The Sn-In-Me (Me = Ag, Cu) systems belong to the group of potential candidates for lead-free solder materials. Samples, representing two vertical sections: with In : Ag = 7: 3 from Sn-In-Ag ternary system and with Cu: In = 1:9 from Sn-In-Cu ternary system, were measured with Differential Scanning Calorimetry (DSC). The experimental transformation temperatures were compared with CALPHAD-type calculation results based on thermodynamic parameter values from COST531 database. The characterisation of investigated samples was done using Scanning Electron Microscopy with Energy Dispersive X-ray (SEM-EDX), Light Optical Microscopy (LOM), electroconductivity and microhardness measurements.
TY - JOUR
AU - Milosavljevic, Aleksandra
AU - Živković, Dragana
AU - Manasijević, Dragan
AU - Talijan, Nadežda M.
AU - Ćosović, Vladan
AU - Grujić, Aleksandar
AU - Marjanovic, B.
PY - 2010
UR - https://cer.ihtm.bg.ac.rs/handle/123456789/705
AB - The Sn-In-Me (Me = Ag, Cu) systems belong to the group of potential candidates for lead-free solder materials. Samples, representing two vertical sections: with In : Ag = 7: 3 from Sn-In-Ag ternary system and with Cu: In = 1:9 from Sn-In-Cu ternary system, were measured with Differential Scanning Calorimetry (DSC). The experimental transformation temperatures were compared with CALPHAD-type calculation results based on thermodynamic parameter values from COST531 database. The characterisation of investigated samples was done using Scanning Electron Microscopy with Energy Dispersive X-ray (SEM-EDX), Light Optical Microscopy (LOM), electroconductivity and microhardness measurements.
PB - Inderscience Enterprises Ltd, Geneva
T2 - International Journal of Materials & Product Technology
T1 - Phase diagram investigation and characterisation of ternary Sn-In-Me (Me = Ag, Cu) lead-free solder systems
VL - 39
IS - 1-2
SP - 95
EP - 107
DO - 10.1504/IJMPT.2010.034263
UR - Conv_2543
ER -
@article{
author = "Milosavljevic, Aleksandra and Živković, Dragana and Manasijević, Dragan and Talijan, Nadežda M. and Ćosović, Vladan and Grujić, Aleksandar and Marjanovic, B.",
year = "2010",
abstract = "The Sn-In-Me (Me = Ag, Cu) systems belong to the group of potential candidates for lead-free solder materials. Samples, representing two vertical sections: with In : Ag = 7: 3 from Sn-In-Ag ternary system and with Cu: In = 1:9 from Sn-In-Cu ternary system, were measured with Differential Scanning Calorimetry (DSC). The experimental transformation temperatures were compared with CALPHAD-type calculation results based on thermodynamic parameter values from COST531 database. The characterisation of investigated samples was done using Scanning Electron Microscopy with Energy Dispersive X-ray (SEM-EDX), Light Optical Microscopy (LOM), electroconductivity and microhardness measurements.",
publisher = "Inderscience Enterprises Ltd, Geneva",
journal = "International Journal of Materials & Product Technology",
title = "Phase diagram investigation and characterisation of ternary Sn-In-Me (Me = Ag, Cu) lead-free solder systems",
volume = "39",
number = "1-2",
pages = "95-107",
doi = "10.1504/IJMPT.2010.034263",
url = "Conv_2543"
}
Milosavljevic, A., Živković, D., Manasijević, D., Talijan, N. M., Ćosović, V., Grujić, A.,& Marjanovic, B.. (2010). Phase diagram investigation and characterisation of ternary Sn-In-Me (Me = Ag, Cu) lead-free solder systems. in International Journal of Materials & Product Technology
Inderscience Enterprises Ltd, Geneva., 39(1-2), 95-107.
https://doi.org/10.1504/IJMPT.2010.034263
Conv_2543
Milosavljevic A, Živković D, Manasijević D, Talijan NM, Ćosović V, Grujić A, Marjanovic B. Phase diagram investigation and characterisation of ternary Sn-In-Me (Me = Ag, Cu) lead-free solder systems. in International Journal of Materials & Product Technology. 2010;39(1-2):95-107.
doi:10.1504/IJMPT.2010.034263
Conv_2543 .
Milosavljevic, Aleksandra, Živković, Dragana, Manasijević, Dragan, Talijan, Nadežda M., Ćosović, Vladan, Grujić, Aleksandar, Marjanovic, B., "Phase diagram investigation and characterisation of ternary Sn-In-Me (Me = Ag, Cu) lead-free solder systems" in International Journal of Materials & Product Technology, 39, no. 1-2 (2010):95-107,
https://doi.org/10.1504/IJMPT.2010.034263 .,
Conv_2543 .
