). The sides of the parallelograms were designed along <n10> and <100> crystallographic directions (1 < n < 8). The acute corners of islands in the masking layer formed by <n10> and <100> crystallographic directions were smaller than 45°. All the crystallographic planes that appeared during etching in the experiment were determined. We found that the obtained types of 3D silicon shape sustain when n > 2. The convex corners were not distorted during etching. Therefore, no convex corner compensation is necessary. We fabricated three matrices of parallelograms with sides along crystallographic directions <310> and <100> as examples for possible applications. Additionally, the etching of matrices was simulated by the level set method. We obtained a good agreement between experiments and simulations.",
publisher = "MDPI",
journal = "Micromachines",
title = "Etching of Uncompensated Convex Corners with Sides along <n10> and <100> in 25 wt% TMAH at 80 °C",
volume = "11",
number = "3",
pages = "253",
doi = "10.3390/mi11030253"
}

Smiljanić, M. M., Lazić, Ž., Jović, V., Radjenović, B.,& Radmilović-Radjenović, M.. (2020). Etching of Uncompensated Convex Corners with Sides along <n10> and <100> in 25 wt% TMAH at 80 °C. in Micromachines
MDPI., 11(3), 253.
https://doi.org/10.3390/mi11030253

Smiljanić MM, Lazić Ž, Jović V, Radjenović B, Radmilović-Radjenović M. Etching of Uncompensated Convex Corners with Sides along <n10> and <100> in 25 wt% TMAH at 80 °C. in Micromachines. 2020;11(3):253.
doi:10.3390/mi11030253 .

Smiljanić, Milče M., Lazić, Žarko, Jović, Vesna, Radjenović, Branislav, Radmilović-Radjenović, Marija, "Etching of Uncompensated Convex Corners with Sides along <n10> and <100> in 25 wt% TMAH at 80 °C" in Micromachines, 11, no. 3 (2020):253,
https://doi.org/10.3390/mi11030253 . .

TY  - CONF
AU  - Smiljanić, Milče M.
AU  - Lazić, Žarko
AU  - Radjenović, Branislav
AU  - Radjenović-Radmilović, Marija
AU  - Jović, Vesna
AU  - Rašljić, Milena
AU  - Cvetanović, Katarina
AU  - Filipović, Ana
PY  - 2019
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/5771
AB  - In this paper, we present and analyze etching of 
parallelogram patterns in the masking layer on a (100) silicon in 
25 wt % TMAH water solution at the temperature of 80 0C. Sides 
of parallelogram islands in the masking layer are designed along 
<n10> and <100> crystallographic directions. A 3D simulation of 
the profile evolution from these patterns during etching of silicon 
using the level set method is also presented. We determined all
crystallographic planes that appear during etching in the 
experiment and obtained simulated etching profiles of these 3D 
structures. A good agreement between dominant 
crystallographic planes through experiments and simulations is 
obtained.
PB  - Society for Electronics, Telecommunications, Computers, Automatic Control and Nuclear Engineering
C3  - Proceedings - 6th International Conference on Electrical, Electronic and Computing Engineering, IcETRAN 2019, June 03 – 06, 2019, Silver Lake, Serbia
T1  - Etched Parallelogram Patterns with Sides Along <100> and <n10> Directions in 25 wt % TMAH
SP  - 584
EP  - 589
UR  - https://hdl.handle.net/21.15107/rcub_cer_5771
ER  - 

@conference{
author = "Smiljanić, Milče M. and Lazić, Žarko and Radjenović, Branislav and Radjenović-Radmilović, Marija and Jović, Vesna and Rašljić, Milena and Cvetanović, Katarina and Filipović, Ana",
year = "2019",
abstract = "In this paper, we present and analyze etching of 
parallelogram patterns in the masking layer on a (100) silicon in 
25 wt % TMAH water solution at the temperature of 80 0C. Sides 
of parallelogram islands in the masking layer are designed along 
<n10> and <100> crystallographic directions. A 3D simulation of 
the profile evolution from these patterns during etching of silicon 
using the level set method is also presented. We determined all
crystallographic planes that appear during etching in the 
experiment and obtained simulated etching profiles of these 3D 
structures. A good agreement between dominant 
crystallographic planes through experiments and simulations is 
obtained.",
publisher = "Society for Electronics, Telecommunications, Computers, Automatic Control and Nuclear Engineering",
journal = "Proceedings - 6th International Conference on Electrical, Electronic and Computing Engineering, IcETRAN 2019, June 03 – 06, 2019, Silver Lake, Serbia",
title = "Etched Parallelogram Patterns with Sides Along <100> and <n10> Directions in 25 wt % TMAH",
pages = "584-589",
url = "https://hdl.handle.net/21.15107/rcub_cer_5771"
}

Smiljanić, M. M., Lazić, Ž., Radjenović, B., Radjenović-Radmilović, M., Jović, V., Rašljić, M., Cvetanović, K.,& Filipović, A.. (2019). Etched Parallelogram Patterns with Sides Along <100> and <n10> Directions in 25 wt % TMAH. in Proceedings - 6th International Conference on Electrical, Electronic and Computing Engineering, IcETRAN 2019, June 03 – 06, 2019, Silver Lake, Serbia
Society for Electronics, Telecommunications, Computers, Automatic Control and Nuclear Engineering., 584-589.
https://hdl.handle.net/21.15107/rcub_cer_5771

Smiljanić MM, Lazić Ž, Radjenović B, Radjenović-Radmilović M, Jović V, Rašljić M, Cvetanović K, Filipović A. Etched Parallelogram Patterns with Sides Along <100> and <n10> Directions in 25 wt % TMAH. in Proceedings - 6th International Conference on Electrical, Electronic and Computing Engineering, IcETRAN 2019, June 03 – 06, 2019, Silver Lake, Serbia. 2019;:584-589.
https://hdl.handle.net/21.15107/rcub_cer_5771 .

Smiljanić, Milče M., Lazić, Žarko, Radjenović, Branislav, Radjenović-Radmilović, Marija, Jović, Vesna, Rašljić, Milena, Cvetanović, Katarina, Filipović, Ana, "Etched Parallelogram Patterns with Sides Along <100> and <n10> Directions in 25 wt % TMAH" in Proceedings - 6th International Conference on Electrical, Electronic and Computing Engineering, IcETRAN 2019, June 03 – 06, 2019, Silver Lake, Serbia (2019):584-589,
https://hdl.handle.net/21.15107/rcub_cer_5771 .

TY  - JOUR
AU  - Mladenović, Ivana
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Obradov, Marko
AU  - Vasiljević-Radović, Dana
AU  - Nikolić, Nebojša D.
AU  - Radojević, Vesna
PY  - 2019
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/3221
AB  - The mechanical properties of systems consisting of copper coatings
electrodeposited on both brass sheet (BS) and thick electrodeposited nickel
coating (ED Ni) substrates have been investigated. The electrodeposition of
copper coatings was performed with and without the ultrasound assistance. The
ultrasound application decreases root mean square (RMS) roughness of deposited Cu coating on both applied substrates, as obtained from non-contact
AFM measurement. The coating roughness is highly dependent on the substrate roughness, being the smallest for the Cu coatings deposited on ED Ni
substrate with the ultrasound mixing. The hardness and adhesion properties
were characterized using the Vickers microindentation test. Model of Korsunsky was applied to the experimental data for determination the film hardness and the model of Chen-Gao was used for the adhesion evaluation. The
introduction of ultrasonic agitation caused the changes in the film microstructure, and consequently in the mechanical properties. The copper coatings on
both substrates, have higher hardness when deposited from electrolyte with
ultrasound agitation. Although the type of the substrate has the major influence
on the adhesion strength, it can be said that Cu electrodeposition with ultrasonic mixing contributes to an increase in adhesion
AB  - Испитиванa су механичкa својствa композитних система који се састоје од електрохемијски исталожених превлака бакра на месингу (BS) и дебелим електрохемијски исталоженим превлакама никла на месинганој фолији (ED Ni) као супстратима. Превлаке
бакра на наведеним супстратима су исталожене из електролита без мешања или са
ултразвучним мешањем. Неконтактна микроскопија атомских сила (AFM) је показала
да храпавост, изражена средњом вредношћу квадратног одступања (RMS), исталожених
превлака бакра на обе врсте супстрата опада са применом ултразвучног мешања. Храпавост превлака у највећој мери зависи од храпавости супстрата, при чему су електрохемијски исталожене превлаке бакра са најмањом храпавошћу реализоване на супстратима Ni електрохемијским таложењем из електролита мешаног применом ултразвука.
Механичка својства тврдоће и адхезије превлака су анализирана Викерсовим тестом
утискивања са малим оптерећењима. За израчунавање апсолутне тврдоће превлака
коришћен је модел Korsunsky, док је за процену адхезије коришћен модел Chen-
-Gao. Примена ултразвучног мешања током процеса електрохемијског таложења бакра
довела је до промена у микроструктури превлака, па самим тим и промена у механичким својствима превлака. Превлаке бакра на оба супстрата имају већу тврдоћу када се
таложе из електролита уз ултразвучно мешање. На адхезију превлаке на подлогама највише утиче тип супстрата, али се може рећи да примена ултразвучног мешања доприноси
побољшању адхезије електрохемијски исталоженог бакра на наведеним супстратима.
PB  - Belgrade : Serbian Chemical Society
T2  - Journal of the Serbian Chemical Society
T1  - Mechanical characterization of copper coatings electrodeposited onto different substrates with and without ultrasound assistance
VL  - 84
IS  - 7
SP  - 729
EP  - 741
DO  - 10.2298/JSC181003023M
ER  - 

@article{
author = "Mladenović, Ivana and Lamovec, Jelena and Jović, Vesna and Obradov, Marko and Vasiljević-Radović, Dana and Nikolić, Nebojša D. and Radojević, Vesna",
year = "2019",
abstract = "The mechanical properties of systems consisting of copper coatings
electrodeposited on both brass sheet (BS) and thick electrodeposited nickel
coating (ED Ni) substrates have been investigated. The electrodeposition of
copper coatings was performed with and without the ultrasound assistance. The
ultrasound application decreases root mean square (RMS) roughness of deposited Cu coating on both applied substrates, as obtained from non-contact
AFM measurement. The coating roughness is highly dependent on the substrate roughness, being the smallest for the Cu coatings deposited on ED Ni
substrate with the ultrasound mixing. The hardness and adhesion properties
were characterized using the Vickers microindentation test. Model of Korsunsky was applied to the experimental data for determination the film hardness and the model of Chen-Gao was used for the adhesion evaluation. The
introduction of ultrasonic agitation caused the changes in the film microstructure, and consequently in the mechanical properties. The copper coatings on
both substrates, have higher hardness when deposited from electrolyte with
ultrasound agitation. Although the type of the substrate has the major influence
on the adhesion strength, it can be said that Cu electrodeposition with ultrasonic mixing contributes to an increase in adhesion, Испитиванa су механичкa својствa композитних система који се састоје од електрохемијски исталожених превлака бакра на месингу (BS) и дебелим електрохемијски исталоженим превлакама никла на месинганој фолији (ED Ni) као супстратима. Превлаке
бакра на наведеним супстратима су исталожене из електролита без мешања или са
ултразвучним мешањем. Неконтактна микроскопија атомских сила (AFM) је показала
да храпавост, изражена средњом вредношћу квадратног одступања (RMS), исталожених
превлака бакра на обе врсте супстрата опада са применом ултразвучног мешања. Храпавост превлака у највећој мери зависи од храпавости супстрата, при чему су електрохемијски исталожене превлаке бакра са најмањом храпавошћу реализоване на супстратима Ni електрохемијским таложењем из електролита мешаног применом ултразвука.
Механичка својства тврдоће и адхезије превлака су анализирана Викерсовим тестом
утискивања са малим оптерећењима. За израчунавање апсолутне тврдоће превлака
коришћен је модел Korsunsky, док је за процену адхезије коришћен модел Chen-
-Gao. Примена ултразвучног мешања током процеса електрохемијског таложења бакра
довела је до промена у микроструктури превлака, па самим тим и промена у механичким својствима превлака. Превлаке бакра на оба супстрата имају већу тврдоћу када се
таложе из електролита уз ултразвучно мешање. На адхезију превлаке на подлогама највише утиче тип супстрата, али се може рећи да примена ултразвучног мешања доприноси
побољшању адхезије електрохемијски исталоженог бакра на наведеним супстратима.",
publisher = "Belgrade : Serbian Chemical Society",
journal = "Journal of the Serbian Chemical Society",
title = "Mechanical characterization of copper coatings electrodeposited onto different substrates with and without ultrasound assistance",
volume = "84",
number = "7",
pages = "729-741",
doi = "10.2298/JSC181003023M"
}

Mladenović, I., Lamovec, J., Jović, V., Obradov, M., Vasiljević-Radović, D., Nikolić, N. D.,& Radojević, V.. (2019). Mechanical characterization of copper coatings electrodeposited onto different substrates with and without ultrasound assistance. in Journal of the Serbian Chemical Society
Belgrade : Serbian Chemical Society., 84(7), 729-741.
https://doi.org/10.2298/JSC181003023M

Mladenović I, Lamovec J, Jović V, Obradov M, Vasiljević-Radović D, Nikolić ND, Radojević V. Mechanical characterization of copper coatings electrodeposited onto different substrates with and without ultrasound assistance. in Journal of the Serbian Chemical Society. 2019;84(7):729-741.
doi:10.2298/JSC181003023M .

Mladenović, Ivana, Lamovec, Jelena, Jović, Vesna, Obradov, Marko, Vasiljević-Radović, Dana, Nikolić, Nebojša D., Radojević, Vesna, "Mechanical characterization of copper coatings electrodeposited onto different substrates with and without ultrasound assistance" in Journal of the Serbian Chemical Society, 84, no. 7 (2019):729-741,
https://doi.org/10.2298/JSC181003023M . .

