A very low impedance circuit was constructed in order to provide a pulsating cathodic potential for a copper electrode immersed in a copper sulphate solution of the type used in copper refining. The increase in surface roughness during a fixed period of plating was investigated as a function of the frequency of pulsation. It was established that the relative increase in surface roughness depended linearly on the square root of the reciprocal frequency. This is in accordance with the theory based on the model of amplification of surface roughness being a transport controlled phenomenon.
TY - JOUR
AU - Savić Maglić, G.
AU - Despić, A.R.
PY - 1973
UR - https://cer.ihtm.bg.ac.rs/handle/123456789/4717
AB - A very low impedance circuit was constructed in order to provide a pulsating cathodic potential for a copper electrode immersed in a copper sulphate solution of the type used in copper refining. The increase in surface roughness during a fixed period of plating was investigated as a function of the frequency of pulsation. It was established that the relative increase in surface roughness depended linearly on the square root of the reciprocal frequency. This is in accordance with the theory based on the model of amplification of surface roughness being a transport controlled phenomenon.
PB - Elsevier
T2 - Electrodeposition and Surface Treatments
T1 - Pulsating potential electrolysis in the deposition of copper
VL - 1
IS - 6
SP - 429
EP - 438
DO - 10.1016/0300-9416(73)90026-6
ER -
@article{
author = "Savić Maglić, G. and Despić, A.R.",
year = "1973",
abstract = "A very low impedance circuit was constructed in order to provide a pulsating cathodic potential for a copper electrode immersed in a copper sulphate solution of the type used in copper refining. The increase in surface roughness during a fixed period of plating was investigated as a function of the frequency of pulsation. It was established that the relative increase in surface roughness depended linearly on the square root of the reciprocal frequency. This is in accordance with the theory based on the model of amplification of surface roughness being a transport controlled phenomenon.",
publisher = "Elsevier",
journal = "Electrodeposition and Surface Treatments",
title = "Pulsating potential electrolysis in the deposition of copper",
volume = "1",
number = "6",
pages = "429-438",
doi = "10.1016/0300-9416(73)90026-6"
}
Savić Maglić, G.,& Despić, A.R.. (1973). Pulsating potential electrolysis in the deposition of copper. in Electrodeposition and Surface Treatments
Elsevier., 1(6), 429-438.
https://doi.org/10.1016/0300-9416(73)90026-6
Savić Maglić G, Despić A. Pulsating potential electrolysis in the deposition of copper. in Electrodeposition and Surface Treatments. 1973;1(6):429-438.
doi:10.1016/0300-9416(73)90026-6 .
Savić Maglić, G., Despić, A.R., "Pulsating potential electrolysis in the deposition of copper" in Electrodeposition and Surface Treatments, 1, no. 6 (1973):429-438,
https://doi.org/10.1016/0300-9416(73)90026-6 . .
