Textile SIW structures without via holes using self-adhesive conductive tapes
Abstract
The paper presents the use of conductive selfadhesive
tapes with conductive adhesive to modify microstrip
lines on textiles and create substrate-integrated waveguides
(SIW). The SIW structure is without via holes and use tapes with
conductive adhesive for shorting edges. Half-mode SIW is chosen
as better option. Filter is constructed on half-mode SIW and also
modified with tapes with conductive adhesive.
Keywords:
Microwave on textiles / SIW-Substrate Integrated Waveguide / Short-circuited edge / Self-adhesive conductive tapesSource:
Proceedings of papers - 16th International Conference on Advanced Technologies, Systems and Services in Telecommunications, TELSIKS 2023, October 25 - 27, 2023, Niš, Serbia, 2023, 37-39Publisher:
- Institute of Electrical and Electronics Engineers (IEEE)
- Niš, Serbia : Faculty of Electronic Engineering, University of Niš
Funding / projects:
- Ministry of Science, Technological Development and Innovation of the Republic of Serbia, institutional funding - 200026 (University of Belgrade, Institute of Chemistry, Technology and Metallurgy - IChTM) (RS-MESTD-inst-2020-200026)
Collections
Institution/Community
IHTMTY - CONF AU - Nešić, Dušan AU - Tanasković, Dragan AU - Vorkapić, Miloš PY - 2023 UR - https://cer.ihtm.bg.ac.rs/handle/123456789/6802 AB - The paper presents the use of conductive selfadhesive tapes with conductive adhesive to modify microstrip lines on textiles and create substrate-integrated waveguides (SIW). The SIW structure is without via holes and use tapes with conductive adhesive for shorting edges. Half-mode SIW is chosen as better option. Filter is constructed on half-mode SIW and also modified with tapes with conductive adhesive. PB - Institute of Electrical and Electronics Engineers (IEEE) PB - Niš, Serbia : Faculty of Electronic Engineering, University of Niš C3 - Proceedings of papers - 16th International Conference on Advanced Technologies, Systems and Services in Telecommunications, TELSIKS 2023, October 25 - 27, 2023, Niš, Serbia T1 - Textile SIW structures without via holes using self-adhesive conductive tapes SP - 37 EP - 39 UR - https://hdl.handle.net/21.15107/rcub_cer_6802 ER -
@conference{ author = "Nešić, Dušan and Tanasković, Dragan and Vorkapić, Miloš", year = "2023", abstract = "The paper presents the use of conductive selfadhesive tapes with conductive adhesive to modify microstrip lines on textiles and create substrate-integrated waveguides (SIW). The SIW structure is without via holes and use tapes with conductive adhesive for shorting edges. Half-mode SIW is chosen as better option. Filter is constructed on half-mode SIW and also modified with tapes with conductive adhesive.", publisher = "Institute of Electrical and Electronics Engineers (IEEE), Niš, Serbia : Faculty of Electronic Engineering, University of Niš", journal = "Proceedings of papers - 16th International Conference on Advanced Technologies, Systems and Services in Telecommunications, TELSIKS 2023, October 25 - 27, 2023, Niš, Serbia", title = "Textile SIW structures without via holes using self-adhesive conductive tapes", pages = "37-39", url = "https://hdl.handle.net/21.15107/rcub_cer_6802" }
Nešić, D., Tanasković, D.,& Vorkapić, M.. (2023). Textile SIW structures without via holes using self-adhesive conductive tapes. in Proceedings of papers - 16th International Conference on Advanced Technologies, Systems and Services in Telecommunications, TELSIKS 2023, October 25 - 27, 2023, Niš, Serbia Institute of Electrical and Electronics Engineers (IEEE)., 37-39. https://hdl.handle.net/21.15107/rcub_cer_6802
Nešić D, Tanasković D, Vorkapić M. Textile SIW structures without via holes using self-adhesive conductive tapes. in Proceedings of papers - 16th International Conference on Advanced Technologies, Systems and Services in Telecommunications, TELSIKS 2023, October 25 - 27, 2023, Niš, Serbia. 2023;:37-39. https://hdl.handle.net/21.15107/rcub_cer_6802 .
Nešić, Dušan, Tanasković, Dragan, Vorkapić, Miloš, "Textile SIW structures without via holes using self-adhesive conductive tapes" in Proceedings of papers - 16th International Conference on Advanced Technologies, Systems and Services in Telecommunications, TELSIKS 2023, October 25 - 27, 2023, Niš, Serbia (2023):37-39, https://hdl.handle.net/21.15107/rcub_cer_6802 .