TY  - CONF
AU  - Mladenović, Ivana
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Obradov, Marko
AU  - Radulović, Katarina
AU  - Vasiljević-Radović, Dana
AU  - Radojević, Vesna
PY  - 2019
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/3227
AB  - Copper coatings are produced on silicon wafer by electrodeposition (ED) for various cathode current densities. The resulting composite systems consist of 10 μm monolayered copper films electrodeposited from sulphate bath on Si wafers with sputtered layers of Cr/Au. Hardness measurements were performed to evaluate properties of the composites. The composite hardness (H c ) was characterized using Vickers microindentation test. Then, an artificial neural network (ANN) model was used to study the relationship between the parameters of metallic composite and their hardness. Two experimental values: applied load during indentation test and current density during the ED process were used as the inputs to the neural network. Finally, the results of the composite hardness (experimental and predicted) were used to estimate the film hardness (H f ) of copper for each variations of the current density. This article shows that ANN is an useful tool in modeling composite hardness change with variation of experimental parameters predicting hardness change of composite Si/Cu with average error of 6 %. Using created ANN model it is possible to predict microhardness of Cu film for current density or indentation load for which we do not have experimental data.
PB  - Institute of Electrical and Electronics Engineers (IEEE)
C3  - 2019 IEEE 31st International Conference on Microelectronics, MIEL 2019 - Proceedings
T1  - Artificial Neural Network for Composite Hardness Modeling of Cu/Si Systems Fabricated Using Various Electrodeposition Parameters
SP  - 133
EP  - 136
DO  - 10.1109/MIEL.2019.8889610
ER  - 

@conference{
author = "Mladenović, Ivana and Lamovec, Jelena and Jović, Vesna and Obradov, Marko and Radulović, Katarina and Vasiljević-Radović, Dana and Radojević, Vesna",
year = "2019",
abstract = "Copper coatings are produced on silicon wafer by electrodeposition (ED) for various cathode current densities. The resulting composite systems consist of 10 μm monolayered copper films electrodeposited from sulphate bath on Si wafers with sputtered layers of Cr/Au. Hardness measurements were performed to evaluate properties of the composites. The composite hardness (H c ) was characterized using Vickers microindentation test. Then, an artificial neural network (ANN) model was used to study the relationship between the parameters of metallic composite and their hardness. Two experimental values: applied load during indentation test and current density during the ED process were used as the inputs to the neural network. Finally, the results of the composite hardness (experimental and predicted) were used to estimate the film hardness (H f ) of copper for each variations of the current density. This article shows that ANN is an useful tool in modeling composite hardness change with variation of experimental parameters predicting hardness change of composite Si/Cu with average error of 6 %. Using created ANN model it is possible to predict microhardness of Cu film for current density or indentation load for which we do not have experimental data.",
publisher = "Institute of Electrical and Electronics Engineers (IEEE)",
journal = "2019 IEEE 31st International Conference on Microelectronics, MIEL 2019 - Proceedings",
title = "Artificial Neural Network for Composite Hardness Modeling of Cu/Si Systems Fabricated Using Various Electrodeposition Parameters",
pages = "133-136",
doi = "10.1109/MIEL.2019.8889610"
}

Mladenović, I., Lamovec, J., Jović, V., Obradov, M., Radulović, K., Vasiljević-Radović, D.,& Radojević, V.. (2019). Artificial Neural Network for Composite Hardness Modeling of Cu/Si Systems Fabricated Using Various Electrodeposition Parameters. in 2019 IEEE 31st International Conference on Microelectronics, MIEL 2019 - Proceedings
Institute of Electrical and Electronics Engineers (IEEE)., 133-136.
https://doi.org/10.1109/MIEL.2019.8889610

Mladenović I, Lamovec J, Jović V, Obradov M, Radulović K, Vasiljević-Radović D, Radojević V. Artificial Neural Network for Composite Hardness Modeling of Cu/Si Systems Fabricated Using Various Electrodeposition Parameters. in 2019 IEEE 31st International Conference on Microelectronics, MIEL 2019 - Proceedings. 2019;:133-136.
doi:10.1109/MIEL.2019.8889610 .

Mladenović, Ivana, Lamovec, Jelena, Jović, Vesna, Obradov, Marko, Radulović, Katarina, Vasiljević-Radović, Dana, Radojević, Vesna, "Artificial Neural Network for Composite Hardness Modeling of Cu/Si Systems Fabricated Using Various Electrodeposition Parameters" in 2019 IEEE 31st International Conference on Microelectronics, MIEL 2019 - Proceedings (2019):133-136,
https://doi.org/10.1109/MIEL.2019.8889610 . .

TY  - JOUR
AU  - Rožić, Ljiljana
AU  - Petrović, Srđan
AU  - Lončarević, Davor
AU  - Grbić, Boško
AU  - Radić, Nenad
AU  - Stojadinović, Stevan
AU  - Jović, Vesna
AU  - Lamovec, Jelena
PY  - 2019
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/2486
AB  - TiO2-CeO2 nanopowders were synthesised by a ball-milling process and then annealed at temperatures from 500 degrees to 800 degrees C. X-ray diffraction and diffuse reflectance spectra were used in combination with temperature programmed desorption to determine the structural and microstructural changes of nanopowders as a the function of annealing temperature. The results of the X-ray analysis showed that the weight fraction of the cerianite phase remained unchanged with a temperature rise of 600-700 degrees C, indicating that the phase changes occur only within TiO2. The TiO2-CeO2 nanopowder showed enhanced optical properties with a red shift after the thermal treatment. Photocatalytic studies revealed that the sample annealed at 600 degrees C showed higher photocatalytic activity than samples annealed at lower or higher temperatures in the degradation of the methyl orange. The activity test of all samples is in accordance with photoluminescence measurements, proportional to the concentrations of hydroxyl radicals at the photocatalyst surfaces.
PB  - Elsevier Sci Ltd, Oxford
T2  - Ceramics International
T1  - Influence of annealing temperature on structural, optical and photocatalytic properties of TiO2-CeO2 nanopowders
VL  - 45
IS  - 2
SP  - 2361
EP  - 2367
DO  - 10.1016/j.ceramint.2018.10.153
ER  - 

@article{
author = "Rožić, Ljiljana and Petrović, Srđan and Lončarević, Davor and Grbić, Boško and Radić, Nenad and Stojadinović, Stevan and Jović, Vesna and Lamovec, Jelena",
year = "2019",
abstract = "TiO2-CeO2 nanopowders were synthesised by a ball-milling process and then annealed at temperatures from 500 degrees to 800 degrees C. X-ray diffraction and diffuse reflectance spectra were used in combination with temperature programmed desorption to determine the structural and microstructural changes of nanopowders as a the function of annealing temperature. The results of the X-ray analysis showed that the weight fraction of the cerianite phase remained unchanged with a temperature rise of 600-700 degrees C, indicating that the phase changes occur only within TiO2. The TiO2-CeO2 nanopowder showed enhanced optical properties with a red shift after the thermal treatment. Photocatalytic studies revealed that the sample annealed at 600 degrees C showed higher photocatalytic activity than samples annealed at lower or higher temperatures in the degradation of the methyl orange. The activity test of all samples is in accordance with photoluminescence measurements, proportional to the concentrations of hydroxyl radicals at the photocatalyst surfaces.",
publisher = "Elsevier Sci Ltd, Oxford",
journal = "Ceramics International",
title = "Influence of annealing temperature on structural, optical and photocatalytic properties of TiO2-CeO2 nanopowders",
volume = "45",
number = "2",
pages = "2361-2367",
doi = "10.1016/j.ceramint.2018.10.153"
}

Rožić, L., Petrović, S., Lončarević, D., Grbić, B., Radić, N., Stojadinović, S., Jović, V.,& Lamovec, J.. (2019). Influence of annealing temperature on structural, optical and photocatalytic properties of TiO2-CeO2 nanopowders. in Ceramics International
Elsevier Sci Ltd, Oxford., 45(2), 2361-2367.
https://doi.org/10.1016/j.ceramint.2018.10.153

Rožić L, Petrović S, Lončarević D, Grbić B, Radić N, Stojadinović S, Jović V, Lamovec J. Influence of annealing temperature on structural, optical and photocatalytic properties of TiO2-CeO2 nanopowders. in Ceramics International. 2019;45(2):2361-2367.
doi:10.1016/j.ceramint.2018.10.153 .

Rožić, Ljiljana, Petrović, Srđan, Lončarević, Davor, Grbić, Boško, Radić, Nenad, Stojadinović, Stevan, Jović, Vesna, Lamovec, Jelena, "Influence of annealing temperature on structural, optical and photocatalytic properties of TiO2-CeO2 nanopowders" in Ceramics International, 45, no. 2 (2019):2361-2367,
https://doi.org/10.1016/j.ceramint.2018.10.153 . .

TY  - JOUR
AU  - Rožić, Ljiljana
AU  - Petrović, Srđan
AU  - Lončarević, Davor
AU  - Grbić, Boško
AU  - Radić, Nenad
AU  - Stojadinović, Stevan
AU  - Jović, Vesna
AU  - Lamovec, Jelena
PY  - 2019
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/2900
AB  - TiO2-CeO2 nanopowders were synthesised by a ball-milling process and then annealed at temperatures from 500 degrees to 800 degrees C. X-ray diffraction and diffuse reflectance spectra were used in combination with temperature programmed desorption to determine the structural and microstructural changes of nanopowders as a the function of annealing temperature. The results of the X-ray analysis showed that the weight fraction of the cerianite phase remained unchanged with a temperature rise of 600-700 degrees C, indicating that the phase changes occur only within TiO2. The TiO2-CeO2 nanopowder showed enhanced optical properties with a red shift after the thermal treatment. Photocatalytic studies revealed that the sample annealed at 600 degrees C showed higher photocatalytic activity than samples annealed at lower or higher temperatures in the degradation of the methyl orange. The activity test of all samples is in accordance with photoluminescence measurements, proportional to the concentrations of hydroxyl radicals at the photocatalyst surfaces.
PB  - Oxford : Elsevier Sci Ltd.
T2  - Ceramics International
T1  - Influence of annealing temperature on structural, optical and photocatalytic properties of TiO2-CeO2 nanopowders
VL  - 45
IS  - 2
SP  - 2361
EP  - 2367
DO  - 10.1016/j.ceramint.2018.10.153
ER  - 

@article{
author = "Rožić, Ljiljana and Petrović, Srđan and Lončarević, Davor and Grbić, Boško and Radić, Nenad and Stojadinović, Stevan and Jović, Vesna and Lamovec, Jelena",
year = "2019",
abstract = "TiO2-CeO2 nanopowders were synthesised by a ball-milling process and then annealed at temperatures from 500 degrees to 800 degrees C. X-ray diffraction and diffuse reflectance spectra were used in combination with temperature programmed desorption to determine the structural and microstructural changes of nanopowders as a the function of annealing temperature. The results of the X-ray analysis showed that the weight fraction of the cerianite phase remained unchanged with a temperature rise of 600-700 degrees C, indicating that the phase changes occur only within TiO2. The TiO2-CeO2 nanopowder showed enhanced optical properties with a red shift after the thermal treatment. Photocatalytic studies revealed that the sample annealed at 600 degrees C showed higher photocatalytic activity than samples annealed at lower or higher temperatures in the degradation of the methyl orange. The activity test of all samples is in accordance with photoluminescence measurements, proportional to the concentrations of hydroxyl radicals at the photocatalyst surfaces.",
publisher = "Oxford : Elsevier Sci Ltd.",
journal = "Ceramics International",
title = "Influence of annealing temperature on structural, optical and photocatalytic properties of TiO2-CeO2 nanopowders",
volume = "45",
number = "2",
pages = "2361-2367",
doi = "10.1016/j.ceramint.2018.10.153"
}

Rožić, L., Petrović, S., Lončarević, D., Grbić, B., Radić, N., Stojadinović, S., Jović, V.,& Lamovec, J.. (2019). Influence of annealing temperature on structural, optical and photocatalytic properties of TiO2-CeO2 nanopowders. in Ceramics International
Oxford : Elsevier Sci Ltd.., 45(2), 2361-2367.
https://doi.org/10.1016/j.ceramint.2018.10.153

Rožić L, Petrović S, Lončarević D, Grbić B, Radić N, Stojadinović S, Jović V, Lamovec J. Influence of annealing temperature on structural, optical and photocatalytic properties of TiO2-CeO2 nanopowders. in Ceramics International. 2019;45(2):2361-2367.
doi:10.1016/j.ceramint.2018.10.153 .

Rožić, Ljiljana, Petrović, Srđan, Lončarević, Davor, Grbić, Boško, Radić, Nenad, Stojadinović, Stevan, Jović, Vesna, Lamovec, Jelena, "Influence of annealing temperature on structural, optical and photocatalytic properties of TiO2-CeO2 nanopowders" in Ceramics International, 45, no. 2 (2019):2361-2367,
https://doi.org/10.1016/j.ceramint.2018.10.153 . .

