Structural, Electrical and Mechanical Behavior of Thin Copper Coatings Obtained by Various Electrodeposition Processes
Samo za registrovane korisnike
2021
Autori
Mladenović, IvanaBošković, Marko
Lamovec, Jelena
Vuksanović, Marija M.
Nikolić, Nebojša D.
Radojević, Vesna
Vasiljević-Radović, Dana
Konferencijski prilog (Objavljena verzija)
Metapodaci
Prikaz svih podataka o dokumentuApstrakt
Electrochemically deposited copper coatings obtained from sulfate baths on brass substrates in the regime of direct current (DC) with and without an application of ultrasound mixing of electrolytes (DC/US) have been studied. The aim of the research was analysis of the influence of current density, ultrasonic mixing of electrolyte and presence of additives on the electrodeposited coatings, in order to obtain uniform compact coatings suitable for potential application in MEMS devices. Structural, electrical and mechanical behavior of thin copper coatings were investigated using SEM, AFM, four- point probe method and Vickers hardness test.
Ključne reči:
Additives / Ultrasonic imaging / Electrolytes / Mechanical factors / Coatings / Copper / Electrochemistry / MEMS devicesIzvor:
Proceedings - 2021 32nd IEEE International Conference on microelectronics, MIEL 2021, 2021, 165-168Izdavač:
- Institute of Electrical and Electronics Engineers (IEEE)
Finansiranje / projekti:
- Ministarstvo nauke, tehnološkog razvoja i inovacija Republike Srbije, institucionalno finansiranje - 200026 (Univerzitet u Beogradu, Institut za hemiju, tehnologiju i metalurgiju - IHTM) (RS-MESTD-inst-2020-200026)
Napomena:
- Niš, Serbia, 12-14 Sept. 2021
DOI: 10.1109/MIEL52794.2021.9569036
ISBN: 978-1-6654-4528-3
ISSN: 2159-1679; 2159-1660
Scopus: 2-s2.0-85118463575
Institucija/grupa
IHTMTY - CONF AU - Mladenović, Ivana AU - Bošković, Marko AU - Lamovec, Jelena AU - Vuksanović, Marija M. AU - Nikolić, Nebojša D. AU - Radojević, Vesna AU - Vasiljević-Radović, Dana PY - 2021 UR - https://cer.ihtm.bg.ac.rs/handle/123456789/4841 AB - Electrochemically deposited copper coatings obtained from sulfate baths on brass substrates in the regime of direct current (DC) with and without an application of ultrasound mixing of electrolytes (DC/US) have been studied. The aim of the research was analysis of the influence of current density, ultrasonic mixing of electrolyte and presence of additives on the electrodeposited coatings, in order to obtain uniform compact coatings suitable for potential application in MEMS devices. Structural, electrical and mechanical behavior of thin copper coatings were investigated using SEM, AFM, four- point probe method and Vickers hardness test. PB - Institute of Electrical and Electronics Engineers (IEEE) C3 - Proceedings - 2021 32nd IEEE International Conference on microelectronics, MIEL 2021 T1 - Structural, Electrical and Mechanical Behavior of Thin Copper Coatings Obtained by Various Electrodeposition Processes SP - 165 EP - 168 DO - 10.1109/MIEL52794.2021.9569036 ER -
@conference{ author = "Mladenović, Ivana and Bošković, Marko and Lamovec, Jelena and Vuksanović, Marija M. and Nikolić, Nebojša D. and Radojević, Vesna and Vasiljević-Radović, Dana", year = "2021", abstract = "Electrochemically deposited copper coatings obtained from sulfate baths on brass substrates in the regime of direct current (DC) with and without an application of ultrasound mixing of electrolytes (DC/US) have been studied. The aim of the research was analysis of the influence of current density, ultrasonic mixing of electrolyte and presence of additives on the electrodeposited coatings, in order to obtain uniform compact coatings suitable for potential application in MEMS devices. Structural, electrical and mechanical behavior of thin copper coatings were investigated using SEM, AFM, four- point probe method and Vickers hardness test.", publisher = "Institute of Electrical and Electronics Engineers (IEEE)", journal = "Proceedings - 2021 32nd IEEE International Conference on microelectronics, MIEL 2021", title = "Structural, Electrical and Mechanical Behavior of Thin Copper Coatings Obtained by Various Electrodeposition Processes", pages = "165-168", doi = "10.1109/MIEL52794.2021.9569036" }
Mladenović, I., Bošković, M., Lamovec, J., Vuksanović, M. M., Nikolić, N. D., Radojević, V.,& Vasiljević-Radović, D.. (2021). Structural, Electrical and Mechanical Behavior of Thin Copper Coatings Obtained by Various Electrodeposition Processes. in Proceedings - 2021 32nd IEEE International Conference on microelectronics, MIEL 2021 Institute of Electrical and Electronics Engineers (IEEE)., 165-168. https://doi.org/10.1109/MIEL52794.2021.9569036
Mladenović I, Bošković M, Lamovec J, Vuksanović MM, Nikolić ND, Radojević V, Vasiljević-Radović D. Structural, Electrical and Mechanical Behavior of Thin Copper Coatings Obtained by Various Electrodeposition Processes. in Proceedings - 2021 32nd IEEE International Conference on microelectronics, MIEL 2021. 2021;:165-168. doi:10.1109/MIEL52794.2021.9569036 .
Mladenović, Ivana, Bošković, Marko, Lamovec, Jelena, Vuksanović, Marija M., Nikolić, Nebojša D., Radojević, Vesna, Vasiljević-Radović, Dana, "Structural, Electrical and Mechanical Behavior of Thin Copper Coatings Obtained by Various Electrodeposition Processes" in Proceedings - 2021 32nd IEEE International Conference on microelectronics, MIEL 2021 (2021):165-168, https://doi.org/10.1109/MIEL52794.2021.9569036 . .