Preparation and mechanical characterization of copper thin films with additives on alloy substrates

Abstract

Thin copper films have various application in the electronic industry for the fabrication of contacts in integrated circuits. Copper electroplating has been widely employed for fabricating the wires of printed circuit boards (PCBs) , sidewall metallization of the microvia and through hole in the fabrication of multilayer PCBs [1] . Along with electrodeposited thin Ni films, they may be considered as laminate composite structures with good mechanical properties such as high hardness and tensile strength, which is especially important for the MEMS structures fabrication [2-4].