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Fractal Reconstruction of Fiber-reinforced Epoxy Microstructure

Authorized Users Only
2021
Authors
Radović, Ivan M.
Stajčić, Aleksandar
Mitić, Vojislav V.
Serpa, C.
Paunović, V.
Ranđelović, Branislav
Conference object (Published version)
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Abstract
In the past century, the use of polymers and composites with a polymer matrix has expanded to such a level that today it is impossible to imagine life without these materials. Epoxy resin and epoxy-based composites are widely used as construction materials, due to their excellent adhesion, thermal and chemical stability. Fractal nature analysis can provide insight in morphological changes at fiber-matrix interface level, which could give direction for the processing of composites. This mathematical technique can be performed on field emission scanning electron microscopy (FESEM) images, by identifying fiber phase and pores shapes and boundaries, as well as fiber-matrix bonding at the interface. In this study, fiberglass mat was used for the reinforcement of epoxy. FESEM image of enlarged fiber after the composite fracture was used for the reconstruction of data. With the use of affine fractal regression model, software Fractal Real Finder was employed for the reconstruction of fiber sh...ape and the determination of Hausdorff dimension.

Keywords:
Scanning electron microscopy (SEM) / Shape / Epoxy resins / field emission scanning electron microscopy (FESEM) / Polymers / Fractals / Microelectronics
Source:
32nd IEEE International Conference on Microelectronics, MIEL 2021, 2021, 203-206
Publisher:
  • Institute of Electrical and Electronics Engineers Inc.
Funding / projects:
  • Ministry of Education, Science and Technological Development, Republic of Serbia, Grant no. 200017 (University of Belgrade, Institute of Nuclear Sciences 'Vinča', Belgrade-Vinča) (RS-200017)
  • Ministry of Education, Science and Technological Development, Republic of Serbia, Grant no. 200026 (University of Belgrade, Institute of Chemistry, Technology and Metallurgy - IChTM) (RS-200026)
Note:
  • Niš, Serbia, 12-14 Sept. 2021

DOI: 10.1109/MIEL52794.2021.9569054

ISBN: 978-1-6654-4528-3

ISSN: 2159-1679

Scopus: 2-s2.0-85118460333
[ Google Scholar ]
2
URI
https://cer.ihtm.bg.ac.rs/handle/123456789/4843
Collections
  • Radovi istraživača / Researchers' publications
Institution/Community
IHTM
TY  - CONF
AU  - Radović, Ivan M.
AU  - Stajčić, Aleksandar
AU  - Mitić, Vojislav V.
AU  - Serpa, C.
AU  - Paunović, V.
AU  - Ranđelović, Branislav
PY  - 2021
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/4843
AB  - In the past century, the use of polymers and composites with a polymer matrix has expanded to such a level that today it is impossible to imagine life without these materials. Epoxy resin and epoxy-based composites are widely used as construction materials, due to their excellent adhesion, thermal and chemical stability. Fractal nature analysis can provide insight in morphological changes at fiber-matrix interface level, which could give direction for the processing of composites. This mathematical technique can be performed on field emission scanning electron microscopy (FESEM) images, by identifying fiber phase and pores shapes and boundaries, as well as fiber-matrix bonding at the interface. In this study, fiberglass mat was used for the reinforcement of epoxy. FESEM image of enlarged fiber after the composite fracture was used for the reconstruction of data. With the use of affine fractal regression model, software Fractal Real Finder was employed for the reconstruction of fiber shape and the determination of Hausdorff dimension.
PB  - Institute of Electrical and Electronics Engineers Inc.
C3  - 32nd IEEE International Conference on Microelectronics, MIEL 2021
T1  - Fractal Reconstruction of Fiber-reinforced Epoxy Microstructure
SP  - 203
EP  - 206
DO  - 10.1109/MIEL52794.2021.9569054
ER  - 
@conference{
author = "Radović, Ivan M. and Stajčić, Aleksandar and Mitić, Vojislav V. and Serpa, C. and Paunović, V. and Ranđelović, Branislav",
year = "2021",
abstract = "In the past century, the use of polymers and composites with a polymer matrix has expanded to such a level that today it is impossible to imagine life without these materials. Epoxy resin and epoxy-based composites are widely used as construction materials, due to their excellent adhesion, thermal and chemical stability. Fractal nature analysis can provide insight in morphological changes at fiber-matrix interface level, which could give direction for the processing of composites. This mathematical technique can be performed on field emission scanning electron microscopy (FESEM) images, by identifying fiber phase and pores shapes and boundaries, as well as fiber-matrix bonding at the interface. In this study, fiberglass mat was used for the reinforcement of epoxy. FESEM image of enlarged fiber after the composite fracture was used for the reconstruction of data. With the use of affine fractal regression model, software Fractal Real Finder was employed for the reconstruction of fiber shape and the determination of Hausdorff dimension.",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
journal = "32nd IEEE International Conference on Microelectronics, MIEL 2021",
title = "Fractal Reconstruction of Fiber-reinforced Epoxy Microstructure",
pages = "203-206",
doi = "10.1109/MIEL52794.2021.9569054"
}
Radović, I. M., Stajčić, A., Mitić, V. V., Serpa, C., Paunović, V.,& Ranđelović, B.. (2021). Fractal Reconstruction of Fiber-reinforced Epoxy Microstructure. in 32nd IEEE International Conference on Microelectronics, MIEL 2021
Institute of Electrical and Electronics Engineers Inc.., 203-206.
https://doi.org/10.1109/MIEL52794.2021.9569054
Radović IM, Stajčić A, Mitić VV, Serpa C, Paunović V, Ranđelović B. Fractal Reconstruction of Fiber-reinforced Epoxy Microstructure. in 32nd IEEE International Conference on Microelectronics, MIEL 2021. 2021;:203-206.
doi:10.1109/MIEL52794.2021.9569054 .
Radović, Ivan M., Stajčić, Aleksandar, Mitić, Vojislav V., Serpa, C., Paunović, V., Ranđelović, Branislav, "Fractal Reconstruction of Fiber-reinforced Epoxy Microstructure" in 32nd IEEE International Conference on Microelectronics, MIEL 2021 (2021):203-206,
https://doi.org/10.1109/MIEL52794.2021.9569054 . .

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