TY  - JOUR
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Jaćimovski, Stevo
AU  - Jovanov, Goran
AU  - Radojević, Vesna
AU  - Šetrajčić, Jovan
PY  - 2019
UR  - http://jakov.kpu.edu.rs/handle/123456789/929
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/2904
AB  - Composite systems of monolayer and multilayer nickel films electrochemically deposited on single crystal (100)-oriented silicon wafers were fabricated with and without the ultrasonic agitation. The hardness and adhesion behaviour of these composite structures were characterized by Vickers microindentation test. The dependence of composite microhardness and film adhesion on the structure of the film and mixing conditions of electrolyte were analysed. Mathematical models of Chicot-Lesage and Chen-Gao were applied to experimental data in order to obtain the film hardness and adhesion parameter respectively. It is confirmed that the mechanical properties of composite systems of nickel thin films on silicon substrate can be enhanced by formation of multilayer film structure by ultrasound-assisted electrodeposition and by reducing the layer thickness in the multilayer film.
AB  - Formirani su kompozitni sistemi od jednoslojnih i višeslojnih filmova nikla elektrohemijski deponovanih sa i bez ultrazvučnog mešanja na pločicama od monokristalnog silicijuma orijentacije (100). Tvrdoća i adhezija tih kompozitnih struktura su okarakterisane testom mikrotvrdoće po Vikersu. Analizirana je zavisnost mikrotvrdoće kompozita i adhezije filma od strukture filma i uslova mešanja elektrolita. Matematički modeli Šiko-Lezaža i Čen-Gaoa su primenjeni na eksperimentalne podatke kako bi se dobile vrednosti tvrdoće filma i parametra adhezije. Potvrđeno je da se mehanička svojstva kompozit-nih sistema sastavljenih od tankih filmova nikla na silicijumskoj podlozi mogu poboljšati formiranjem višeslojne strukture filmova, primenom ultrazvučnog mešanja pri elektrodepoziciji i smanjenjem debljine sloja u višeslojnom filmu.
PB  - Belgrade : Academy of Criminalistic and Police Studies
T2  - NBP : Journal of Criminalistic and Law : Žurnal za kriminalistiku i pravo
T1  - Hardness and assessment of adhesion of monolayer and multilayer nickel thin films electrochemically deposited on silicon substrates with and without the ultrasonic agitation
T1  - Tvrdoća i procena adhezije jednoslojnih i višeslojnih tankih filmova nikla elektrohemijski deponovanih na silicijumskim podlogama sa i bez ultrazvučnog mešanja
VL  - 24
IS  - 1
SP  - 17
EP  - 29
DO  - 10.5937/nabepo24-19682
ER  - 

@article{
author = "Lamovec, Jelena and Jović, Vesna and Jaćimovski, Stevo and Jovanov, Goran and Radojević, Vesna and Šetrajčić, Jovan",
year = "2019",
abstract = "Composite systems of monolayer and multilayer nickel films electrochemically deposited on single crystal (100)-oriented silicon wafers were fabricated with and without the ultrasonic agitation. The hardness and adhesion behaviour of these composite structures were characterized by Vickers microindentation test. The dependence of composite microhardness and film adhesion on the structure of the film and mixing conditions of electrolyte were analysed. Mathematical models of Chicot-Lesage and Chen-Gao were applied to experimental data in order to obtain the film hardness and adhesion parameter respectively. It is confirmed that the mechanical properties of composite systems of nickel thin films on silicon substrate can be enhanced by formation of multilayer film structure by ultrasound-assisted electrodeposition and by reducing the layer thickness in the multilayer film., Formirani su kompozitni sistemi od jednoslojnih i višeslojnih filmova nikla elektrohemijski deponovanih sa i bez ultrazvučnog mešanja na pločicama od monokristalnog silicijuma orijentacije (100). Tvrdoća i adhezija tih kompozitnih struktura su okarakterisane testom mikrotvrdoće po Vikersu. Analizirana je zavisnost mikrotvrdoće kompozita i adhezije filma od strukture filma i uslova mešanja elektrolita. Matematički modeli Šiko-Lezaža i Čen-Gaoa su primenjeni na eksperimentalne podatke kako bi se dobile vrednosti tvrdoće filma i parametra adhezije. Potvrđeno je da se mehanička svojstva kompozit-nih sistema sastavljenih od tankih filmova nikla na silicijumskoj podlozi mogu poboljšati formiranjem višeslojne strukture filmova, primenom ultrazvučnog mešanja pri elektrodepoziciji i smanjenjem debljine sloja u višeslojnom filmu.",
publisher = "Belgrade : Academy of Criminalistic and Police Studies",
journal = "NBP : Journal of Criminalistic and Law : Žurnal za kriminalistiku i pravo",
title = "Hardness and assessment of adhesion of monolayer and multilayer nickel thin films electrochemically deposited on silicon substrates with and without the ultrasonic agitation, Tvrdoća i procena adhezije jednoslojnih i višeslojnih tankih filmova nikla elektrohemijski deponovanih na silicijumskim podlogama sa i bez ultrazvučnog mešanja",
volume = "24",
number = "1",
pages = "17-29",
doi = "10.5937/nabepo24-19682"
}

Lamovec, J., Jović, V., Jaćimovski, S., Jovanov, G., Radojević, V.,& Šetrajčić, J.. (2019). Hardness and assessment of adhesion of monolayer and multilayer nickel thin films electrochemically deposited on silicon substrates with and without the ultrasonic agitation. in NBP : Journal of Criminalistic and Law : Žurnal za kriminalistiku i pravo
Belgrade : Academy of Criminalistic and Police Studies., 24(1), 17-29.
https://doi.org/10.5937/nabepo24-19682

Lamovec J, Jović V, Jaćimovski S, Jovanov G, Radojević V, Šetrajčić J. Hardness and assessment of adhesion of monolayer and multilayer nickel thin films electrochemically deposited on silicon substrates with and without the ultrasonic agitation. in NBP : Journal of Criminalistic and Law : Žurnal za kriminalistiku i pravo. 2019;24(1):17-29.
doi:10.5937/nabepo24-19682 .

Lamovec, Jelena, Jović, Vesna, Jaćimovski, Stevo, Jovanov, Goran, Radojević, Vesna, Šetrajčić, Jovan, "Hardness and assessment of adhesion of monolayer and multilayer nickel thin films electrochemically deposited on silicon substrates with and without the ultrasonic agitation" in NBP : Journal of Criminalistic and Law : Žurnal za kriminalistiku i pravo, 24, no. 1 (2019):17-29,
https://doi.org/10.5937/nabepo24-19682 . .

TY  - JOUR
AU  - Smiljanić, Milče
AU  - Lazić, Žarko
AU  - Rađenović, Branislav
AU  - Radmilović-Radjenović, Marija
AU  - Jović, Vesna
PY  - 2019
UR  - http://www.mdpi.com/2072-666X/10/2/102
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/2640
AB  - Squares and circles are basic patterns for most mask designs of silicon microdevices. Evolution of etched Si crystallographic planes defined by square and circle patterns in the masking layer is presented and analyzed in this paper. The sides of square patterns in the masking layer are designed along predetermined <n10> crystallographic directions. Etching of a (100) silicon substrate is performed in 25 wt % tetramethylammonium hydroxide (TMAH) water solution at the temperature of 80 °C. Additionally, this paper presents three-dimensional (3D) simulations of the profile evolution during silicon etching of designed patterns based on the level-set method. We analyzed etching of designed patterns in the shape of square and circle islands. The crystallographic planes that appear during etching of 3D structures in the experiment and simulated etching profiles are determined. A good agreement between dominant crystallographic planes through experiments and simulations is obtained. The etch rates of dominant exposed crystallographic planes are also analytically calculated.
PB  - MDPI
T2  - Micromachines
T2  - Micromachines
T1  - Evolution of Si Crystallographic Planes-Etching of Square and Circle Patterns in 25 wt % TMAH
VL  - 10
IS  - 2
SP  - 102
DO  - 10.3390/mi10020102
ER  - 

@article{
author = "Smiljanić, Milče and Lazić, Žarko and Rađenović, Branislav and Radmilović-Radjenović, Marija and Jović, Vesna",
year = "2019",
abstract = "Squares and circles are basic patterns for most mask designs of silicon microdevices. Evolution of etched Si crystallographic planes defined by square and circle patterns in the masking layer is presented and analyzed in this paper. The sides of square patterns in the masking layer are designed along predetermined <n10> crystallographic directions. Etching of a (100) silicon substrate is performed in 25 wt % tetramethylammonium hydroxide (TMAH) water solution at the temperature of 80 °C. Additionally, this paper presents three-dimensional (3D) simulations of the profile evolution during silicon etching of designed patterns based on the level-set method. We analyzed etching of designed patterns in the shape of square and circle islands. The crystallographic planes that appear during etching of 3D structures in the experiment and simulated etching profiles are determined. A good agreement between dominant crystallographic planes through experiments and simulations is obtained. The etch rates of dominant exposed crystallographic planes are also analytically calculated.",
publisher = "MDPI",
journal = "Micromachines, Micromachines",
title = "Evolution of Si Crystallographic Planes-Etching of Square and Circle Patterns in 25 wt % TMAH",
volume = "10",
number = "2",
pages = "102",
doi = "10.3390/mi10020102"
}

Smiljanić, M., Lazić, Ž., Rađenović, B., Radmilović-Radjenović, M.,& Jović, V.. (2019). Evolution of Si Crystallographic Planes-Etching of Square and Circle Patterns in 25 wt % TMAH. in Micromachines
MDPI., 10(2), 102.
https://doi.org/10.3390/mi10020102

Smiljanić M, Lazić Ž, Rađenović B, Radmilović-Radjenović M, Jović V. Evolution of Si Crystallographic Planes-Etching of Square and Circle Patterns in 25 wt % TMAH. in Micromachines. 2019;10(2):102.
doi:10.3390/mi10020102 .

Smiljanić, Milče, Lazić, Žarko, Rađenović, Branislav, Radmilović-Radjenović, Marija, Jović, Vesna, "Evolution of Si Crystallographic Planes-Etching of Square and Circle Patterns in 25 wt % TMAH" in Micromachines, 10, no. 2 (2019):102,
https://doi.org/10.3390/mi10020102 . .

TY  - CONF
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Mladenović, Ivana
AU  - Radojević, Vesna
AU  - Jaćimovski, Stevo
AU  - Popović, Bogdan
PY  - 2018
UR  - http://www.vti.mod.gov.rs/oteh18/index.htm
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/3834
AB  - Alternate electrodeposition of ordinary and ultrasonic-assisted Ni layers on polycrystalline copper substrates and single-crystal (100)-oriented silicon wafers was used for the formation of composite systems with nickel thin multilayer films. The hardness and adhesion properties of these composite systems were characterized using Vickers microhardness test, with different loads. Dependence of composite microhardness and film adhesion on type of substrate and layer thickness was investigated. Model of Korsunsky, Chicot-Lesage and Chen-Gao were chosen and applied to experimental data for obtaining the film hardness and adhesion evaluation, respectively. It is confirmed that in comparison with the conventional electrodeposited Ni films, the mechanical properties of the ultrasonic-assisted multilayer Ni films are improved. The microhardness and adhesion of the films are enhanced by introduction of ultrasound and by reducing the layer thickness in the film.
PB  - Belgrade : Military Technical Institute
C3  - Proceedings - 8th International scientific conference on defensive technologies-proceedings, Belgrade, Serbia,
T1  - Characterization of nickel thin multilayer films electrodeposited under different agitation conditions
SP  - 421
EP  - 426
UR  - https://hdl.handle.net/21.15107/rcub_cer_3834
ER  - 

@conference{
author = "Lamovec, Jelena and Jović, Vesna and Mladenović, Ivana and Radojević, Vesna and Jaćimovski, Stevo and Popović, Bogdan",
year = "2018",
abstract = "Alternate electrodeposition of ordinary and ultrasonic-assisted Ni layers on polycrystalline copper substrates and single-crystal (100)-oriented silicon wafers was used for the formation of composite systems with nickel thin multilayer films. The hardness and adhesion properties of these composite systems were characterized using Vickers microhardness test, with different loads. Dependence of composite microhardness and film adhesion on type of substrate and layer thickness was investigated. Model of Korsunsky, Chicot-Lesage and Chen-Gao were chosen and applied to experimental data for obtaining the film hardness and adhesion evaluation, respectively. It is confirmed that in comparison with the conventional electrodeposited Ni films, the mechanical properties of the ultrasonic-assisted multilayer Ni films are improved. The microhardness and adhesion of the films are enhanced by introduction of ultrasound and by reducing the layer thickness in the film.",
publisher = "Belgrade : Military Technical Institute",
journal = "Proceedings - 8th International scientific conference on defensive technologies-proceedings, Belgrade, Serbia,",
title = "Characterization of nickel thin multilayer films electrodeposited under different agitation conditions",
pages = "421-426",
url = "https://hdl.handle.net/21.15107/rcub_cer_3834"
}

Lamovec, J., Jović, V., Mladenović, I., Radojević, V., Jaćimovski, S.,& Popović, B.. (2018). Characterization of nickel thin multilayer films electrodeposited under different agitation conditions. in Proceedings - 8th International scientific conference on defensive technologies-proceedings, Belgrade, Serbia,
Belgrade : Military Technical Institute., 421-426.
https://hdl.handle.net/21.15107/rcub_cer_3834

Lamovec J, Jović V, Mladenović I, Radojević V, Jaćimovski S, Popović B. Characterization of nickel thin multilayer films electrodeposited under different agitation conditions. in Proceedings - 8th International scientific conference on defensive technologies-proceedings, Belgrade, Serbia,. 2018;:421-426.
https://hdl.handle.net/21.15107/rcub_cer_3834 .

Lamovec, Jelena, Jović, Vesna, Mladenović, Ivana, Radojević, Vesna, Jaćimovski, Stevo, Popović, Bogdan, "Characterization of nickel thin multilayer films electrodeposited under different agitation conditions" in Proceedings - 8th International scientific conference on defensive technologies-proceedings, Belgrade, Serbia, (2018):421-426,
https://hdl.handle.net/21.15107/rcub_cer_3834 .

