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Structural, Electrical and Mechanical Behavior of Thin Copper Coatings Obtained by Various Electrodeposition Processes

Authorized Users Only
2021
Authors
Mladenović, Ivana
Bošković, Marko
Lamovec, Jelena
Vuksanović, Marija M.
Nikolić, Nebojša D.
Radojević, Vesna
Vasiljević-Radović, Dana
Conference object (Published version)
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Abstract
Electrochemically deposited copper coatings obtained from sulfate baths on brass substrates in the regime of direct current (DC) with and without an application of ultrasound mixing of electrolytes (DC/US) have been studied. The aim of the research was analysis of the influence of current density, ultrasonic mixing of electrolyte and presence of additives on the electrodeposited coatings, in order to obtain uniform compact coatings suitable for potential application in MEMS devices. Structural, electrical and mechanical behavior of thin copper coatings were investigated using SEM, AFM, four- point probe method and Vickers hardness test.
Keywords:
Additives / Ultrasonic imaging / Electrolytes / Mechanical factors / Coatings / Copper / Electrochemistry / MEMS devices
Source:
Proceedings - 2021 32nd IEEE International Conference on microelectronics, MIEL 2021, 2021, 165-168
Publisher:
  • Institute of Electrical and Electronics Engineers (IEEE)
Funding / projects:
  • Ministry of Education, Science and Technological Development, Republic of Serbia, Grant no. 200026 (University of Belgrade, Institute of Chemistry, Technology and Metallurgy - IChTM) (RS-200026)
Note:
  • Niš, Serbia, 12-14 Sept. 2021

DOI: 10.1109/MIEL52794.2021.9569036

ISBN: 978-1-6654-4528-3

ISSN: 2159-1679; 2159-1660

Scopus: 2-s2.0-85118463575
[ Google Scholar ]
1
URI
https://cer.ihtm.bg.ac.rs/handle/123456789/4841
Collections
  • Radovi istraživača / Researchers' publications
Institution/Community
IHTM
TY  - CONF
AU  - Mladenović, Ivana
AU  - Bošković, Marko
AU  - Lamovec, Jelena
AU  - Vuksanović, Marija M.
AU  - Nikolić, Nebojša D.
AU  - Radojević, Vesna
AU  - Vasiljević-Radović, Dana
PY  - 2021
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/4841
AB  - Electrochemically deposited copper coatings obtained from sulfate baths on brass substrates in the regime of direct current (DC) with and without an application of ultrasound mixing of electrolytes (DC/US) have been studied. The aim of the research was analysis of the influence of current density, ultrasonic mixing of electrolyte and presence of additives on the electrodeposited coatings, in order to obtain uniform compact coatings suitable for potential application in MEMS devices. Structural, electrical and mechanical behavior of thin copper coatings were investigated using SEM, AFM, four- point probe method and Vickers hardness test.
PB  - Institute of Electrical and Electronics Engineers (IEEE)
C3  - Proceedings - 2021 32nd IEEE International Conference on microelectronics, MIEL 2021
T1  - Structural, Electrical and Mechanical Behavior of Thin Copper Coatings Obtained by Various Electrodeposition Processes
SP  - 165
EP  - 168
DO  - 10.1109/MIEL52794.2021.9569036
ER  - 
@conference{
author = "Mladenović, Ivana and Bošković, Marko and Lamovec, Jelena and Vuksanović, Marija M. and Nikolić, Nebojša D. and Radojević, Vesna and Vasiljević-Radović, Dana",
year = "2021",
abstract = "Electrochemically deposited copper coatings obtained from sulfate baths on brass substrates in the regime of direct current (DC) with and without an application of ultrasound mixing of electrolytes (DC/US) have been studied. The aim of the research was analysis of the influence of current density, ultrasonic mixing of electrolyte and presence of additives on the electrodeposited coatings, in order to obtain uniform compact coatings suitable for potential application in MEMS devices. Structural, electrical and mechanical behavior of thin copper coatings were investigated using SEM, AFM, four- point probe method and Vickers hardness test.",
publisher = "Institute of Electrical and Electronics Engineers (IEEE)",
journal = "Proceedings - 2021 32nd IEEE International Conference on microelectronics, MIEL 2021",
title = "Structural, Electrical and Mechanical Behavior of Thin Copper Coatings Obtained by Various Electrodeposition Processes",
pages = "165-168",
doi = "10.1109/MIEL52794.2021.9569036"
}
Mladenović, I., Bošković, M., Lamovec, J., Vuksanović, M. M., Nikolić, N. D., Radojević, V.,& Vasiljević-Radović, D.. (2021). Structural, Electrical and Mechanical Behavior of Thin Copper Coatings Obtained by Various Electrodeposition Processes. in Proceedings - 2021 32nd IEEE International Conference on microelectronics, MIEL 2021
Institute of Electrical and Electronics Engineers (IEEE)., 165-168.
https://doi.org/10.1109/MIEL52794.2021.9569036
Mladenović I, Bošković M, Lamovec J, Vuksanović MM, Nikolić ND, Radojević V, Vasiljević-Radović D. Structural, Electrical and Mechanical Behavior of Thin Copper Coatings Obtained by Various Electrodeposition Processes. in Proceedings - 2021 32nd IEEE International Conference on microelectronics, MIEL 2021. 2021;:165-168.
doi:10.1109/MIEL52794.2021.9569036 .
Mladenović, Ivana, Bošković, Marko, Lamovec, Jelena, Vuksanović, Marija M., Nikolić, Nebojša D., Radojević, Vesna, Vasiljević-Radović, Dana, "Structural, Electrical and Mechanical Behavior of Thin Copper Coatings Obtained by Various Electrodeposition Processes" in Proceedings - 2021 32nd IEEE International Conference on microelectronics, MIEL 2021 (2021):165-168,
https://doi.org/10.1109/MIEL52794.2021.9569036 . .

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