Wettability of electrodeposited copper films and correlation with morphology and surface chemistry
Само за регистроване кориснике
2023
Аутори
Mladenović, IvanaVuksanović, Marija
Obradov, Marko
Jovanov, Vladislav
Vorkapić, Miloš
Nikolić, Nebojša D.
Vasiljević-Radović, Dana
Конференцијски прилог (Објављена верзија)
Метаподаци
Приказ свих података о документуАпстракт
In this study, different forms of copper films were
electrodeposited (ED) on silicon wafer, copper and brass foils.
The effect of monocrystalline Si(111) surface cleaning method
and electrodeposition conditions and regimes (frequency in the
pulsating current (PC) regime, an addition of additives in
electrolyte for the constant galvanostatic (DC) regime, and
thickness) on surface morphology and wettability of copper films
was investigated. Optical microscopy equipped with highresolution camera, scanning electron microscopy (SEM) and an
atomic force microscopy (AFM) were used for thin film
characterization and to evaluate wettability of copper films. The
sessile drop method was used for the measurement of water
contact angle. According to the obtained results, choice of
electrolyte used in ED greatly affects wettability of copper films.
It was also shown that copper films electrodeposited from basic
sulfate electrolyte with varying current regimes frequencies,
thicknesses,... and cathode types have opposite trends between
roughness parameter values and the water contact angle value.
Structural-morphological changes of a film or bulk solid surface
are key parameters in determining wettability properties and the
analysis of the wetting angle oscillations, but not the only one.
Кључне речи:
wettability / water contact angle / sessile drop method / copper films / hydrophilic / image analysisИзвор:
Proceedings, X International conference IcETRAN, 05 - 08.06.2023, East Sarajevo, B&H, 2023, MOI1.3-6, MOI1.3-1-Издавач:
- Society for Electronics, Telecommunications, Computers, Automatic Control and Nuclear Engineering
Финансирање / пројекти:
- Министарство науке, технолошког развоја и иновација Републике Србије, институционално финансирање - 200026 (Универзитет у Београду, Институт за хемију, технологију и металургију - ИХТМ) (RS-MESTD-inst-2020-200026)
- Министарство науке, технолошког развоја и иновација Републике Србије, институционално финансирање - 200017 (Универзитет у Београду, Институт за нуклеарне науке Винча, Београд-Винча) (RS-MESTD-inst-2020-200017)
URI
https://www.etran.rs/2023/E_PROCEEDINGS_ICETRAN_2023/IcETRAN23_RADOVI/MOI1.3.pdfhttps://cer.ihtm.bg.ac.rs/handle/123456789/6253
Институција/група
IHTMTY - CONF AU - Mladenović, Ivana AU - Vuksanović, Marija AU - Obradov, Marko AU - Jovanov, Vladislav AU - Vorkapić, Miloš AU - Nikolić, Nebojša D. AU - Vasiljević-Radović, Dana PY - 2023 UR - https://www.etran.rs/2023/E_PROCEEDINGS_ICETRAN_2023/IcETRAN23_RADOVI/MOI1.3.pdf UR - https://cer.ihtm.bg.ac.rs/handle/123456789/6253 AB - In this study, different forms of copper films were electrodeposited (ED) on silicon wafer, copper and brass foils. The effect of monocrystalline Si(111) surface cleaning method and electrodeposition conditions and regimes (frequency in the pulsating current (PC) regime, an addition of additives in electrolyte for the constant galvanostatic (DC) regime, and thickness) on surface morphology and wettability of copper films was investigated. Optical microscopy equipped with highresolution camera, scanning electron microscopy (SEM) and an atomic force microscopy (AFM) were used for thin film characterization and to evaluate wettability of copper films. The sessile drop method was used for the measurement of water contact angle. According to the obtained results, choice of electrolyte used in ED greatly affects wettability of copper films. It was also shown that copper films electrodeposited from basic sulfate electrolyte with varying