@conference{
author = "Mladenović, Ivana and Vuksanović, Marija and Obradov, Marko and Jovanov, Vladislav and Vorkapić, Miloš and Nikolić, Nebojša D. and Vasiljević-Radović, Dana",
year = "2023",
abstract = "In this study, different forms of copper films were
electrodeposited (ED) on silicon wafer, copper and brass foils.
The effect of monocrystalline Si(111) surface cleaning method
and electrodeposition conditions and regimes (frequency in the
pulsating current (PC) regime, an addition of additives in
electrolyte for the constant galvanostatic (DC) regime, and
thickness) on surface morphology and wettability of copper films
was investigated. Optical microscopy equipped with highresolution camera, scanning electron microscopy (SEM) and an
atomic force microscopy (AFM) were used for thin film
characterization and to evaluate wettability of copper films. The
sessile drop method was used for the measurement of water
contact angle. According to the obtained results, choice of
electrolyte used in ED greatly affects wettability of copper films.
It was also shown that copper films electrodeposited from basic
sulfate electrolyte with varying current regimes frequencies,
thicknesses, and cathode types have opposite trends between
roughness parameter values and the water contact angle value.
Structural-morphological changes of a film or bulk solid surface
are key parameters in determining wettability properties and the
analysis of the wetting angle oscillations, but not the only one.",
publisher = "Society for Electronics, Telecommunications, Computers, Automatic Control and Nuclear Engineering",
journal = "Proceedings, X International conference IcETRAN, 05 - 08.06.2023, East Sarajevo, B&H",
title = "Wettability of electrodeposited copper films and correlation with morphology and surface chemistry",
volume = "MOI1.3-6",
pages = "MOI1.3-1",
url = "https://hdl.handle.net/21.15107/rcub_cer_6253"
}