Identification of intermetallic compounds in thin layers of electrodeposited Cu–Cd alloys using electrochemical techniques
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1991
Authors
Jović, Vladimir D.Spaić, Savo
Despić, Aleksandar R.
Stevanović, Jasmina S.
Pristavec, Matjaž
Article (Published version)
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An attempt was made to analyse the phase structure of thin layers of electrodeposited Cu–Cd alloys using anodic linear sweep voltammetry combined with a potentiostatic pulse technique (ALSV–PPT). The results were compared with data obtained using conventional techniques for phase structure analysis. It was found that application of the conventional X-ray technique (Guinier analysis) is limited, because the grain size of the alloy constituents is too small for compounds to be revealed by X-ray peaks. Electrodeposited alloys could be successfully analysed using that method only after subsequent thermal treatment. Diffraction patterns from transmission electron micrographs of very thin foils (of the order of 20–50 nm) of electrodeposited 75Cd–25Cu (at.-%) alloy revealed the presence of CuCd3 intermetallic compound having a grain size of ~20 nm. By comparing all the results, the distribution of the various intermetallic compounds present at various stages in the electrodeposition of thin (...up to 10 μm) layers of Cu–Cd alloys could be established. Combined ALSV–PPT was found to be more sensitive than either of the other methods employed. MST/1206.
Keywords:
anodic linear sweep voltammetry / Electrochemistry / Copper Cadmium Alloys / potentiostatic pulse technique / ElectrodepositionSource:
Materials Science and Technology, 1991, 7, 11, 1021-1030Publisher:
- USA :Taylor & Francis INC
DOI: 10.1179/mst.1991.7.11.1021
ISSN: 0267-0836; 1743-2847
Scopus: 2-s2.0-0026258978
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IHTMTY - JOUR AU - Jović, Vladimir D. AU - Spaić, Savo AU - Despić, Aleksandar R. AU - Stevanović, Jasmina S. AU - Pristavec, Matjaž PY - 1991 UR - https://cer.ihtm.bg.ac.rs/handle/123456789/4363 AB - An attempt was made to analyse the phase structure of thin layers of electrodeposited Cu–Cd alloys using anodic linear sweep voltammetry combined with a potentiostatic pulse technique (ALSV–PPT). The results were compared with data obtained using conventional techniques for phase structure analysis. It was found that application of the conventional X-ray technique (Guinier analysis) is limited, because the grain size of the alloy constituents is too small for compounds to be revealed by X-ray peaks. Electrodeposited alloys could be successfully analysed using that method only after subsequent thermal treatment. Diffraction patterns from transmission electron micrographs of very thin foils (of the order of 20–50 nm) of electrodeposited 75Cd–25Cu (at.-%) alloy revealed the presence of CuCd3 intermetallic compound having a grain size of ~20 nm. By comparing all the results, the distribution of the various intermetallic compounds present at various stages in the electrodeposition of thin (up to 10 μm) layers of Cu–Cd alloys could be established. Combined ALSV–PPT was found to be more sensitive than either of the other methods employed. MST/1206. PB - USA :Taylor & Francis INC T2 - Materials Science and Technology T1 - Identification of intermetallic compounds in thin layers of electrodeposited Cu–Cd alloys using electrochemical techniques VL - 7 IS - 11 SP - 1021 EP - 1030 DO - 10.1179/mst.1991.7.11.1021 ER -
@article{ author = "Jović, Vladimir D. and Spaić, Savo and Despić, Aleksandar R. and Stevanović, Jasmina S. and Pristavec, Matjaž", year = "1991", abstract = "An attempt was made to analyse the phase structure of thin layers of electrodeposited Cu–Cd alloys using anodic linear sweep voltammetry combined with a potentiostatic pulse technique (ALSV–PPT). The results were compared with data obtained using conventional techniques for phase structure analysis. It was found that application of the conventional X-ray technique (Guinier analysis) is limited, because the grain size of the alloy constituents is too small for compounds to be revealed by X-ray peaks. Electrodeposited alloys could be successfully analysed using that method only after subsequent thermal treatment. Diffraction patterns from transmission electron micrographs of very thin foils (of the order of 20–50 nm) of electrodeposited 75Cd–25Cu (at.-%) alloy revealed the presence of CuCd3 intermetallic compound having a grain size of ~20 nm. By comparing all the results, the distribution of the various intermetallic compounds present at various stages in the electrodeposition of thin (up to 10 μm) layers of Cu–Cd alloys could be established. Combined ALSV–PPT was found to be more sensitive than either of the other methods employed. MST/1206.", publisher = "USA :Taylor & Francis INC", journal = "Materials Science and Technology", title = "Identification of intermetallic compounds in thin layers of electrodeposited Cu–Cd alloys using electrochemical techniques", volume = "7", number = "11", pages = "1021-1030", doi = "10.1179/mst.1991.7.11.1021" }
Jović, V. D., Spaić, S., Despić, A. R., Stevanović, J. S.,& Pristavec, M.. (1991). Identification of intermetallic compounds in thin layers of electrodeposited Cu–Cd alloys using electrochemical techniques. in Materials Science and Technology USA :Taylor & Francis INC., 7(11), 1021-1030. https://doi.org/10.1179/mst.1991.7.11.1021
Jović VD, Spaić S, Despić AR, Stevanović JS, Pristavec M. Identification of intermetallic compounds in thin layers of electrodeposited Cu–Cd alloys using electrochemical techniques. in Materials Science and Technology. 1991;7(11):1021-1030. doi:10.1179/mst.1991.7.11.1021 .
Jović, Vladimir D., Spaić, Savo, Despić, Aleksandar R., Stevanović, Jasmina S., Pristavec, Matjaž, "Identification of intermetallic compounds in thin layers of electrodeposited Cu–Cd alloys using electrochemical techniques" in Materials Science and Technology, 7, no. 11 (1991):1021-1030, https://doi.org/10.1179/mst.1991.7.11.1021 . .