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Phase diagram investigation and characterisation of ternary Sn-In-Me (Me = Ag, Cu) lead-free solder systems

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2010
Authors
Milosavljevic, Aleksandra
Živković, Dragana
Manasijević, Dragan
Talijan, Nadežda M.
Ćosović, Vladan
Grujić, Aleksandar
Marjanovic, B.
Article (Published version)
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Abstract
The Sn-In-Me (Me = Ag, Cu) systems belong to the group of potential candidates for lead-free solder materials. Samples, representing two vertical sections: with In : Ag = 7: 3 from Sn-In-Ag ternary system and with Cu: In = 1:9 from Sn-In-Cu ternary system, were measured with Differential Scanning Calorimetry (DSC). The experimental transformation temperatures were compared with CALPHAD-type calculation results based on thermodynamic parameter values from COST531 database. The characterisation of investigated samples was done using Scanning Electron Microscopy with Energy Dispersive X-ray (SEM-EDX), Light Optical Microscopy (LOM), electroconductivity and microhardness measurements.
Keywords:
lead-free solders / phase diagrams / electroconductivity / Sn-In-Ag / Sn-In-Cu
Source:
International Journal of Materials & Product Technology, 2010, 39, 1-2, 95-107
Publisher:
  • Inderscience Enterprises Ltd, Geneva

DOI: 10.1504/IJMPT.2010.034263

ISSN: 0268-1900

WoS: 000281373100009

Scopus: 2-s2.0-77955193373
[ Google Scholar ]
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URI
http://cer.ihtm.bg.ac.rs/handle/123456789/705
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