TY  - CONF
AU  - Jović, Vesna
AU  - Lamovec, Jelena
AU  - Starčević, Marko
AU  - Đinović, Zoran
AU  - Smiljanić, Milče M.
AU  - Lazić, Žarko
PY  - 2018
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/5795
AB  - Nowadays, with no doubt, PDMS, poly(dimethylsiloxane) elastomer is material of choice for microfluidic 
fabrication because of its unique chemical, optical and mechanical properties. Unfortunately, it is not photo-definable (i.e. 
not a photoresist) and fabrication of PDMS MEM (micro-electro-mechanical) devices is typically done using soft 
lithography. Some steps of the process are difficult to perform without manually handling PDMS layers. Next problem to be 
considered in patterning PDMS membranes is bond strength between membrane and silicon substrate. To investigate this, 
we fabricated PDMS membranes on silicon either by spin coating Si wafer or transferring previously fabricated PDMS 
membrane to Si chip with bonding layer on it. PDMS network samples for this research were synthesized with the same 
composition, which are Sylgard 184 (Dow Corning, USA) silicone elastomer base and silicone elastomer curing agent, 
volume ratio 10:1. Fabrication of test structures is based on bulk micromachining on ⟨100⟩ oriented Si wafers to fabricate 
square cavities on which PDMS membranes were realized by one of mentioned procedures. Mechanical testing of PDMS 
membranes, elastic properties and adhesion strength of membranes with different thicknesses were investigated applying 
pressurized bulge testing. Pressure was applied to the PDMS membrane via nitrogen gas and the resulting load-deflection 
curves were monitoring.
PB  - Belgrade : The Military Technical Institute
C3  - Proceedings - 8th International Scientific Conference of Defensive Technologies, OTEH 2018, 11-12.10.2018, Belgrade
T1  - Experimental study of PDMS membranes fabricated either by spin coating or transfer bonding to a silicon chip with etched cavity
SP  - 462
EP  - 467
UR  - https://hdl.handle.net/21.15107/rcub_cer_5795
ER  - 

@conference{
author = "Jović, Vesna and Lamovec, Jelena and Starčević, Marko and Đinović, Zoran and Smiljanić, Milče M. and Lazić, Žarko",
year = "2018",
abstract = "Nowadays, with no doubt, PDMS, poly(dimethylsiloxane) elastomer is material of choice for microfluidic 
fabrication because of its unique chemical, optical and mechanical properties. Unfortunately, it is not photo-definable (i.e. 
not a photoresist) and fabrication of PDMS MEM (micro-electro-mechanical) devices is typically done using soft 
lithography. Some steps of the process are difficult to perform without manually handling PDMS layers. Next problem to be 
considered in patterning PDMS membranes is bond strength between membrane and silicon substrate. To investigate this, 
we fabricated PDMS membranes on silicon either by spin coating Si wafer or transferring previously fabricated PDMS 
membrane to Si chip with bonding layer on it. PDMS network samples for this research were synthesized with the same 
composition, which are Sylgard 184 (Dow Corning, USA) silicone elastomer base and silicone elastomer curing agent, 
volume ratio 10:1. Fabrication of test structures is based on bulk micromachining on ⟨100⟩ oriented Si wafers to fabricate 
square cavities on which PDMS membranes were realized by one of mentioned procedures. Mechanical testing of PDMS 
membranes, elastic properties and adhesion strength of membranes with different thicknesses were investigated applying 
pressurized bulge testing. Pressure was applied to the PDMS membrane via nitrogen gas and the resulting load-deflection 
curves were monitoring.",
publisher = "Belgrade : The Military Technical Institute",
journal = "Proceedings - 8th International Scientific Conference of Defensive Technologies, OTEH 2018, 11-12.10.2018, Belgrade",
title = "Experimental study of PDMS membranes fabricated either by spin coating or transfer bonding to a silicon chip with etched cavity",
pages = "462-467",
url = "https://hdl.handle.net/21.15107/rcub_cer_5795"
}

Jović, V., Lamovec, J., Starčević, M., Đinović, Z., Smiljanić, M. M.,& Lazić, Ž.. (2018). Experimental study of PDMS membranes fabricated either by spin coating or transfer bonding to a silicon chip with etched cavity. in Proceedings - 8th International Scientific Conference of Defensive Technologies, OTEH 2018, 11-12.10.2018, Belgrade
Belgrade : The Military Technical Institute., 462-467.
https://hdl.handle.net/21.15107/rcub_cer_5795

Jović V, Lamovec J, Starčević M, Đinović Z, Smiljanić MM, Lazić Ž. Experimental study of PDMS membranes fabricated either by spin coating or transfer bonding to a silicon chip with etched cavity. in Proceedings - 8th International Scientific Conference of Defensive Technologies, OTEH 2018, 11-12.10.2018, Belgrade. 2018;:462-467.
https://hdl.handle.net/21.15107/rcub_cer_5795 .

Jović, Vesna, Lamovec, Jelena, Starčević, Marko, Đinović, Zoran, Smiljanić, Milče M., Lazić, Žarko, "Experimental study of PDMS membranes fabricated either by spin coating or transfer bonding to a silicon chip with etched cavity" in Proceedings - 8th International Scientific Conference of Defensive Technologies, OTEH 2018, 11-12.10.2018, Belgrade (2018):462-467,
https://hdl.handle.net/21.15107/rcub_cer_5795 .

TY  - JOUR
AU  - Petrović, Srđan
AU  - Rožić, Ljiljana
AU  - Jović, Vesna
AU  - Stojadinović, Stevan
AU  - Grbić, Boško
AU  - Radić, Nenad
AU  - Lamovec, Jelena
AU  - Vasilić, Rastko
PY  - 2018
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/2454
AB  - Nanocrystalline TiO2-CeO2 powders were synthesized from their TiO2 and CeO2 oxides using mechanical ball milling process. The response surface method is applied to identify optimal parameters for the synthesis of TiO2-CeO2 photocatalyst. Analysis of variance and main effect plot are used to determine the significant parameters and set the optimal level for each parameter. Regression analysis showed good agreement of experimental data with the second-order polynomial model with a coefficients of determination: R-2 = 0.991, R-Adj(2). = 0.940 and R-Pred(2). = 0.983. Under optimal experimental conditions of TiO2:CeO2 weight percentage ratio 71: 29, milling speed 200 rpm, and milling time 115 min the highest photodegradation efficiency was achieved. On the basis of the above statistical analysis, it was found that the band gap energy of TiO2-CeO2 nanoparticles decreases with the increase of the milling speed and milling time with constant TiO2:CeO2 weight percentage ratio. Obtained results suggest that mechanical ball milling process is a rapid, efficient and low energy consumption method to synthesize TiO2-CeO2 photocatalyst.
PB  - Elsevier
T2  - Advanced Powder Technology
T1  - Optimization of a nanoparticle ball milling process parameters using the response surface method
VL  - 29
IS  - 9
SP  - 2129
EP  - 2139
DO  - 10.1016/j.apt.2018.05.021
ER  - 

@article{
author = "Petrović, Srđan and Rožić, Ljiljana and Jović, Vesna and Stojadinović, Stevan and Grbić, Boško and Radić, Nenad and Lamovec, Jelena and Vasilić, Rastko",
year = "2018",
abstract = "Nanocrystalline TiO2-CeO2 powders were synthesized from their TiO2 and CeO2 oxides using mechanical ball milling process. The response surface method is applied to identify optimal parameters for the synthesis of TiO2-CeO2 photocatalyst. Analysis of variance and main effect plot are used to determine the significant parameters and set the optimal level for each parameter. Regression analysis showed good agreement of experimental data with the second-order polynomial model with a coefficients of determination: R-2 = 0.991, R-Adj(2). = 0.940 and R-Pred(2). = 0.983. Under optimal experimental conditions of TiO2:CeO2 weight percentage ratio 71: 29, milling speed 200 rpm, and milling time 115 min the highest photodegradation efficiency was achieved. On the basis of the above statistical analysis, it was found that the band gap energy of TiO2-CeO2 nanoparticles decreases with the increase of the milling speed and milling time with constant TiO2:CeO2 weight percentage ratio. Obtained results suggest that mechanical ball milling process is a rapid, efficient and low energy consumption method to synthesize TiO2-CeO2 photocatalyst.",
publisher = "Elsevier",
journal = "Advanced Powder Technology",
title = "Optimization of a nanoparticle ball milling process parameters using the response surface method",
volume = "29",
number = "9",
pages = "2129-2139",
doi = "10.1016/j.apt.2018.05.021"
}

Petrović, S., Rožić, L., Jović, V., Stojadinović, S., Grbić, B., Radić, N., Lamovec, J.,& Vasilić, R.. (2018). Optimization of a nanoparticle ball milling process parameters using the response surface method. in Advanced Powder Technology
Elsevier., 29(9), 2129-2139.
https://doi.org/10.1016/j.apt.2018.05.021

Petrović S, Rožić L, Jović V, Stojadinović S, Grbić B, Radić N, Lamovec J, Vasilić R. Optimization of a nanoparticle ball milling process parameters using the response surface method. in Advanced Powder Technology. 2018;29(9):2129-2139.
doi:10.1016/j.apt.2018.05.021 .

Petrović, Srđan, Rožić, Ljiljana, Jović, Vesna, Stojadinović, Stevan, Grbić, Boško, Radić, Nenad, Lamovec, Jelena, Vasilić, Rastko, "Optimization of a nanoparticle ball milling process parameters using the response surface method" in Advanced Powder Technology, 29, no. 9 (2018):2129-2139,
https://doi.org/10.1016/j.apt.2018.05.021 . .

TY  - JOUR
AU  - Lamovec, Jelena
AU  - Mladenović, Ivana
AU  - Jović, Vesna
AU  - Radojević, Vesna
AU  - Jaćimovski, Stevo
AU  - Jovanov, Goran
PY  - 2018
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/2272
AB  - Multilayer composite structures of electrodeposited Ni films on polycrystalline copper substrates were fabricated with the assistance of ultrasonic agitation. Alternate ordinary and ultrasonicassisted electrodeposition of Ni layers allowed the formation of laminated films. The adhesion and hardness properties were characterized using bidirectional bending test and Vickers microhardness test with different loads. Dependence of composite microhardness and film adhesion on layer thickness was investigated. It was confirmed that densified parallel interfaces give rise to high hardness and strength of composites. Model of Korsunsky was chosen and applied to experimental data for obtaining the film hardness and model of Chen-Gao was applied for the adhesion evaluation. Compared with the conventional electrodeposited Ni films, the mechanical properties of the ultrasonic-assisted multilayer Ni films are improved. The microhardness and adhesion of the films are enhanced by introduction of ultrasound and by reducing the layer thickness in the film.
AB  - Višeslojne kompozitne strukture su sačinjene od elektrodeponovanih filmova Ni na supstratima od polikristalnog bakra uz pomoć ultrazvučnog mešanja. Naizmenična elektrodepozicija slojeva Ni bez i uz pomoć ultrazvučnog mešanja omogućila je formiranje laminatnih filmova. Adhezija i tvrdoća su okarakterisane ispitivanjem na savijanje u dva pravca i Vikersovim testom mikrotvrdoće sa različitim opterećenjima. Zavisnost kompozitne mikrotvrdoće i adhezije filma od debljine sloja je ispitana. Potvrđeno je da veliki broj međuslojnih granica doprinosi povećanju tvrdoće i jačine kompozita. Za obradu eksperimentalnih podataka su odabrani i primenjeni model Korsunskog za izračunavanje tvrdoće filma i model Čen-Gao za procenu adhezije filma. U poređenju sa filmovima Ni elektrodeponovanim na konvencionalan način, mehanička svojstva filmova elektrodeponovanih u prisustvu uzltrazvuka su poboljšana. Vrednosti mikrotvrdoće i adhezije su povećane uvođenjem ultrazvuka i smanjenjem debljine pojedinačnog sloja Ni u filmu.
PB  - Belgrade, Serbia : Engineering Society for Corrosion
T2  - Zaštita materijala
T1  - Obtaining and characterization of multilayer nickel thin films electrodeposited with the assistance of ultrasonic agitation
T1  - Dobijanje i karakterizacija višeslojnih tankih filmova nikla elektrodeponovanih uz pomoć ultrazvučnog mešanja
VL  - 59
IS  - 3
SP  - 394
EP  - 400
DO  - 10.5937/zasmat1803394L
ER  - 

@article{
author = "Lamovec, Jelena and Mladenović, Ivana and Jović, Vesna and Radojević, Vesna and Jaćimovski, Stevo and Jovanov, Goran",
year = "2018",
abstract = "Multilayer composite structures of electrodeposited Ni films on polycrystalline copper substrates were fabricated with the assistance of ultrasonic agitation. Alternate ordinary and ultrasonicassisted electrodeposition of Ni layers allowed the formation of laminated films. The adhesion and hardness properties were characterized using bidirectional bending test and Vickers microhardness test with different loads. Dependence of composite microhardness and film adhesion on layer thickness was investigated. It was confirmed that densified parallel interfaces give rise to high hardness and strength of composites. Model of Korsunsky was chosen and applied to experimental data for obtaining the film hardness and model of Chen-Gao was applied for the adhesion evaluation. Compared with the conventional electrodeposited Ni films, the mechanical properties of the ultrasonic-assisted multilayer Ni films are improved. The microhardness and adhesion of the films are enhanced by introduction of ultrasound and by reducing the layer thickness in the film., Višeslojne kompozitne strukture su sačinjene od elektrodeponovanih filmova Ni na supstratima od polikristalnog bakra uz pomoć ultrazvučnog mešanja. Naizmenična elektrodepozicija slojeva Ni bez i uz pomoć ultrazvučnog mešanja omogućila je formiranje laminatnih filmova. Adhezija i tvrdoća su okarakterisane ispitivanjem na savijanje u dva pravca i Vikersovim testom mikrotvrdoće sa različitim opterećenjima. Zavisnost kompozitne mikrotvrdoće i adhezije filma od debljine sloja je ispitana. Potvrđeno je da veliki broj međuslojnih granica doprinosi povećanju tvrdoće i jačine kompozita. Za obradu eksperimentalnih podataka su odabrani i primenjeni model Korsunskog za izračunavanje tvrdoće filma i model Čen-Gao za procenu adhezije filma. U poređenju sa filmovima Ni elektrodeponovanim na konvencionalan način, mehanička svojstva filmova elektrodeponovanih u prisustvu uzltrazvuka su poboljšana. Vrednosti mikrotvrdoće i adhezije su povećane uvođenjem ultrazvuka i smanjenjem debljine pojedinačnog sloja Ni u filmu.",
publisher = "Belgrade, Serbia : Engineering Society for Corrosion",
journal = "Zaštita materijala",
title = "Obtaining and characterization of multilayer nickel thin films electrodeposited with the assistance of ultrasonic agitation, Dobijanje i karakterizacija višeslojnih tankih filmova nikla elektrodeponovanih uz pomoć ultrazvučnog mešanja",
volume = "59",
number = "3",
pages = "394-400",
doi = "10.5937/zasmat1803394L"
}

Lamovec, J., Mladenović, I., Jović, V., Radojević, V., Jaćimovski, S.,& Jovanov, G.. (2018). Obtaining and characterization of multilayer nickel thin films electrodeposited with the assistance of ultrasonic agitation. in Zaštita materijala
Belgrade, Serbia : Engineering Society for Corrosion., 59(3), 394-400.
https://doi.org/10.5937/zasmat1803394L

Lamovec J, Mladenović I, Jović V, Radojević V, Jaćimovski S, Jovanov G. Obtaining and characterization of multilayer nickel thin films electrodeposited with the assistance of ultrasonic agitation. in Zaštita materijala. 2018;59(3):394-400.
doi:10.5937/zasmat1803394L .

Lamovec, Jelena, Mladenović, Ivana, Jović, Vesna, Radojević, Vesna, Jaćimovski, Stevo, Jovanov, Goran, "Obtaining and characterization of multilayer nickel thin films electrodeposited with the assistance of ultrasonic agitation" in Zaštita materijala, 59, no. 3 (2018):394-400,
https://doi.org/10.5937/zasmat1803394L . .

