Microindentation hardness testing of different composite systems with thin electrodeposited nickel and copper films
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Thin Ni and Cu films with fine-grained structures have been electrodeposited from self-made sulphamate-based and sulphate-based electrolytes, respectively. DC electrodeposition of Ni films was performed on single crystal Si wafers with different orientations named (100) and (111), and electrodeposition of Cu films was performed on massive electrodeposited Ni films as the substrates. In order to investigate the influence of the microstructure of the substrates and Ni and Cu thin films on mechanical properties of these composite structures, Vickers microhardness testing for different loads was done. For any composite system of thin film on a substrate, there is a critical indentation depth,1 when a measured hardness value is not the hardness of the electrodeposited film, but the so-called "composite hardness", because the substrate also participates in the plastic deformations during the indentation process. Composite hardness model of Chicot-Lesage was chosen and applied to the experime...ntal data in order to analyse and determine the absolute film hardness. Further analysis of work hardening parameter (t/d)m, that can express the difference in tendency of the composite hardness with the indentation load, was performed for the above-mentioned composite systems.
Keywords:
composite hardness / Vickers microhardness / composite hardness models / electrodeposition / thin films / work hardening parameterSource:
Proceedings - 5th International scientific conference on defensive technologies-proceedings, Belgrade, Serbia, 2012, 570-575Publisher:
- Belgrade : Military Technical Institute
Funding / projects:
- Micro- Nanosystems and Sensors for Electric Power and Process Industry and Environmental Protection (RS-MESTD-Technological Development (TD or TR)-32008)
- Predefined functional properties polymer composite materials processes and equipment development (RS-MESTD-Technological Development (TD or TR)-34011)
- Synthesis, processing and applications of nanostructured multifunctional materials with defined properties (RS-MESTD-Integrated and Interdisciplinary Research (IIR or III)-45019)
- Reinforcement of Regional Microsystems and Nanosystems Centre (EU-FP7-205533)
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IHTMTY - CONF AU - Lamovec, Jelena AU - Jović, Vesna AU - Mladenović, Ivana AU - Sarajlić, Milija AU - Radojević, Vesna PY - 2012 UR - http://www.vti.mod.gov.rs/oteh12/index.htm UR - https://cer.ihtm.bg.ac.rs/handle/123456789/3831 AB - Thin Ni and Cu films with fine-grained structures have been electrodeposited from self-made sulphamate-based and sulphate-based electrolytes, respectively. DC electrodeposition of Ni films was performed on single crystal Si wafers with different orientations named (100) and (111), and electrodeposition of Cu films was performed on massive electrodeposited Ni films as the substrates. In order to investigate the influence of the microstructure of the substrates and Ni and Cu thin films on mechanical properties of these composite structures, Vickers microhardness testing for different loads was done. For any composite system of thin film on a substrate, there is a critical indentation depth,1 when a measured hardness value is not the hardness of the electrodeposited film, but the so-called "composite hardness", because the substrate also participates in the plastic deformations during the indentation process. Composite hardness model of Chicot-Lesage was chosen and applied to the experimental data in order to analyse and determine the absolute film hardness. Further analysis of work hardening parameter (t/d)m, that can express the difference in tendency of the composite hardness with the indentation load, was performed for the above-mentioned composite systems. PB - Belgrade : Military Technical Institute C3 - Proceedings - 5th International scientific conference on defensive technologies-proceedings, Belgrade, Serbia T1 - Microindentation hardness testing of different composite systems with thin electrodeposited nickel and copper films SP - 570 EP - 575 UR - https://hdl.handle.net/21.15107/rcub_cer_3831 ER -
@conference{ author = "Lamovec, Jelena and Jović, Vesna and Mladenović, Ivana and Sarajlić, Milija and Radojević, Vesna", year = "2012", abstract = "Thin Ni and Cu films with fine-grained structures have been electrodeposited from self-made sulphamate-based and sulphate-based electrolytes, respectively. DC electrodeposition of Ni films was performed on single crystal Si wafers with different orientations named (100) and (111), and electrodeposition of Cu films was performed on massive electrodeposited Ni films as the substrates. In order to investigate the influence of the microstructure of the substrates and Ni and Cu thin films on mechanical properties of these composite structures, Vickers microhardness testing for different loads was done. For any composite system of thin film on a substrate, there is a critical indentation depth,1 when a measured hardness value is not the hardness of the electrodeposited film, but the so-called "composite hardness", because the substrate also participates in the plastic deformations during the indentation process. Composite hardness model of Chicot-Lesage was chosen and applied to the experimental data in order to analyse and determine the absolute film hardness. Further analysis of work hardening parameter (t/d)m, that can express the difference in tendency of the composite hardness with the indentation load, was performed for the above-mentioned composite systems.", publisher = "Belgrade : Military Technical Institute", journal = "Proceedings - 5th International scientific conference on defensive technologies-proceedings, Belgrade, Serbia", title = "Microindentation hardness testing of different composite systems with thin electrodeposited nickel and copper films", pages = "570-575", url = "https://hdl.handle.net/21.15107/rcub_cer_3831" }
Lamovec, J., Jović, V., Mladenović, I., Sarajlić, M.,& Radojević, V.. (2012). Microindentation hardness testing of different composite systems with thin electrodeposited nickel and copper films. in Proceedings - 5th International scientific conference on defensive technologies-proceedings, Belgrade, Serbia Belgrade : Military Technical Institute., 570-575. https://hdl.handle.net/21.15107/rcub_cer_3831
Lamovec J, Jović V, Mladenović I, Sarajlić M, Radojević V. Microindentation hardness testing of different composite systems with thin electrodeposited nickel and copper films. in Proceedings - 5th International scientific conference on defensive technologies-proceedings, Belgrade, Serbia. 2012;:570-575. https://hdl.handle.net/21.15107/rcub_cer_3831 .
Lamovec, Jelena, Jović, Vesna, Mladenović, Ivana, Sarajlić, Milija, Radojević, Vesna, "Microindentation hardness testing of different composite systems with thin electrodeposited nickel and copper films" in Proceedings - 5th International scientific conference on defensive technologies-proceedings, Belgrade, Serbia (2012):570-575, https://hdl.handle.net/21.15107/rcub_cer_3831 .