current regimes frequencies, thicknesses, and cathode types have opposite trends between roughness parameter values and the water contact angle value. Structural-morphological changes of a film or bulk solid surface are key parameters in determining wettability properties and the analysis of the wetting angle oscillations, but not the only one. PB - Society for Electronics, Telecommunications, Computers, Automatic Control and Nuclear Engineering C3 - Proceedings, X International conference IcETRAN, 05 - 08.06.2023, East Sarajevo, B&H T1 - Wettability of electrodeposited copper films and correlation with morphology and surface chemistry VL - MOI1.3-6 SP - MOI1.3-1 UR - https://hdl.handle.net/21.15107/rcub_cer_6253 ER -
@conference{ author = "Mladenović, Ivana and Vuksanović, Marija and Obradov, Marko and Jovanov, Vladislav and Vorkapić, Miloš and Nikolić, Nebojša D. and Vasiljević-Radović, Dana", year = "2023", abstract = "In this study, different forms of copper films were electrodeposited (ED) on silicon wafer, copper and brass foils. The effect of monocrystalline Si(111) surface cleaning method and electrodeposition conditions and regimes (frequency in the pulsating current (PC) regime, an addition of additives in electrolyte for the constant galvanostatic (DC) regime, and thickness) on surface morphology and wettability of copper films was investigated. Optical microscopy equipped with highresolution camera, scanning electron microscopy (SEM) and an atomic force microscopy (AFM) were used for thin film characterization and to evaluate wettability of copper films. The sessile drop method was used for the measurement of water contact angle. According to the obtained results, choice of electrolyte used in ED greatly affects wettability of copper films. It was also shown that copper films electrodeposited from basic sulfate electrolyte with varying current regimes frequencies, thicknesses, and cathode types have opposite trends between roughness parameter values and the water contact angle value. Structural-morphological changes of a film or bulk solid surface are key parameters in determining wettability properties and the analysis of the wetting angle oscillations, but not the only one.", publisher = "Society for Electronics, Telecommunications, Computers, Automatic Control and Nuclear Engineering", journal = "Proceedings, X International conference IcETRAN, 05 - 08.06.2023, East Sarajevo, B&H", title = "Wettability of electrodeposited copper films and correlation with morphology and surface chemistry", volume = "MOI1.3-6", pages = "MOI1.3-1", url = "https://hdl.handle.net/21.15107/rcub_cer_6253" }
Mladenović, I., Vuksanović, M., Obradov, M., Jovanov, V., Vorkapić, M., Nikolić, N. D.,& Vasiljević-Radović, D.. (2023). Wettability of electrodeposited copper films and correlation with morphology and surface chemistry. in Proceedings, X International conference IcETRAN, 05 - 08.06.2023, East Sarajevo, B&H Society for Electronics, Telecommunications, Computers, Automatic Control and Nuclear Engineering., MOI1.3-6, MOI1.3-1. https://hdl.handle.net/21.15107/rcub_cer_6253
Mladenović I, Vuksanović M, Obradov M, Jovanov V, Vorkapić M, Nikolić ND, Vasiljević-Radović D. Wettability of electrodeposited copper films and correlation with morphology and surface chemistry. in Proceedings, X International conference IcETRAN, 05 - 08.06.2023, East Sarajevo, B&H. 2023;MOI1.3-6:MOI1.3-1. https://hdl.handle.net/21.15107/rcub_cer_6253 .
Mladenović, Ivana, Vuksanović, Marija, Obradov, Marko, Jovanov, Vladislav, Vorkapić, Miloš, Nikolić, Nebojša D., Vasiljević-Radović, Dana, "Wettability of electrodeposited copper films and correlation with morphology and surface chemistry" in Proceedings, X International conference IcETRAN, 05 - 08.06.2023, East Sarajevo, B&H, MOI1.3-6 (2023):MOI1.3-1, https://hdl.handle.net/21.15107/rcub_cer_6253 .