TY  - CONF
AU  - Mladenović, Ivana
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Popović, Bogdan
AU  - Vorkapić, Miloš
AU  - Radojević, Vesna
PY  - 2017
UR  - https://etran.rs/2017/ETRAN/Zbornik_radova/
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/3825
AB  - Microhardness test is the most commonly used
method for assessing the mechanical properties of thin films.This testing method uses controlled contact at a single point of an indenter and chosen material which induces the plastic deformation in material under indenter. The measured hardness is considered as the composite hardness, because the substrate
participates in the plastic deformation caused by indentation. This research has been carried out in order to analyze and compare the hardness response of different composite systems consist of monolayer electrodeposited copper thin film on brass and steel alloys as the substrates. The influence of the electrodeposition parameters and of the substrate on the hardness and interlayer adhesion were investigated by Vickers microhardness testing for different load.
PB  - Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering
C3  - Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, IcETRAN 2017, Kladovo, Serbia
T1  - Hardness response and adhesion of thin copper films on alloy substrates
SP  - MOI1.3.1
EP  - MOI1.3.6
UR  - https://hdl.handle.net/21.15107/rcub_cer_3825
ER  - 

@conference{
author = "Mladenović, Ivana and Lamovec, Jelena and Jović, Vesna and Popović, Bogdan and Vorkapić, Miloš and Radojević, Vesna",
year = "2017",
abstract = "Microhardness test is the most commonly used
method for assessing the mechanical properties of thin films.This testing method uses controlled contact at a single point of an indenter and chosen material which induces the plastic deformation in material under indenter. The measured hardness is considered as the composite hardness, because the substrate
participates in the plastic deformation caused by indentation. This research has been carried out in order to analyze and compare the hardness response of different composite systems consist of monolayer electrodeposited copper thin film on brass and steel alloys as the substrates. The influence of the electrodeposition parameters and of the substrate on the hardness and interlayer adhesion were investigated by Vickers microhardness testing for different load.",
publisher = "Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering",
journal = "Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, IcETRAN 2017, Kladovo, Serbia",
title = "Hardness response and adhesion of thin copper films on alloy substrates",
pages = "MOI1.3.1-MOI1.3.6",
url = "https://hdl.handle.net/21.15107/rcub_cer_3825"
}

Mladenović, I., Lamovec, J., Jović, V., Popović, B., Vorkapić, M.,& Radojević, V.. (2017). Hardness response and adhesion of thin copper films on alloy substrates. in Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, IcETRAN 2017, Kladovo, Serbia
Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering., MOI1.3.1-MOI1.3.6.
https://hdl.handle.net/21.15107/rcub_cer_3825

Mladenović I, Lamovec J, Jović V, Popović B, Vorkapić M, Radojević V. Hardness response and adhesion of thin copper films on alloy substrates. in Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, IcETRAN 2017, Kladovo, Serbia. 2017;:MOI1.3.1-MOI1.3.6.
https://hdl.handle.net/21.15107/rcub_cer_3825 .

Mladenović, Ivana, Lamovec, Jelena, Jović, Vesna, Popović, Bogdan, Vorkapić, Miloš, Radojević, Vesna, "Hardness response and adhesion of thin copper films on alloy substrates" in Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, IcETRAN 2017, Kladovo, Serbia (2017):MOI1.3.1-MOI1.3.6,
https://hdl.handle.net/21.15107/rcub_cer_3825 .

TY  - CONF
AU  - Mladenović, Ivana
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Obradov, Marko
AU  - Popović, Bogdan
AU  - Vorkapić, Miloš
AU  - Radojević, Vesna
PY  - 2017
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/5703
AB  - Thin copper films have various application in the electronic industry for the fabrication of
contacts in integrated circuits. Copper electroplating has been widely employed for
fabricating the wires of printed circuit boards (PCBs) , sidewall metallization of the microvia
and through hole in the fabrication of multilayer PCBs [1] . Along with electrodeposited thin
Ni films, they may be considered as laminate composite structures with good mechanical
properties such as high hardness and tensile strength, which is especially important for the
MEMS structures fabrication [2-4].
PB  - Belgrade : Institute of Chemistry, Technology and Metallurgy
C3  - Book of Abstracts - COST MP1402 Scientific Workshop "ALD and related ultra-thin film processes for advanced devices", 29-30 of August, 2017, Belgrade, Serbia
T1  - Preparation and mechanical characterization of copper thin films with additives on alloy substrates
SP  - 18
EP  - 19
UR  - https://hdl.handle.net/21.15107/rcub_cer_5703
ER  - 

@conference{
author = "Mladenović, Ivana and Lamovec, Jelena and Jović, Vesna and Obradov, Marko and Popović, Bogdan and Vorkapić, Miloš and Radojević, Vesna",
year = "2017",
abstract = "Thin copper films have various application in the electronic industry for the fabrication of
contacts in integrated circuits. Copper electroplating has been widely employed for
fabricating the wires of printed circuit boards (PCBs) , sidewall metallization of the microvia
and through hole in the fabrication of multilayer PCBs [1] . Along with electrodeposited thin
Ni films, they may be considered as laminate composite structures with good mechanical
properties such as high hardness and tensile strength, which is especially important for the
MEMS structures fabrication [2-4].",
publisher = "Belgrade : Institute of Chemistry, Technology and Metallurgy",
journal = "Book of Abstracts - COST MP1402 Scientific Workshop "ALD and related ultra-thin film processes for advanced devices", 29-30 of August, 2017, Belgrade, Serbia",
title = "Preparation and mechanical characterization of copper thin films with additives on alloy substrates",
pages = "18-19",
url = "https://hdl.handle.net/21.15107/rcub_cer_5703"
}

Mladenović, I., Lamovec, J., Jović, V., Obradov, M., Popović, B., Vorkapić, M.,& Radojević, V.. (2017). Preparation and mechanical characterization of copper thin films with additives on alloy substrates. in Book of Abstracts - COST MP1402 Scientific Workshop "ALD and related ultra-thin film processes for advanced devices", 29-30 of August, 2017, Belgrade, Serbia
Belgrade : Institute of Chemistry, Technology and Metallurgy., 18-19.
https://hdl.handle.net/21.15107/rcub_cer_5703

Mladenović I, Lamovec J, Jović V, Obradov M, Popović B, Vorkapić M, Radojević V. Preparation and mechanical characterization of copper thin films with additives on alloy substrates. in Book of Abstracts - COST MP1402 Scientific Workshop "ALD and related ultra-thin film processes for advanced devices", 29-30 of August, 2017, Belgrade, Serbia. 2017;:18-19.
https://hdl.handle.net/21.15107/rcub_cer_5703 .

Mladenović, Ivana, Lamovec, Jelena, Jović, Vesna, Obradov, Marko, Popović, Bogdan, Vorkapić, Miloš, Radojević, Vesna, "Preparation and mechanical characterization of copper thin films with additives on alloy substrates" in Book of Abstracts - COST MP1402 Scientific Workshop "ALD and related ultra-thin film processes for advanced devices", 29-30 of August, 2017, Belgrade, Serbia (2017):18-19,
https://hdl.handle.net/21.15107/rcub_cer_5703 .

TY  - JOUR
AU  - Mladenović, Ivana
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Radojević, Vesna
PY  - 2017
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/2206
AB  - Thin copper films were electrodeposited on a polycrystalline cold-rolled copper substrate. The composition of the laboratory-made copper sulphate electrolyte was changed by the addition of various additives. The influence of chloride ion (Cl-), polyethylene glycol (PEG) and 3-mercapto-1-propane sulfonic acid (MPSA) on mechanical and adhesion properties of the electrodeposited copper films was investigated using Vickers microindentation technique. Calculations of the film hardness and adhesion were carried out using composite hardness models of Korsunsky and Chen-Gao. The hardness of the composite system is influenced by the adhesion of the copper film to the substrate. Increasing adhesion corresponds to increasing values of the calculated adhesion parameter b, named the critical reduced depth. When additives are added to a plating solution, the copper deposition mechanism is changed and fine-grained microstructure without the formation of microscopic nodules is obtained.
PB  - Faculty of Technical Sciences in Cacak
T2  - Serbian Journal of Electrical Engineering
T1  - Synergetic effect of additives on the hardness and adhesion of thin electrodeposited copper films
VL  - 14
IS  - 1
SP  - 1
EP  - 11
DO  - 10.2298/SJEE1701001M
ER  - 

@article{
author = "Mladenović, Ivana and Lamovec, Jelena and Jović, Vesna and Radojević, Vesna",
year = "2017",
abstract = "Thin copper films were electrodeposited on a polycrystalline cold-rolled copper substrate. The composition of the laboratory-made copper sulphate electrolyte was changed by the addition of various additives. The influence of chloride ion (Cl-), polyethylene glycol (PEG) and 3-mercapto-1-propane sulfonic acid (MPSA) on mechanical and adhesion properties of the electrodeposited copper films was investigated using Vickers microindentation technique. Calculations of the film hardness and adhesion were carried out using composite hardness models of Korsunsky and Chen-Gao. The hardness of the composite system is influenced by the adhesion of the copper film to the substrate. Increasing adhesion corresponds to increasing values of the calculated adhesion parameter b, named the critical reduced depth. When additives are added to a plating solution, the copper deposition mechanism is changed and fine-grained microstructure without the formation of microscopic nodules is obtained.",
publisher = "Faculty of Technical Sciences in Cacak",
journal = "Serbian Journal of Electrical Engineering",
title = "Synergetic effect of additives on the hardness and adhesion of thin electrodeposited copper films",
volume = "14",
number = "1",
pages = "1-11",
doi = "10.2298/SJEE1701001M"
}

Mladenović, I., Lamovec, J., Jović, V.,& Radojević, V.. (2017). Synergetic effect of additives on the hardness and adhesion of thin electrodeposited copper films. in Serbian Journal of Electrical Engineering
Faculty of Technical Sciences in Cacak., 14(1), 1-11.
https://doi.org/10.2298/SJEE1701001M

Mladenović I, Lamovec J, Jović V, Radojević V. Synergetic effect of additives on the hardness and adhesion of thin electrodeposited copper films. in Serbian Journal of Electrical Engineering. 2017;14(1):1-11.
doi:10.2298/SJEE1701001M .

Mladenović, Ivana, Lamovec, Jelena, Jović, Vesna, Radojević, Vesna, "Synergetic effect of additives on the hardness and adhesion of thin electrodeposited copper films" in Serbian Journal of Electrical Engineering, 14, no. 1 (2017):1-11,
https://doi.org/10.2298/SJEE1701001M . .

TY  - CONF
AU  - Jović, Vesna
AU  - Lamovec, Jelena
AU  - Sojer, D.
AU  - Lončarević, Davor
AU  - Mladenović, Ivana
AU  - Vasiljević-Radović, Dana
PY  - 2017
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/2099
AB  - The aim of this Work as the fabrication of Nd2Fe14B submicron size particles starting from very coarse-grained hydrogen decrepitated (HD) material. Surfactant-assisted high-energy ball milling (SAHEBM) with WC milling balls and bowl was employed for obtaining magnetic powder with optimum characteristics for further magnet processing.
PB  - Institute of Electrical and Electronics Engineers Inc.
C3  - IEEE 30th International Conference on Microelectronics (Miel)
T1  - Effect of High Energy Ball Milling on the Morphology and Magnetic Properties of Powder Prepared from HD Nd2Fe14B Material
SP  - 131
EP  - 134
DO  - 10.1109/MIEL.2017.8190085
ER  - 

@conference{
author = "Jović, Vesna and Lamovec, Jelena and Sojer, D. and Lončarević, Davor and Mladenović, Ivana and Vasiljević-Radović, Dana",
year = "2017",
abstract = "The aim of this Work as the fabrication of Nd2Fe14B submicron size particles starting from very coarse-grained hydrogen decrepitated (HD) material. Surfactant-assisted high-energy ball milling (SAHEBM) with WC milling balls and bowl was employed for obtaining magnetic powder with optimum characteristics for further magnet processing.",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
journal = "IEEE 30th International Conference on Microelectronics (Miel)",
title = "Effect of High Energy Ball Milling on the Morphology and Magnetic Properties of Powder Prepared from HD Nd2Fe14B Material",
pages = "131-134",
doi = "10.1109/MIEL.2017.8190085"
}

Jović, V., Lamovec, J., Sojer, D., Lončarević, D., Mladenović, I.,& Vasiljević-Radović, D.. (2017). Effect of High Energy Ball Milling on the Morphology and Magnetic Properties of Powder Prepared from HD Nd2Fe14B Material. in IEEE 30th International Conference on Microelectronics (Miel)
Institute of Electrical and Electronics Engineers Inc.., 131-134.
https://doi.org/10.1109/MIEL.2017.8190085

Jović V, Lamovec J, Sojer D, Lončarević D, Mladenović I, Vasiljević-Radović D. Effect of High Energy Ball Milling on the Morphology and Magnetic Properties of Powder Prepared from HD Nd2Fe14B Material. in IEEE 30th International Conference on Microelectronics (Miel). 2017;:131-134.
doi:10.1109/MIEL.2017.8190085 .

Jović, Vesna, Lamovec, Jelena, Sojer, D., Lončarević, Davor, Mladenović, Ivana, Vasiljević-Radović, Dana, "Effect of High Energy Ball Milling on the Morphology and Magnetic Properties of Powder Prepared from HD Nd2Fe14B Material" in IEEE 30th International Conference on Microelectronics (Miel) (2017):131-134,
https://doi.org/10.1109/MIEL.2017.8190085 . .

