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Structural and microhardness characterization of thin electrodeposited Ni/Cu multilayers on copper substrates

Samo za registrovane korisnike
2010
Autori
Lamovec, Jelena
Jović, Vesna
Popović, Bogdan
Vasiljević-Radović, Dana
Aleksić, Radoslav
Radojević, Vesna
Konferencijski prilog (Objavljena verzija)
Metapodaci
Prikaz svih podataka o dokumentu
Apstrakt
Multilayered composite systems of alternately electrodeposited nanocrystalline Cu and Ni films on cold-rolled microcrystalline copper substrates were fabricated. Highly-densified parallel interfaces which can give rise to high strength of composites are obtained by depositing layers at a very narrow spacing. The mechanical properties of the composite systems were characterized using Vickers microhardness testing with loads ranging from 1.96 N down to 0.049 N. Dependence of microhardness on layer thickness, Ni/Cu layer thickness ratio and total thickness of the film was investigated. The microhardness increased with decreasing the layer thickness down to 30 nm and it is consistent with the Hall-Petch relation. Composite hardness model of Korsunsky was applied to the experimental data in order to determine the composite film hardness. The highest value of all the composite film hardness values was obtained when the ratio of Ni: Cu layer thickness was 4:1.
Izvor:
27th International Conference on Microelectronics, MIEL 2010 - Proceedings, 2010, 213-216
Finansiranje / projekti:
  • Mikrosistemske, nanosistemske tehnologije i komponente (RS-11027)
  • Dizajniranje nanokristalnih magnetnih materijala tipa (Nd,Pr)FeB i komponenti na bazi smart magnetnih materijala (RS-142035)

DOI: 10.1109/MIEL.2010.5490498

Scopus: 2-s2.0-77955240918
[ Google Scholar ]
2
URI
https://cer.ihtm.bg.ac.rs/handle/123456789/755
Kolekcije
  • Radovi istraživača / Researchers' publications
Institucija/grupa
IHTM
TY  - CONF
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Popović, Bogdan
AU  - Vasiljević-Radović, Dana
AU  - Aleksić, Radoslav
AU  - Radojević, Vesna
PY  - 2010
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/755
AB  - Multilayered composite systems of alternately electrodeposited nanocrystalline Cu and Ni films on cold-rolled microcrystalline copper substrates were fabricated. Highly-densified parallel interfaces which can give rise to high strength of composites are obtained by depositing layers at a very narrow spacing. The mechanical properties of the composite systems were characterized using Vickers microhardness testing with loads ranging from 1.96 N down to 0.049 N. Dependence of microhardness on layer thickness, Ni/Cu layer thickness ratio and total thickness of the film was investigated. The microhardness increased with decreasing the layer thickness down to 30 nm and it is consistent with the Hall-Petch relation. Composite hardness model of Korsunsky was applied to the experimental data in order to determine the composite film hardness. The highest value of all the composite film hardness values was obtained when the ratio of Ni: Cu layer thickness was 4:1.
C3  - 27th International Conference on Microelectronics, MIEL 2010 - Proceedings
T1  - Structural and microhardness characterization of thin electrodeposited Ni/Cu multilayers on copper substrates
SP  - 213
EP  - 216
DO  - 10.1109/MIEL.2010.5490498
ER  - 
@conference{
author = "Lamovec, Jelena and Jović, Vesna and Popović, Bogdan and Vasiljević-Radović, Dana and Aleksić, Radoslav and Radojević, Vesna",
year = "2010",
abstract = "Multilayered composite systems of alternately electrodeposited nanocrystalline Cu and Ni films on cold-rolled microcrystalline copper substrates were fabricated. Highly-densified parallel interfaces which can give rise to high strength of composites are obtained by depositing layers at a very narrow spacing. The mechanical properties of the composite systems were characterized using Vickers microhardness testing with loads ranging from 1.96 N down to 0.049 N. Dependence of microhardness on layer thickness, Ni/Cu layer thickness ratio and total thickness of the film was investigated. The microhardness increased with decreasing the layer thickness down to 30 nm and it is consistent with the Hall-Petch relation. Composite hardness model of Korsunsky was applied to the experimental data in order to determine the composite film hardness. The highest value of all the composite film hardness values was obtained when the ratio of Ni: Cu layer thickness was 4:1.",
journal = "27th International Conference on Microelectronics, MIEL 2010 - Proceedings",
title = "Structural and microhardness characterization of thin electrodeposited Ni/Cu multilayers on copper substrates",
pages = "213-216",
doi = "10.1109/MIEL.2010.5490498"
}
Lamovec, J., Jović, V., Popović, B., Vasiljević-Radović, D., Aleksić, R.,& Radojević, V.. (2010). Structural and microhardness characterization of thin electrodeposited Ni/Cu multilayers on copper substrates. in 27th International Conference on Microelectronics, MIEL 2010 - Proceedings, 213-216.
https://doi.org/10.1109/MIEL.2010.5490498
Lamovec J, Jović V, Popović B, Vasiljević-Radović D, Aleksić R, Radojević V. Structural and microhardness characterization of thin electrodeposited Ni/Cu multilayers on copper substrates. in 27th International Conference on Microelectronics, MIEL 2010 - Proceedings. 2010;:213-216.
doi:10.1109/MIEL.2010.5490498 .
Lamovec, Jelena, Jović, Vesna, Popović, Bogdan, Vasiljević-Radović, Dana, Aleksić, Radoslav, Radojević, Vesna, "Structural and microhardness characterization of thin electrodeposited Ni/Cu multilayers on copper substrates" in 27th International Conference on Microelectronics, MIEL 2010 - Proceedings (2010):213-216,
https://doi.org/10.1109/MIEL.2010.5490498 . .

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