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Structural, Electrical and Mechanical Behavior of Thin Copper Coatings Obtained by Various Electrodeposition Processes
dc.creator | Mladenović, Ivana | |
dc.creator | Bošković, Marko | |
dc.creator | Lamovec, Jelena | |
dc.creator | Vuksanović, Marija M. | |
dc.creator | Nikolić, Nebojša D. | |
dc.creator | Radojević, Vesna | |
dc.creator | Vasiljević-Radović, Dana | |
dc.date.accessioned | 2021-11-15T23:31:14Z | |
dc.date.available | 2021-11-15T23:31:14Z | |
dc.date.issued | 2021 | |
dc.identifier.isbn | 978-1-6654-4528-3 | |
dc.identifier.isbn | 978-1-6654-4529-0 | |
dc.identifier.issn | 2159-1679 | |
dc.identifier.issn | 2159-1660 | |
dc.identifier.uri | https://cer.ihtm.bg.ac.rs/handle/123456789/4841 | |
dc.description.abstract | Electrochemically deposited copper coatings obtained from sulfate baths on brass substrates in the regime of direct current (DC) with and without an application of ultrasound mixing of electrolytes (DC/US) have been studied. The aim of the research was analysis of the influence of current density, ultrasonic mixing of electrolyte and presence of additives on the electrodeposited coatings, in order to obtain uniform compact coatings suitable for potential application in MEMS devices. Structural, electrical and mechanical behavior of thin copper coatings were investigated using SEM, AFM, four- point probe method and Vickers hardness test. | sr |
dc.language.iso | en | sr |
dc.publisher | Institute of Electrical and Electronics Engineers (IEEE) | sr |
dc.relation | info:eu-repo/grantAgreement/MESTD/inst-2020/200026/RS// | sr |
dc.rights | restrictedAccess | sr |
dc.rights.uri | https://creativecommons.org/licenses/by/4.0/ | |
dc.source | Proceedings - 2021 32nd IEEE International Conference on microelectronics, MIEL 2021 | sr |
dc.subject | Additives | sr |
dc.subject | Ultrasonic imaging | sr |
dc.subject | Electrolytes | sr |
dc.subject | Mechanical factors | sr |
dc.subject | Coatings | sr |
dc.subject | Copper | sr |
dc.subject | Electrochemistry | sr |
dc.subject | MEMS devices | sr |
dc.title | Structural, Electrical and Mechanical Behavior of Thin Copper Coatings Obtained by Various Electrodeposition Processes | sr |
dc.type | conferenceObject | sr |
dc.rights.license | ARR | sr |
dc.citation.spage | 165 | |
dc.citation.epage | 168 | |
dc.description.other | Niš, Serbia, 12-14 Sept. 2021 | sr |
dc.identifier.doi | 10.1109/MIEL52794.2021.9569036 | |
dc.identifier.scopus | 2-s2.0-85118463575 | |
dc.type.version | publishedVersion | sr |