Hardness response and adhesion of thin copper films on alloy substrates
Autori
Mladenović, IvanaLamovec, Jelena
Jović, Vesna
Popović, Bogdan
Vorkapić, Miloš
Radojević, Vesna
Konferencijski prilog (Objavljena verzija)
Metapodaci
Prikaz svih podataka o dokumentuApstrakt
Microhardness test is the most commonly used
method for assessing the mechanical properties of thin films.This testing method uses controlled contact at a single point of an indenter and chosen material which induces the plastic deformation in material under indenter. The measured hardness is considered as the composite hardness, because the substrate
participates in the plastic deformation caused by indentation. This research has been carried out in order to analyze and compare the hardness response of different composite systems consist of monolayer electrodeposited copper thin film on brass and steel alloys as the substrates. The influence of the electrodeposition parameters and of the substrate on the hardness and interlayer adhesion were investigated by Vickers microhardness testing for different load.
Ključne reči:
microhardness / composite system / thin film / adhesion / electrodepositionIzvor:
Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, IcETRAN 2017, Kladovo, Serbia, 2017, MOI1.3.1-MOI1.3.6Izdavač:
- Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering
Finansiranje / projekti:
- Mikro, nano-sistemi i senzori za primenu u elektroprivredi, procesnoj industriji i zaštiti životne sredine (RS-MESTD-Technological Development (TD or TR)-32008)
- Razvoj opreme i procesa dobijanja polimernih kompozitnih materijala sa unapred definisanim funkcionalnim svojstvima (RS-MESTD-Technological Development (TD or TR)-34011)
- Sinteza, razvoj tehnologija dobijanja i primena nanostrukturnih multifunkcionalnih materijala definisanih svojstava (RS-MESTD-Integrated and Interdisciplinary Research (IIR or III)-45019)
Institucija/grupa
IHTMTY - CONF AU - Mladenović, Ivana AU - Lamovec, Jelena AU - Jović, Vesna AU - Popović, Bogdan AU - Vorkapić, Miloš AU - Radojević, Vesna PY - 2017 UR - https://etran.rs/2017/ETRAN/Zbornik_radova/ UR - https://cer.ihtm.bg.ac.rs/handle/123456789/3825 AB - Microhardness test is the most commonly used method for assessing the mechanical properties of thin films.This testing method uses controlled contact at a single point of an indenter and chosen material which induces the plastic deformation in material under indenter. The measured hardness is considered as the composite hardness, because the substrate participates in the plastic deformation caused by indentation. This research has been carried out in order to analyze and compare the hardness response of different composite systems consist of monolayer electrodeposited copper thin film on brass and steel alloys as the substrates. The influence of the electrodeposition parameters and of the substrate on the hardness and interlayer adhesion were investigated by Vickers microhardness testing for different load. PB - Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering C3 - Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, IcETRAN 2017, Kladovo, Serbia T1 - Hardness response and adhesion of thin copper films on alloy substrates SP - MOI1.3.1 EP - MOI1.3.6 UR - https://hdl.handle.net/21.15107/rcub_cer_3825 ER -
@conference{ author = "Mladenović, Ivana and Lamovec, Jelena and Jović, Vesna and Popović, Bogdan and Vorkapić, Miloš and Radojević, Vesna", year = "2017", abstract = "Microhardness test is the most commonly used method for assessing the mechanical properties of thin films.This testing method uses controlled contact at a single point of an indenter and chosen material which induces the plastic deformation in material under indenter. The measured hardness is considered as the composite hardness, because the substrate participates in the plastic deformation caused by indentation. This research has been carried out in order to analyze and compare the hardness response of different composite systems consist of monolayer electrodeposited copper thin film on brass and steel alloys as the substrates. The influence of the electrodeposition parameters and of the substrate on the hardness and interlayer adhesion were investigated by Vickers microhardness testing for different load.", publisher = "Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering", journal = "Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, IcETRAN 2017, Kladovo, Serbia", title = "Hardness response and adhesion of thin copper films on alloy substrates", pages = "MOI1.3.1-MOI1.3.6", url = "https://hdl.handle.net/21.15107/rcub_cer_3825" }
Mladenović, I., Lamovec, J., Jović, V., Popović, B., Vorkapić, M.,& Radojević, V.. (2017). Hardness response and adhesion of thin copper films on alloy substrates. in Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, IcETRAN 2017, Kladovo, Serbia Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering., MOI1.3.1-MOI1.3.6. https://hdl.handle.net/21.15107/rcub_cer_3825
Mladenović I, Lamovec J, Jović V, Popović B, Vorkapić M, Radojević V. Hardness response and adhesion of thin copper films on alloy substrates. in Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, IcETRAN 2017, Kladovo, Serbia. 2017;:MOI1.3.1-MOI1.3.6. https://hdl.handle.net/21.15107/rcub_cer_3825 .
Mladenović, Ivana, Lamovec, Jelena, Jović, Vesna, Popović, Bogdan, Vorkapić, Miloš, Radojević, Vesna, "Hardness response and adhesion of thin copper films on alloy substrates" in Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, IcETRAN 2017, Kladovo, Serbia (2017):MOI1.3.1-MOI1.3.6, https://hdl.handle.net/21.15107/rcub_cer_3825 .