TY  - JOUR
AU  - Todorović, D. M.
AU  - Rabasovic, M. D.
AU  - Markushev, D. D.
AU  - Jović, Vesna
AU  - Radulović, Katarina
PY  - 2017
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/2193
AB  - Rectangular silicon cantilevers are studied by the photoacoustic (PA) elastic bending method. Experimental signals versus modulation frequency of the excitation optical beam are measured and analyzed in a frequency range from 20 Hz to 50 000 Hz. The procedure for experimental signal correction to eliminate the frequency characteristics of the measuring system is given. The corrected experimental signal shows a good correlation with theoretically calculated PA signal at frequencies below 32 000 Hz. The corrected experimental PA elastic bending signals for cantilevers with different thicknesses are analyzed. The experimental results allow identifying the resonant frequency (the first resonant mode) of the cantilever vibrations. These values are in good agreement with the theoretically computed values. A theoretical model of the optically excited Si cantilever is derived, taking into account plasmaelastic, thermoelastic, and thermodiffusion mechanisms. Dynamic relations for the amplitude and phase of electronic and thermal elastic vibrations in optically excited cantilevers are derived. The theoretical model is compared to the experimental results.
PB  - Springer/Plenum Publishers, New York
T2  - International Journal of Thermophysics
T1  - Study of Silicon Cantilevers by the Photoacoustic Elastic Bending Method
VL  - 38
IS  - 3
DO  - 10.1007/s10765-016-2175-5
ER  - 

@article{
author = "Todorović, D. M. and Rabasovic, M. D. and Markushev, D. D. and Jović, Vesna and Radulović, Katarina",
year = "2017",
abstract = "Rectangular silicon cantilevers are studied by the photoacoustic (PA) elastic bending method. Experimental signals versus modulation frequency of the excitation optical beam are measured and analyzed in a frequency range from 20 Hz to 50 000 Hz. The procedure for experimental signal correction to eliminate the frequency characteristics of the measuring system is given. The corrected experimental signal shows a good correlation with theoretically calculated PA signal at frequencies below 32 000 Hz. The corrected experimental PA elastic bending signals for cantilevers with different thicknesses are analyzed. The experimental results allow identifying the resonant frequency (the first resonant mode) of the cantilever vibrations. These values are in good agreement with the theoretically computed values. A theoretical model of the optically excited Si cantilever is derived, taking into account plasmaelastic, thermoelastic, and thermodiffusion mechanisms. Dynamic relations for the amplitude and phase of electronic and thermal elastic vibrations in optically excited cantilevers are derived. The theoretical model is compared to the experimental results.",
publisher = "Springer/Plenum Publishers, New York",
journal = "International Journal of Thermophysics",
title = "Study of Silicon Cantilevers by the Photoacoustic Elastic Bending Method",
volume = "38",
number = "3",
doi = "10.1007/s10765-016-2175-5"
}

Todorović, D. M., Rabasovic, M. D., Markushev, D. D., Jović, V.,& Radulović, K.. (2017). Study of Silicon Cantilevers by the Photoacoustic Elastic Bending Method. in International Journal of Thermophysics
Springer/Plenum Publishers, New York., 38(3).
https://doi.org/10.1007/s10765-016-2175-5

Todorović DM, Rabasovic MD, Markushev DD, Jović V, Radulović K. Study of Silicon Cantilevers by the Photoacoustic Elastic Bending Method. in International Journal of Thermophysics. 2017;38(3).
doi:10.1007/s10765-016-2175-5 .

Todorović, D. M., Rabasovic, M. D., Markushev, D. D., Jović, Vesna, Radulović, Katarina, "Study of Silicon Cantilevers by the Photoacoustic Elastic Bending Method" in International Journal of Thermophysics, 38, no. 3 (2017),
https://doi.org/10.1007/s10765-016-2175-5 . .

TY  - CONF
AU  - Mladenović, Ivana
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Radojević, Vesna
PY  - 2016
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/3828
AB  - Tanki bakarni filmovi debljine 10 μm deponovani su na hladno-valjanim supstratima od bakra i mesinga procesom elektrohemijske depozicije iz laboratorijski napravljenog sulfatnog kupatila sa dodatkom različitih aditiva (hloridnih jona (Cl-) i polietilen glikola (PEG)). Ispitivan je uticaj aditiva i parametara depozicije na strukturna i mehanička svojstva bakarnih prevlaka. Prisustvo aditiva omogućilo je nastajanje glatkih i sjajnih depozita usled promene njihove mikrostrukture. Mikromehanička svojstva filmova bakra ispitivana su metodom mikroindentacije po Vikersu. Izmerena vrednost tvrdoće kompozitnog sistema Cu film – supstrat je složena funkcija tvrdoće supstrata i tvrdoće filma. Za određivanje tvrdoće filmova iz kompozitne mikrotvrdoće korišćeni su modeli Korsunskog i Šiko-Lezaža. Eksperimentalna ispitivanja su pokazala da se istovremenim dodatkom aditiva (PEG+Cl-) ostvaruje kvalitetnija mikrostruktura depozita koji usled toga imaju bolja mikromehanička svojstva.
PB  - Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering
C3  - Зборник 60. конференције за електронику, телекомуникације, рачунарство, аутоматику и нуклеарну технику ЕТРАН 2016, Златибор
T1  - Sinergetski efekat aditiva na morfološka i mikromehanička svojstva bakarnih prevlaka na različitim podlogama
SP  - MO1.1.1
EP  - MO1.1.6
UR  - https://hdl.handle.net/21.15107/rcub_cer_3828
ER  - 

@conference{
author = "Mladenović, Ivana and Lamovec, Jelena and Jović, Vesna and Radojević, Vesna",
year = "2016",
abstract = "Tanki bakarni filmovi debljine 10 μm deponovani su na hladno-valjanim supstratima od bakra i mesinga procesom elektrohemijske depozicije iz laboratorijski napravljenog sulfatnog kupatila sa dodatkom različitih aditiva (hloridnih jona (Cl-) i polietilen glikola (PEG)). Ispitivan je uticaj aditiva i parametara depozicije na strukturna i mehanička svojstva bakarnih prevlaka. Prisustvo aditiva omogućilo je nastajanje glatkih i sjajnih depozita usled promene njihove mikrostrukture. Mikromehanička svojstva filmova bakra ispitivana su metodom mikroindentacije po Vikersu. Izmerena vrednost tvrdoće kompozitnog sistema Cu film – supstrat je složena funkcija tvrdoće supstrata i tvrdoće filma. Za određivanje tvrdoće filmova iz kompozitne mikrotvrdoće korišćeni su modeli Korsunskog i Šiko-Lezaža. Eksperimentalna ispitivanja su pokazala da se istovremenim dodatkom aditiva (PEG+Cl-) ostvaruje kvalitetnija mikrostruktura depozita koji usled toga imaju bolja mikromehanička svojstva.",
publisher = "Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering",
journal = "Зборник 60. конференције за електронику, телекомуникације, рачунарство, аутоматику и нуклеарну технику ЕТРАН 2016, Златибор",
title = "Sinergetski efekat aditiva na morfološka i mikromehanička svojstva bakarnih prevlaka na različitim podlogama",
pages = "MO1.1.1-MO1.1.6",
url = "https://hdl.handle.net/21.15107/rcub_cer_3828"
}

Mladenović, I., Lamovec, J., Jović, V.,& Radojević, V.. (2016). Sinergetski efekat aditiva na morfološka i mikromehanička svojstva bakarnih prevlaka na različitim podlogama. in Зборник 60. конференције за електронику, телекомуникације, рачунарство, аутоматику и нуклеарну технику ЕТРАН 2016, Златибор
Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering., MO1.1.1-MO1.1.6.
https://hdl.handle.net/21.15107/rcub_cer_3828

Mladenović I, Lamovec J, Jović V, Radojević V. Sinergetski efekat aditiva na morfološka i mikromehanička svojstva bakarnih prevlaka na različitim podlogama. in Зборник 60. конференције за електронику, телекомуникације, рачунарство, аутоматику и нуклеарну технику ЕТРАН 2016, Златибор. 2016;:MO1.1.1-MO1.1.6.
https://hdl.handle.net/21.15107/rcub_cer_3828 .

Mladenović, Ivana, Lamovec, Jelena, Jović, Vesna, Radojević, Vesna, "Sinergetski efekat aditiva na morfološka i mikromehanička svojstva bakarnih prevlaka na različitim podlogama" in Зборник 60. конференције за електронику, телекомуникације, рачунарство, аутоматику и нуклеарну технику ЕТРАН 2016, Златибор (2016):MO1.1.1-MO1.1.6,
https://hdl.handle.net/21.15107/rcub_cer_3828 .

TY  - CONF
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Mladenović, Ivana
AU  - Popović, Bogdan
AU  - Vorkapić, Miloš
AU  - Radojević, Vesna
PY  - 2016
UR  - http://www.vti.mod.gov.rs/oteh16/index.htm
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/3833
AB  - Composite systems of monolayered electrodeposited Ni and Cu thin films (5-10 μm) on monocrystalline Si wafers
and 50 μm-thick electrodeposited Ni film as the substrates were fabricated. On the basis of their difference in hardness, these
systems can be thought of as “soft film on hard substrate” composite systems.
Adhesion of electrodeposited films on different substrates was investigated by Vickers microindentation hardness testing.
Strong adhesion corresponds to extended plastic deformation zone at the film/substrate interface. Interfacial tension effects
contribute to the measured hardness. Composite hardness models of Chicot-Lesage (C-L) and Chen-Gao (C-G) were
applied in order to investigate the influence of adhesion on microhardness test results. When adhesion exists between the
film and the substrate, the critical reduced depth (the ratio between the radius of the plastic zone beneath the indent and the
indentation depth) increases.
Microhardness measurements are useful tool for assessment and quantification of the film/substrate interface strength.
PB  - Belgrade : Military Technical Institute
C3  - Proceedings - 7th International scientific conference on defensive technologies-proceedings, Belgrade, Serbia
T1  - On the correlation of microhardness with the film adhesion for “soft film on hard substrate” composite system
SP  - 536
EP  - 540
UR  - https://hdl.handle.net/21.15107/rcub_cer_3833
ER  - 

@conference{
author = "Lamovec, Jelena and Jović, Vesna and Mladenović, Ivana and Popović, Bogdan and Vorkapić, Miloš and Radojević, Vesna",
year = "2016",
abstract = "Composite systems of monolayered electrodeposited Ni and Cu thin films (5-10 μm) on monocrystalline Si wafers
and 50 μm-thick electrodeposited Ni film as the substrates were fabricated. On the basis of their difference in hardness, these
systems can be thought of as “soft film on hard substrate” composite systems.
Adhesion of electrodeposited films on different substrates was investigated by Vickers microindentation hardness testing.
Strong adhesion corresponds to extended plastic deformation zone at the film/substrate interface. Interfacial tension effects
contribute to the measured hardness. Composite hardness models of Chicot-Lesage (C-L) and Chen-Gao (C-G) were
applied in order to investigate the influence of adhesion on microhardness test results. When adhesion exists between the
film and the substrate, the critical reduced depth (the ratio between the radius of the plastic zone beneath the indent and the
indentation depth) increases.
Microhardness measurements are useful tool for assessment and quantification of the film/substrate interface strength.",
publisher = "Belgrade : Military Technical Institute",
journal = "Proceedings - 7th International scientific conference on defensive technologies-proceedings, Belgrade, Serbia",
title = "On the correlation of microhardness with the film adhesion for “soft film on hard substrate” composite system",
pages = "536-540",
url = "https://hdl.handle.net/21.15107/rcub_cer_3833"
}

Lamovec, J., Jović, V., Mladenović, I., Popović, B., Vorkapić, M.,& Radojević, V.. (2016). On the correlation of microhardness with the film adhesion for “soft film on hard substrate” composite system. in Proceedings - 7th International scientific conference on defensive technologies-proceedings, Belgrade, Serbia
Belgrade : Military Technical Institute., 536-540.
https://hdl.handle.net/21.15107/rcub_cer_3833

Lamovec J, Jović V, Mladenović I, Popović B, Vorkapić M, Radojević V. On the correlation of microhardness with the film adhesion for “soft film on hard substrate” composite system. in Proceedings - 7th International scientific conference on defensive technologies-proceedings, Belgrade, Serbia. 2016;:536-540.
https://hdl.handle.net/21.15107/rcub_cer_3833 .

Lamovec, Jelena, Jović, Vesna, Mladenović, Ivana, Popović, Bogdan, Vorkapić, Miloš, Radojević, Vesna, "On the correlation of microhardness with the film adhesion for “soft film on hard substrate” composite system" in Proceedings - 7th International scientific conference on defensive technologies-proceedings, Belgrade, Serbia (2016):536-540,
https://hdl.handle.net/21.15107/rcub_cer_3833 .

TY  - CONF
AU  - Jović, Vesna
AU  - Lamovec, Jelena
AU  - Smiljanić, Milče M.
AU  - Lazić, Žarko
AU  - Popović, Bogdan
AU  - Poljak, Predrag
PY  - 2016
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/5775
AB  - This paper presents fabrication of microcantilevers on {100} oriented Si substrate by bulk micromachining. 
Two types of CCC (Convex Corner Compensation) structures, namely ⟨100⟩ oriented simple beam and structure using 
symmetric rectangular blocks oriented in the ⟨110⟩ direction at the apex of the square peg have been analyzed. Etching 
solution has been KOH water solution (80 wt. %) at etching temperature of 80 o
C. Detailed construction and etching 
behavior of both structures have been given and explained.
PB  - Belgrade : The Military Technical Institute
C3  - Proceedings - 7th International scientific conference on defensive technologies-proceedings, OTEH 2016, Belgrade, Serbia
T1  - A comparison of different convex corner compensation strucutures applicable in anisotropic wet chemical etching of {100} oriented silicon
UR  - https://hdl.handle.net/21.15107/rcub_cer_5775
ER  - 

@conference{
author = "Jović, Vesna and Lamovec, Jelena and Smiljanić, Milče M. and Lazić, Žarko and Popović, Bogdan and Poljak, Predrag",
year = "2016",
abstract = "This paper presents fabrication of microcantilevers on {100} oriented Si substrate by bulk micromachining. 
Two types of CCC (Convex Corner Compensation) structures, namely ⟨100⟩ oriented simple beam and structure using 
symmetric rectangular blocks oriented in the ⟨110⟩ direction at the apex of the square peg have been analyzed. Etching 
solution has been KOH water solution (80 wt. %) at etching temperature of 80 o
C. Detailed construction and etching 
behavior of both structures have been given and explained.",
publisher = "Belgrade : The Military Technical Institute",
journal = "Proceedings - 7th International scientific conference on defensive technologies-proceedings, OTEH 2016, Belgrade, Serbia",
title = "A comparison of different convex corner compensation strucutures applicable in anisotropic wet chemical etching of {100} oriented silicon",
url = "https://hdl.handle.net/21.15107/rcub_cer_5775"
}

Jović, V., Lamovec, J., Smiljanić, M. M., Lazić, Ž., Popović, B.,& Poljak, P.. (2016). A comparison of different convex corner compensation strucutures applicable in anisotropic wet chemical etching of {100} oriented silicon. in Proceedings - 7th International scientific conference on defensive technologies-proceedings, OTEH 2016, Belgrade, Serbia
Belgrade : The Military Technical Institute..
https://hdl.handle.net/21.15107/rcub_cer_5775

Jović V, Lamovec J, Smiljanić MM, Lazić Ž, Popović B, Poljak P. A comparison of different convex corner compensation strucutures applicable in anisotropic wet chemical etching of {100} oriented silicon. in Proceedings - 7th International scientific conference on defensive technologies-proceedings, OTEH 2016, Belgrade, Serbia. 2016;.
https://hdl.handle.net/21.15107/rcub_cer_5775 .

