Preparation and mechanical characterization of copper thin films with additives on alloy substrates
2017
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Authors
Mladenović, IvanaLamovec, Jelena
Jović, Vesna
Obradov, Marko
Popović, Bogdan
Vorkapić, Miloš
Radojević, Vesna
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Thin copper films have various application in the electronic industry for the fabrication of
contacts in integrated circuits. Copper electroplating has been widely employed for
fabricating the wires of printed circuit boards (PCBs) , sidewall metallization of the microvia
and through hole in the fabrication of multilayer PCBs [1] . Along with electrodeposited thin
Ni films, they may be considered as laminate composite structures with good mechanical
properties such as high hardness and tensile strength, which is especially important for the
MEMS structures fabrication [2-4].
Keywords:
electrodeposition / thin film / composite system / microhardnessSource:
Book of Abstracts - COST MP1402 Scientific Workshop "ALD and related ultra-thin film processes for advanced devices", 29-30 of August, 2017, Belgrade, Serbia, 2017, 18-19Publisher:
- Belgrade : Institute of Chemistry, Technology and Metallurgy
Funding / projects:
- Dynamics of nonlinear physicochemical and biochemical systems with modeling and predicting of their behavior under nonequilibrium conditions (RS-MESTD-Basic Research (BR or ON)-172015)
- Micro- Nanosystems and Sensors for Electric Power and Process Industry and Environmental Protection (RS-MESTD-Technological Development (TD or TR)-32008)
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IHTMTY - CONF AU - Mladenović, Ivana AU - Lamovec, Jelena AU - Jović, Vesna AU - Obradov, Marko AU - Popović, Bogdan AU - Vorkapić, Miloš AU - Radojević, Vesna PY - 2017 UR - https://cer.ihtm.bg.ac.rs/handle/123456789/5703 AB - Thin copper films have various application in the electronic industry for the fabrication of contacts in integrated circuits. Copper electroplating has been widely employed for fabricating the wires of printed circuit boards (PCBs) , sidewall metallization of the microvia and through hole in the fabrication of multilayer PCBs [1] . Along with electrodeposited thin Ni films, they may be considered as laminate composite structures with good mechanical properties such as high hardness and tensile strength, which is especially important for the MEMS structures fabrication [2-4]. PB - Belgrade : Institute of Chemistry, Technology and Metallurgy C3 - Book of Abstracts - COST MP1402 Scientific Workshop "ALD and related ultra-thin film processes for advanced devices", 29-30 of August, 2017, Belgrade, Serbia T1 - Preparation and mechanical characterization of copper thin films with additives on alloy substrates SP - 18 EP - 19 UR - https://hdl.handle.net/21.15107/rcub_cer_5703 ER -
@conference{ author = "Mladenović, Ivana and Lamovec, Jelena and Jović, Vesna and Obradov, Marko and Popović, Bogdan and Vorkapić, Miloš and Radojević, Vesna", year = "2017", abstract = "Thin copper films have various application in the electronic industry for the fabrication of contacts in integrated circuits. Copper electroplating has been widely employed for fabricating the wires of printed circuit boards (PCBs) , sidewall metallization of the microvia and through hole in the fabrication of multilayer PCBs [1] . Along with electrodeposited thin Ni films, they may be considered as laminate composite structures with good mechanical properties such as high hardness and tensile strength, which is especially important for the MEMS structures fabrication [2-4].", publisher = "Belgrade : Institute of Chemistry, Technology and Metallurgy", journal = "Book of Abstracts - COST MP1402 Scientific Workshop "ALD and related ultra-thin film processes for advanced devices", 29-30 of August, 2017, Belgrade, Serbia", title = "Preparation and mechanical characterization of copper thin films with additives on alloy substrates", pages = "18-19", url = "https://hdl.handle.net/21.15107/rcub_cer_5703" }
Mladenović, I., Lamovec, J., Jović, V., Obradov, M., Popović, B., Vorkapić, M.,& Radojević, V.. (2017). Preparation and mechanical characterization of copper thin films with additives on alloy substrates. in Book of Abstracts - COST MP1402 Scientific Workshop "ALD and related ultra-thin film processes for advanced devices", 29-30 of August, 2017, Belgrade, Serbia Belgrade : Institute of Chemistry, Technology and Metallurgy., 18-19. https://hdl.handle.net/21.15107/rcub_cer_5703
Mladenović I, Lamovec J, Jović V, Obradov M, Popović B, Vorkapić M, Radojević V. Preparation and mechanical characterization of copper thin films with additives on alloy substrates. in Book of Abstracts - COST MP1402 Scientific Workshop "ALD and related ultra-thin film processes for advanced devices", 29-30 of August, 2017, Belgrade, Serbia. 2017;:18-19. https://hdl.handle.net/21.15107/rcub_cer_5703 .
Mladenović, Ivana, Lamovec, Jelena, Jović, Vesna, Obradov, Marko, Popović, Bogdan, Vorkapić, Miloš, Radojević, Vesna, "Preparation and mechanical characterization of copper thin films with additives on alloy substrates" in Book of Abstracts - COST MP1402 Scientific Workshop "ALD and related ultra-thin film processes for advanced devices", 29-30 of August, 2017, Belgrade, Serbia (2017):18-19, https://hdl.handle.net/21.15107/rcub_cer_5703 .