Show simple item record

dc.creatorLamovec, Jelena
dc.creatorJović, Vesna
dc.creatorPopović, Bogdan
dc.creatorVasiljević-Radović, Dana
dc.creatorAleksić, Radoslav
dc.creatorRadojević, Vesna
dc.date.accessioned2019-01-30T17:25:05Z
dc.date.available2019-01-30T17:25:05Z
dc.date.issued2010
dc.identifier.urihttp://cer.ihtm.bg.ac.rs/handle/123456789/755
dc.description.abstractMultilayered composite systems of alternately electrodeposited nanocrystalline Cu and Ni films on cold-rolled microcrystalline copper substrates were fabricated. Highly-densified parallel interfaces which can give rise to high strength of composites are obtained by depositing layers at a very narrow spacing. The mechanical properties of the composite systems were characterized using Vickers microhardness testing with loads ranging from 1.96 N down to 0.049 N. Dependence of microhardness on layer thickness, Ni/Cu layer thickness ratio and total thickness of the film was investigated. The microhardness increased with decreasing the layer thickness down to 30 nm and it is consistent with the Hall-Petch relation. Composite hardness model of Korsunsky was applied to the experimental data in order to determine the composite film hardness. The highest value of all the composite film hardness values was obtained when the ratio of Ni: Cu layer thickness was 4:1.en
dc.relationinfo:eu-repo/grantAgreement/MESTD/MPN2006-2010/11027/RS//
dc.relationinfo:eu-repo/grantAgreement/MESTD/MPN2006-2010/142035/RS//
dc.rightsrestrictedAccess
dc.source27th International Conference on Microelectronics, MIEL 2010 - Proceedings
dc.titleStructural and microhardness characterization of thin electrodeposited Ni/Cu multilayers on copper substratesen
dc.typeconferenceObject
dc.rights.licenseARR
dcterms.abstractРадојевић, В.; Ламовец, Јелена; Васиљевић-Радовић, Дана; Јовић, Весна; Поповић, Богдан; Aлексић, Радослав Р.;
dc.citation.spage213
dc.citation.epage216
dc.citation.other: 213-216
dc.identifier.doi10.1109/MIEL.2010.5490498
dc.identifier.rcubConv_4247
dc.identifier.scopus2-s2.0-77955240918
dc.type.versionpublishedVersion


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record