Phase diagram investigation and characterisation of ternary Sn-In-Me (Me = Ag, Cu) lead-free solder systems

Abstract

The Sn-In-Me (Me = Ag, Cu) systems belong to the group of potential candidates for lead-free solder materials. Samples, representing two vertical sections: with In : Ag = 7: 3 from Sn-In-Ag ternary system and with Cu: In = 1:9 from Sn-In-Cu ternary system, were measured with Differential Scanning Calorimetry (DSC). The experimental transformation temperatures were compared with CALPHAD-type calculation results based on thermodynamic parameter values from COST531 database. The characterisation of investigated samples was done using Scanning Electron Microscopy with Energy Dispersive X-ray (SEM-EDX), Light Optical Microscopy (LOM), electroconductivity and microhardness measurements.