Jović, Vesna, Lamovec, Jelena, Smiljanić, Milče M., Lazić, Žarko, Popović, Bogdan, Poljak, Predrag, "A comparison of different convex corner compensation strucutures applicable in anisotropic wet chemical etching of {100} oriented silicon" in Proceedings - 7th International scientific conference on defensive technologies-proceedings, OTEH 2016, Belgrade, Serbia (2016),
https://hdl.handle.net/21.15107/rcub_cer_5775 .

TY  - CONF
AU  - Mladenović, Ivana
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Radojević, Vesna
PY  - 2015
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/3829
AB  - Tehnikom elektrohemijske depozicije iz dva
kupatila (DBT), dobijeni su višeslojni filmovi Ni i Cu
naizmeničnim deponovanjem na polikristalni bakarni supstrat.
Promena parametara kao što su ukupna debljina filma,
debljina pojedinačnog sloja i odnos debljina pojedinačnih
slojeva Ni i Cu u filmu, utiče na mehanička svojstva višeslojnih
filmova i omogućava formiranje različitih struktura za njihovu
primenu u MEMS-u. Tanki filmovi Ni i Cu sa debljinom
slojeva od 75 nm do 5 μm pokazuju dobru međuslojnu
adheziju. Smanjenjem debljine pojedinačnog sloja do 300 nm i
povećanjem odnosa debljina slojeva Ni:Cu na 1:4, došlo se do
višestrukog povećanja vrednosti Vikersove mikrotvrdoće u
odnosu na jednoslojne metalne filmove. Filmovi sa debljinom
slojeva većom od 5 mikrometara, nemaju dobru medjuslojnu
adheziju i uočava se delaminacija slojeva. Sve strukture
višeslojnih filmova Ni i Cu se mogu primeniti za izradu
trodimenzionalnih MEMS struktura od nikla, metodom
selektivnog nagrizanja sloja bakra u kiselom rastvoru tiouree
(tehnikom „površinskog mikromašinstva“).
AB  - Multilayer Ni/Cu films were alternately electrochemically deposited on polycrystalline Cu substrate by dual-bath technique. Change of the
parameters such as total film thickness, sublayer thickness and sublayer thickness ratio influences the mechanical properties of the multilayer Ni/Cu films and gives the possibilities for different MEMS fabrication applications. Thin Ni and Cu films with sublayer thickness from 75 nm to 5 µm have good interlayer adhesion. Decreasing the sublayer thickness leads to increase in the composite microhardness value. Delamination of the layers is noticed for the sublayer thickness greater than 5 µm. Three-dimensional Ni microstructures can be fabricated using multilayer Ni/Cu film by selective etching of Cu layers in in acidic thiourea solution („surface micromachining“ technique).
PB  - Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering
C3  - Зборник 59. конференције за електронику, телекомуникације, рачунарство, аутоматику и нуклеарну технику ЕТРАН 2015, Srebrno jezero
T1  - Uticaj strukture višeslojnih tankih filmova nikla i bakra na njihova mehanička svojstva i primenu u izradi MEMS naprava
T1  - Influence of the structure of multilayer thin Ni/Cu films
on their mechanical properties and MEMS devices
fabrication applications
SP  - MO2.1.1
EP  - MO2.1.4
UR  - https://hdl.handle.net/21.15107/rcub_cer_3829
ER  - 

@conference{
author = "Mladenović, Ivana and Lamovec, Jelena and Jović, Vesna and Radojević, Vesna",
year = "2015",
abstract = "Tehnikom elektrohemijske depozicije iz dva
kupatila (DBT), dobijeni su višeslojni filmovi Ni i Cu
naizmeničnim deponovanjem na polikristalni bakarni supstrat.
Promena parametara kao što su ukupna debljina filma,
debljina pojedinačnog sloja i odnos debljina pojedinačnih
slojeva Ni i Cu u filmu, utiče na mehanička svojstva višeslojnih
filmova i omogućava formiranje različitih struktura za njihovu
primenu u MEMS-u. Tanki filmovi Ni i Cu sa debljinom
slojeva od 75 nm do 5 μm pokazuju dobru međuslojnu
adheziju. Smanjenjem debljine pojedinačnog sloja do 300 nm i
povećanjem odnosa debljina slojeva Ni:Cu na 1:4, došlo se do
višestrukog povećanja vrednosti Vikersove mikrotvrdoće u
odnosu na jednoslojne metalne filmove. Filmovi sa debljinom
slojeva većom od 5 mikrometara, nemaju dobru medjuslojnu
adheziju i uočava se delaminacija slojeva. Sve strukture
višeslojnih filmova Ni i Cu se mogu primeniti za izradu
trodimenzionalnih MEMS struktura od nikla, metodom
selektivnog nagrizanja sloja bakra u kiselom rastvoru tiouree
(tehnikom „površinskog mikromašinstva“)., Multilayer Ni/Cu films were alternately electrochemically deposited on polycrystalline Cu substrate by dual-bath technique. Change of the
parameters such as total film thickness, sublayer thickness and sublayer thickness ratio influences the mechanical properties of the multilayer Ni/Cu films and gives the possibilities for different MEMS fabrication applications. Thin Ni and Cu films with sublayer thickness from 75 nm to 5 µm have good interlayer adhesion. Decreasing the sublayer thickness leads to increase in the composite microhardness value. Delamination of the layers is noticed for the sublayer thickness greater than 5 µm. Three-dimensional Ni microstructures can be fabricated using multilayer Ni/Cu film by selective etching of Cu layers in in acidic thiourea solution („surface micromachining“ technique).",
publisher = "Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering",
journal = "Зборник 59. конференције за електронику, телекомуникације, рачунарство, аутоматику и нуклеарну технику ЕТРАН 2015, Srebrno jezero",
title = "Uticaj strukture višeslojnih tankih filmova nikla i bakra na njihova mehanička svojstva i primenu u izradi MEMS naprava, Influence of the structure of multilayer thin Ni/Cu films
on their mechanical properties and MEMS devices
fabrication applications",
pages = "MO2.1.1-MO2.1.4",
url = "https://hdl.handle.net/21.15107/rcub_cer_3829"
}

Mladenović, I., Lamovec, J., Jović, V.,& Radojević, V.. (2015). Uticaj strukture višeslojnih tankih filmova nikla i bakra na njihova mehanička svojstva i primenu u izradi MEMS naprava. in Зборник 59. конференције за електронику, телекомуникације, рачунарство, аутоматику и нуклеарну технику ЕТРАН 2015, Srebrno jezero
Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering., MO2.1.1-MO2.1.4.
https://hdl.handle.net/21.15107/rcub_cer_3829

Mladenović I, Lamovec J, Jović V, Radojević V. Uticaj strukture višeslojnih tankih filmova nikla i bakra na njihova mehanička svojstva i primenu u izradi MEMS naprava. in Зборник 59. конференције за електронику, телекомуникације, рачунарство, аутоматику и нуклеарну технику ЕТРАН 2015, Srebrno jezero. 2015;:MO2.1.1-MO2.1.4.
https://hdl.handle.net/21.15107/rcub_cer_3829 .

Mladenović, Ivana, Lamovec, Jelena, Jović, Vesna, Radojević, Vesna, "Uticaj strukture višeslojnih tankih filmova nikla i bakra na njihova mehanička svojstva i primenu u izradi MEMS naprava" in Зборник 59. конференције за електронику, телекомуникације, рачунарство, аутоматику и нуклеарну технику ЕТРАН 2015, Srebrno jezero (2015):MO2.1.1-MO2.1.4,
https://hdl.handle.net/21.15107/rcub_cer_3829 .

TY  - GEN
AU  - Smiljanić, Milče M.
AU  - Lazić, Žarko
AU  - Jović, Vesna
AU  - Rašljić, Milena
AU  - Cvetanović, Katarina
AU  - Vasiljević-Radović, Dana
PY  - 2015
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/3980
AB  - Anizotropno vlažno hemijsko nagrizanje (100) silicijuma u vodenom rastvoru TMAH
koncentracije 25 tež. % na temperaturi od 80 C je novi tehnološki postupak koji se koristi za
izradu različitih trodimenzionalnih struktura. Osnova ove tehnike su nanošenje silicijum
dioksida, koji predstavlja maskirajući sloj, i fotolitografski postupak, kojim se definišu
strukture u pravcu <110> ili u pravcu <100> i odgovarajuće kompenzacije na konveksnim
uglovima. Nagrizanjem silicijuma kroz otvore u silicijum dioksidu dobijaju se kompenzovani
konveksni uglovi čiji su kraci duž pravca <110> ili duž pravca <100>.
PB  - Belgrade : University of Belgrade - Institute of Chemistry, Technology and Metallurgy
T1  - Kompenzacija konveksnog ugla u vodenom rastvoru TMAH koncentracije 25 tež. %
UR  - https://hdl.handle.net/21.15107/rcub_cer_3980
ER  - 

@misc{
author = "Smiljanić, Milče M. and Lazić, Žarko and Jović, Vesna and Rašljić, Milena and Cvetanović, Katarina and Vasiljević-Radović, Dana",
year = "2015",
abstract = "Anizotropno vlažno hemijsko nagrizanje (100) silicijuma u vodenom rastvoru TMAH
koncentracije 25 tež. % na temperaturi od 80 C je novi tehnološki postupak koji se koristi za
izradu različitih trodimenzionalnih struktura. Osnova ove tehnike su nanošenje silicijum
dioksida, koji predstavlja maskirajući sloj, i fotolitografski postupak, kojim se definišu
strukture u pravcu <110> ili u pravcu <100> i odgovarajuće kompenzacije na konveksnim
uglovima. Nagrizanjem silicijuma kroz otvore u silicijum dioksidu dobijaju se kompenzovani
konveksni uglovi čiji su kraci duž pravca <110> ili duž pravca <100>.",
publisher = "Belgrade : University of Belgrade - Institute of Chemistry, Technology and Metallurgy",
title = "Kompenzacija konveksnog ugla u vodenom rastvoru TMAH koncentracije 25 tež. %",
url = "https://hdl.handle.net/21.15107/rcub_cer_3980"
}

Smiljanić, M. M., Lazić, Ž., Jović, V., Rašljić, M., Cvetanović, K.,& Vasiljević-Radović, D.. (2015). Kompenzacija konveksnog ugla u vodenom rastvoru TMAH koncentracije 25 tež. %. 
Belgrade : University of Belgrade - Institute of Chemistry, Technology and Metallurgy..
https://hdl.handle.net/21.15107/rcub_cer_3980

Smiljanić MM, Lazić Ž, Jović V, Rašljić M, Cvetanović K, Vasiljević-Radović D. Kompenzacija konveksnog ugla u vodenom rastvoru TMAH koncentracije 25 tež. %. 2015;.
https://hdl.handle.net/21.15107/rcub_cer_3980 .

Smiljanić, Milče M., Lazić, Žarko, Jović, Vesna, Rašljić, Milena, Cvetanović, Katarina, Vasiljević-Radović, Dana, "Kompenzacija konveksnog ugla u vodenom rastvoru TMAH koncentracije 25 tež. %" (2015),
https://hdl.handle.net/21.15107/rcub_cer_3980 .

TY  - GEN
AU  - Jović, Vesna
AU  - Đinović, Zoran
AU  - Radovanović, Filip
AU  - Starčević, Marko
AU  - Lamovec, Jelena
AU  - Smiljanić, Milče M.
AU  - Lazić, Žarko
AU  - Popović, Bogdan
AU  - Vorkapić, Miloš
PY  - 2015
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/3981
AB  - Поступцима запреминског микромашинства су реализовани квадратни отвори у Si супстратима {100} оријентације и над њима мембране ПДМС-а различите дебљине. С обзиром, да се филмови ПДМС-а не могу обрађивати и структуирати класичним фотолитографским поступцима, овај технолошки поступак омогућава реализацију дефинисаних мембрана овог материјала на супстратима Si који се у потпуности могу структуирати поступцима класичне фотолитографије. Ово отвара могућност за
реализацијом читавог низа сензора и актуатора који у свом раду могу да користе хипереластичне мембране ПДМС-а.
PB  - Ministarstvo za prosvetu, nauku i tehnološki razvoj - Projekat TR32008
T1  - Реализација ПДМС (ПолиДиМетилСилоксанских) мембрана над дефинисаним отворима у Si {100} оријентације поступцима запреминског микромашинства
UR  - https://hdl.handle.net/21.15107/rcub_cer_3981
ER  - 

@misc{
author = "Jović, Vesna and Đinović, Zoran and Radovanović, Filip and Starčević, Marko and Lamovec, Jelena and Smiljanić, Milče M. and Lazić, Žarko and Popović, Bogdan and Vorkapić, Miloš",
year = "2015",
abstract = "Поступцима запреминског микромашинства су реализовани квадратни отвори у Si супстратима {100} оријентације и над њима мембране ПДМС-а различите дебљине. С обзиром, да се филмови ПДМС-а не могу обрађивати и структуирати класичним фотолитографским поступцима, овај технолошки поступак омогућава реализацију дефинисаних мембрана овог материјала на супстратима Si који се у потпуности могу структуирати поступцима класичне фотолитографије. Ово отвара могућност за
реализацијом читавог низа сензора и актуатора који у свом раду могу да користе хипереластичне мембране ПДМС-а.",
publisher = "Ministarstvo za prosvetu, nauku i tehnološki razvoj - Projekat TR32008",
title = "Реализација ПДМС (ПолиДиМетилСилоксанских) мембрана над дефинисаним отворима у Si {100} оријентације поступцима запреминског микромашинства",
url = "https://hdl.handle.net/21.15107/rcub_cer_3981"
}

Jović, V., Đinović, Z., Radovanović, F., Starčević, M., Lamovec, J., Smiljanić, M. M., Lazić, Ž., Popović, B.,& Vorkapić, M.. (2015). Реализација ПДМС (ПолиДиМетилСилоксанских) мембрана над дефинисаним отворима у Si {100} оријентације поступцима запреминског микромашинства. 
Ministarstvo za prosvetu, nauku i tehnološki razvoj - Projekat TR32008..
https://hdl.handle.net/21.15107/rcub_cer_3981

Jović V, Đinović Z, Radovanović F, Starčević M, Lamovec J, Smiljanić MM, Lazić Ž, Popović B, Vorkapić M. Реализација ПДМС (ПолиДиМетилСилоксанских) мембрана над дефинисаним отворима у Si {100} оријентације поступцима запреминског микромашинства. 2015;.
https://hdl.handle.net/21.15107/rcub_cer_3981 .

