Phase diagram investigation and characterisation of ternary Sn-In-Me (Me = Ag, Cu) lead-free solder systems
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Talijan, Nadežda M.
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The Sn-In-Me (Me = Ag, Cu) systems belong to the group of potential candidates for lead-free solder materials. Samples, representing two vertical sections: with In : Ag = 7: 3 from Sn-In-Ag ternary system and with Cu: In = 1:9 from Sn-In-Cu ternary system, were measured with Differential Scanning Calorimetry (DSC). The experimental transformation temperatures were compared with CALPHAD-type calculation results based on thermodynamic parameter values from COST531 database. The characterisation of investigated samples was done using Scanning Electron Microscopy with Energy Dispersive X-ray (SEM-EDX), Light Optical Microscopy (LOM), electroconductivity and microhardness measurements.
Keywords:lead-free solders / phase diagrams / electroconductivity / Sn-In-Ag / Sn-In-Cu
Source:International Journal of Materials & Product Technology, 2010, 39, 1-2, 95-107
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