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Textile SIW structures without via holes using self-adhesive conductive tapes

dc.creatorNešić, Dušan
dc.creatorTanasković, Dragan
dc.creatorVorkapić, Miloš
dc.date.accessioned2023-11-01T11:58:39Z
dc.date.available2023-11-01T11:58:39Z
dc.date.issued2023
dc.identifier.isbn979-8-3503-4701-2
dc.identifier.urihttps://cer.ihtm.bg.ac.rs/handle/123456789/6802
dc.description.abstractThe paper presents the use of conductive selfadhesive tapes with conductive adhesive to modify microstrip lines on textiles and create substrate-integrated waveguides (SIW). The SIW structure is without via holes and use tapes with conductive adhesive for shorting edges. Half-mode SIW is chosen as better option. Filter is constructed on half-mode SIW and also modified with tapes with conductive adhesive.sr
dc.language.isoensr
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)sr
dc.publisherNiš, Serbia : Faculty of Electronic Engineering, University of Nišsr
dc.relationinfo:eu-repo/grantAgreement/MESTD/inst-2020/200026/RS//sr
dc.rightsrestrictedAccesssr
dc.sourceProceedings of papers - 16th International Conference on Advanced Technologies, Systems and Services in Telecommunications, TELSIKS 2023, October 25 - 27, 2023, Niš, Serbiasr
dc.subjectMicrowave on textilessr
dc.subjectSIW-Substrate Integrated Waveguidesr
dc.subjectShort-circuited edgesr
dc.subjectSelf-adhesive conductive tapessr
dc.titleTextile SIW structures without via holes using self-adhesive conductive tapessr
dc.typeconferenceObjectsr
dc.rights.licenseARRsr
dc.citation.spage37
dc.citation.epage39
dc.citation.rankM63
dc.identifier.rcubhttps://hdl.handle.net/21.15107/rcub_cer_6802
dc.type.versionpublishedVersionsr


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