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dc.creatorMilosavljevic, Aleksandra
dc.creatorŽivković, Dragana
dc.creatorManasijević, Dragan
dc.creatorTalijan, Nadežda M.
dc.creatorĆosović, Vladan
dc.creatorGrujić, Aleksandar
dc.creatorMarjanovic, B.
dc.date.accessioned2019-01-30T17:24:00Z
dc.date.available2019-01-30T17:24:00Z
dc.date.issued2010
dc.identifier.issn0268-1900
dc.identifier.urihttp://cer.ihtm.bg.ac.rs/handle/123456789/705
dc.description.abstractThe Sn-In-Me (Me = Ag, Cu) systems belong to the group of potential candidates for lead-free solder materials. Samples, representing two vertical sections: with In : Ag = 7: 3 from Sn-In-Ag ternary system and with Cu: In = 1:9 from Sn-In-Cu ternary system, were measured with Differential Scanning Calorimetry (DSC). The experimental transformation temperatures were compared with CALPHAD-type calculation results based on thermodynamic parameter values from COST531 database. The characterisation of investigated samples was done using Scanning Electron Microscopy with Energy Dispersive X-ray (SEM-EDX), Light Optical Microscopy (LOM), electroconductivity and microhardness measurements.en
dc.publisherInderscience Enterprises Ltd, Geneva
dc.rightsrestrictedAccess
dc.sourceInternational Journal of Materials & Product Technology
dc.subjectlead-free soldersen
dc.subjectphase diagramsen
dc.subjectelectroconductivityen
dc.subjectSn-In-Agen
dc.subjectSn-In-Cuen
dc.titlePhase diagram investigation and characterisation of ternary Sn-In-Me (Me = Ag, Cu) lead-free solder systemsen
dc.typearticle
dc.rights.licenseARR
dcterms.abstractТалијан, Надежда М.; Марјановиц, Б.; Милосављевиц, Aлександра; Грујић, Aлександар; Манасијевиц, Драган; Зивковиц, Драгана; Ћосовић, Владан;
dc.citation.volume39
dc.citation.issue1-2
dc.citation.spage95
dc.citation.epage107
dc.citation.other39(1-2): 95-107
dc.citation.rankM23
dc.identifier.doi10.1504/IJMPT.2010.034263
dc.identifier.rcubConv_2543
dc.identifier.scopus2-s2.0-77955193373
dc.identifier.wos000281373100009
dc.type.versionpublishedVersion


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