Jović, Vesna, Đinović, Zoran, Radovanović, Filip, Starčević, Marko, Lamovec, Jelena, Smiljanić, Milče M., Lazić, Žarko, Popović, Bogdan, Vorkapić, Miloš, "Реализација ПДМС (ПолиДиМетилСилоксанских) мембрана над дефинисаним отворима у Si {100} оријентације поступцима запреминског микромашинства" (2015),
https://hdl.handle.net/21.15107/rcub_cer_3981 .

TY  - JOUR
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Mladenović, Ivana
AU  - Popović, Bogdan
AU  - Radojević, Vesna
PY  - 2015
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/1691
AB  - Multilayer Ni/Cu thin films were produced by dual-bath electrodeposition technique (DBT) on polycrystalline cold-rolled Cu substrate. Different Ni/Cu multilayer structures were realized by changing of process parameters such as total film thickness, sublayer thickness and Ni/Cu sublayer thickness ratio. The mechanical properties of Vickers microhardness and interfacial adhesion in the films were investigated. Decreasing of sublayer thickness down to 300 nm and increasing of Ni:Cu sublayer thickness ratio to 1:4, lead to higher values of Vickers microhardness compared to monolayer metal films. Thin films with sublayer thicknesses from 75 nm to 5 μm show strong interfacial adhesion. A weak adhesion and sublayer exfoliation for the films with sublayer thickness greater than 5μm were found. Three-dimensional Ni microstructures can be fabricated using multilayer Ni/Cu film by selective etching of Cu layers in an acidic thiourea solution ('surface micromachining' technique).
AB  - Tehnikom elektrohemijske depozicije iz dva kupatila (dual-bath technique, DBT), dobijeni su višeslojni filmovi Ni i Cu, naizmeničnim deponovanjem na polikristalni, hladno-valjani bakarni supstrat. Različite strukture Ni/Cu višeslojnih filmova su ostvarene promenom procesnih parametara kao što su ukupna debljina filma, debljina pojedinačnog sloja u filmu i odnos debljina pojedinačnih slojeva Ni i Cu u filmu. Ispitana su mehanička svojstva mikrotvrdoće po Vikersu i adhezije filma na supstratu i kontaktnim površinama slojeva u filmu. Smanjenjem debljine pojedinačnog sloja do 300 nm i povećanjem odnosa debljina slojeva Ni:Cu na 1:4, došlo se do višestrukog povećanja vrednosti Vikersove mikrotvrdoće u odnosu na jednoslojne metalne filmove. Tanki slojevi Ni i Cu sa debljinom od 75 nm do 5 μm pokazuju dobru međuslojnu adheziju. Filmovi sa debljinom slojeva većom od 5 μm, nemaju dobru međuslojnu adheziju i uočava se delaminacija (razdvajanje) slojeva. Sve strukture višeslojnih filmova Ni i Cu se mogu primeniti za izradu trodimenzionalnih MEMS struktura od Ni, metodom selektivnog nagrizanja slojeva Cu u kiselom rastvoru tiouree tehnikom 'površinskog mikromašinstva'.
PB  - Savez inženjera i tehničara Srbije
T2  - Tehnika
T1  - Analysis of the influence of structure on mechanical properties of multilayer Ni/Cu thin films for use in microelectronic technologies
T1  - Analiza uticaja strukture na mehanička svojstva višeslojnih tankih filmova Ni/Cu za primenu u mikroelektronskim tehnologijama
VL  - 70
IS  - 6
SP  - 915
EP  - 920
DO  - 10.5937/tehnika1506915L
ER  - 

@article{
author = "Lamovec, Jelena and Jović, Vesna and Mladenović, Ivana and Popović, Bogdan and Radojević, Vesna",
year = "2015",
abstract = "Multilayer Ni/Cu thin films were produced by dual-bath electrodeposition technique (DBT) on polycrystalline cold-rolled Cu substrate. Different Ni/Cu multilayer structures were realized by changing of process parameters such as total film thickness, sublayer thickness and Ni/Cu sublayer thickness ratio. The mechanical properties of Vickers microhardness and interfacial adhesion in the films were investigated. Decreasing of sublayer thickness down to 300 nm and increasing of Ni:Cu sublayer thickness ratio to 1:4, lead to higher values of Vickers microhardness compared to monolayer metal films. Thin films with sublayer thicknesses from 75 nm to 5 μm show strong interfacial adhesion. A weak adhesion and sublayer exfoliation for the films with sublayer thickness greater than 5μm were found. Three-dimensional Ni microstructures can be fabricated using multilayer Ni/Cu film by selective etching of Cu layers in an acidic thiourea solution ('surface micromachining' technique)., Tehnikom elektrohemijske depozicije iz dva kupatila (dual-bath technique, DBT), dobijeni su višeslojni filmovi Ni i Cu, naizmeničnim deponovanjem na polikristalni, hladno-valjani bakarni supstrat. Različite strukture Ni/Cu višeslojnih filmova su ostvarene promenom procesnih parametara kao što su ukupna debljina filma, debljina pojedinačnog sloja u filmu i odnos debljina pojedinačnih slojeva Ni i Cu u filmu. Ispitana su mehanička svojstva mikrotvrdoće po Vikersu i adhezije filma na supstratu i kontaktnim površinama slojeva u filmu. Smanjenjem debljine pojedinačnog sloja do 300 nm i povećanjem odnosa debljina slojeva Ni:Cu na 1:4, došlo se do višestrukog povećanja vrednosti Vikersove mikrotvrdoće u odnosu na jednoslojne metalne filmove. Tanki slojevi Ni i Cu sa debljinom od 75 nm do 5 μm pokazuju dobru međuslojnu adheziju. Filmovi sa debljinom slojeva većom od 5 μm, nemaju dobru međuslojnu adheziju i uočava se delaminacija (razdvajanje) slojeva. Sve strukture višeslojnih filmova Ni i Cu se mogu primeniti za izradu trodimenzionalnih MEMS struktura od Ni, metodom selektivnog nagrizanja slojeva Cu u kiselom rastvoru tiouree tehnikom 'površinskog mikromašinstva'.",
publisher = "Savez inženjera i tehničara Srbije",
journal = "Tehnika",
title = "Analysis of the influence of structure on mechanical properties of multilayer Ni/Cu thin films for use in microelectronic technologies, Analiza uticaja strukture na mehanička svojstva višeslojnih tankih filmova Ni/Cu za primenu u mikroelektronskim tehnologijama",
volume = "70",
number = "6",
pages = "915-920",
doi = "10.5937/tehnika1506915L"
}

Lamovec, J., Jović, V., Mladenović, I., Popović, B.,& Radojević, V.. (2015). Analysis of the influence of structure on mechanical properties of multilayer Ni/Cu thin films for use in microelectronic technologies. in Tehnika
Savez inženjera i tehničara Srbije., 70(6), 915-920.
https://doi.org/10.5937/tehnika1506915L

Lamovec J, Jović V, Mladenović I, Popović B, Radojević V. Analysis of the influence of structure on mechanical properties of multilayer Ni/Cu thin films for use in microelectronic technologies. in Tehnika. 2015;70(6):915-920.
doi:10.5937/tehnika1506915L .

Lamovec, Jelena, Jović, Vesna, Mladenović, Ivana, Popović, Bogdan, Radojević, Vesna, "Analysis of the influence of structure on mechanical properties of multilayer Ni/Cu thin films for use in microelectronic technologies" in Tehnika, 70, no. 6 (2015):915-920,
https://doi.org/10.5937/tehnika1506915L . .

TY  - CONF
AU  - Radulović, Katarina
AU  - Radovanović, Filip
AU  - Randjelović, Danijela
AU  - Jović, Vesna
AU  - Lamovec, Jelena
AU  - Vasiljević-Radović, Dana
AU  - Jakšić, Zoran
PY  - 2015
UR  - http://dais.sanu.ac.rs/123456789/787
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/2594
AB  - Properties of sintered NdFeB magnets strongly depend on granulation and size distribution of constituent particles, which requires an efficient method for their separation into relatively narrow size fractions. We investigated two methods of magnetic particle separation from a mixture with different sizes using simulation by finite element method: magnetophoresis and gravity settling. In the case of magnetophoresis magnetic particles ranging in diameter from 1 to 10 m were deflected from the direction of continuous laminar flow by a perpendicular magnetic field. Larger particles were deflected from the direction of laminar flow more than smaller particles. The applied flow rate and strength and gradient of the applied magnetic field were the key parameters in controlling the deflection. The gravity settling model simulated spherical particles falling in heptane. Particles of various sizes were divided according to the time they needed to reach the bottom. The model used an axially symmetric fluid-flow simulation in a moving coordinate system connected with the particle, coupled with an ordinary differential equation for the force balance of the particle (gravity and drag force). The grain accelerated from standstill and rapidly reached its terminal velocity. This velocity was approximately proportional to the square of the particle radius, which led to clear separation of 5-10 um particles from those with a diameter of 1 um.
PB  - Belgrade : ETRAN Society
C3  - 59. Konferencija za elektroniku, telekomunikacije, računarstvo, automatiku i nuklearnu tehniku, Srebrno jezero, 8-11. juna, 2015. godine [i] 2nd International Conference on Electrical, Electronic and Computing Engineering IcETRAN 2015 Silver Lake (Srebrno jezero), Serbia, June 8-11, 2015: Proceedings
T1  - Modelling the size separation of NdFeB magnetic microparticles by magnetophoresis and gravity settling
UR  - https://hdl.handle.net/21.15107/rcub_dais_787
ER  - 

@conference{
author = "Radulović, Katarina and Radovanović, Filip and Randjelović, Danijela and Jović, Vesna and Lamovec, Jelena and Vasiljević-Radović, Dana and Jakšić, Zoran",
year = "2015",
abstract = "Properties of sintered NdFeB magnets strongly depend on granulation and size distribution of constituent particles, which requires an efficient method for their separation into relatively narrow size fractions. We investigated two methods of magnetic particle separation from a mixture with different sizes using simulation by finite element method: magnetophoresis and gravity settling. In the case of magnetophoresis magnetic particles ranging in diameter from 1 to 10 m were deflected from the direction of continuous laminar flow by a perpendicular magnetic field. Larger particles were deflected from the direction of laminar flow more than smaller particles. The applied flow rate and strength and gradient of the applied magnetic field were the key parameters in controlling the deflection. The gravity settling model simulated spherical particles falling in heptane. Particles of various sizes were divided according to the time they needed to reach the bottom. The model used an axially symmetric fluid-flow simulation in a moving coordinate system connected with the particle, coupled with an ordinary differential equation for the force balance of the particle (gravity and drag force). The grain accelerated from standstill and rapidly reached its terminal velocity. This velocity was approximately proportional to the square of the particle radius, which led to clear separation of 5-10 um particles from those with a diameter of 1 um.",
publisher = "Belgrade : ETRAN Society",
journal = "59. Konferencija za elektroniku, telekomunikacije, računarstvo, automatiku i nuklearnu tehniku, Srebrno jezero, 8-11. juna, 2015. godine [i] 2nd International Conference on Electrical, Electronic and Computing Engineering IcETRAN 2015 Silver Lake (Srebrno jezero), Serbia, June 8-11, 2015: Proceedings",
title = "Modelling the size separation of NdFeB magnetic microparticles by magnetophoresis and gravity settling",
url = "https://hdl.handle.net/21.15107/rcub_dais_787"
}

Radulović, K., Radovanović, F., Randjelović, D., Jović, V., Lamovec, J., Vasiljević-Radović, D.,& Jakšić, Z.. (2015). Modelling the size separation of NdFeB magnetic microparticles by magnetophoresis and gravity settling. in 59. Konferencija za elektroniku, telekomunikacije, računarstvo, automatiku i nuklearnu tehniku, Srebrno jezero, 8-11. juna, 2015. godine [i] 2nd International Conference on Electrical, Electronic and Computing Engineering IcETRAN 2015 Silver Lake (Srebrno jezero), Serbia, June 8-11, 2015: Proceedings
Belgrade : ETRAN Society..
https://hdl.handle.net/21.15107/rcub_dais_787

Radulović K, Radovanović F, Randjelović D, Jović V, Lamovec J, Vasiljević-Radović D, Jakšić Z. Modelling the size separation of NdFeB magnetic microparticles by magnetophoresis and gravity settling. in 59. Konferencija za elektroniku, telekomunikacije, računarstvo, automatiku i nuklearnu tehniku, Srebrno jezero, 8-11. juna, 2015. godine [i] 2nd International Conference on Electrical, Electronic and Computing Engineering IcETRAN 2015 Silver Lake (Srebrno jezero), Serbia, June 8-11, 2015: Proceedings. 2015;.
https://hdl.handle.net/21.15107/rcub_dais_787 .

Radulović, Katarina, Radovanović, Filip, Randjelović, Danijela, Jović, Vesna, Lamovec, Jelena, Vasiljević-Radović, Dana, Jakšić, Zoran, "Modelling the size separation of NdFeB magnetic microparticles by magnetophoresis and gravity settling" in 59. Konferencija za elektroniku, telekomunikacije, računarstvo, automatiku i nuklearnu tehniku, Srebrno jezero, 8-11. juna, 2015. godine [i] 2nd International Conference on Electrical, Electronic and Computing Engineering IcETRAN 2015 Silver Lake (Srebrno jezero), Serbia, June 8-11, 2015: Proceedings (2015),
https://hdl.handle.net/21.15107/rcub_dais_787 .