CER - Central Repository
Institute of Chemistry, Technology and Metallurgy
    • English
    • Српски
    • Српски (Serbia)
  • English 
    • English
    • Serbian (Cyrillic)
    • Serbian (Latin)
  • Login
View Item 
  •   CER
  • IHTM
  • Radovi istraživača / Researchers' publications
  • View Item
  •   CER
  • IHTM
  • Radovi istraživača / Researchers' publications
  • View Item
JavaScript is disabled for your browser. Some features of this site may not work without it.

Identification of intermetallic compounds in thin layers of electrodeposited Cu–Cd alloys using electrochemical techniques

Authorized Users Only
1991
Authors
Jović, Vladimir D.
Spaić, Savo
Despić, Aleksandar R.
Stevanović, Jasmina S.
Pristavec, Matjaž
Article (Published version)
Metadata
Show full item record
Abstract
An attempt was made to analyse the phase structure of thin layers of electrodeposited Cu–Cd alloys using anodic linear sweep voltammetry combined with a potentiostatic pulse technique (ALSV–PPT). The results were compared with data obtained using conventional techniques for phase structure analysis. It was found that application of the conventional X-ray technique (Guinier analysis) is limited, because the grain size of the alloy constituents is too small for compounds to be revealed by X-ray peaks. Electrodeposited alloys could be successfully analysed using that method only after subsequent thermal treatment. Diffraction patterns from transmission electron micrographs of very thin foils (of the order of 20–50 nm) of electrodeposited 75Cd–25Cu (at.-%) alloy revealed the presence of CuCd3 intermetallic compound having a grain size of ~20 nm. By comparing all the results, the distribution of the various intermetallic compounds present at various stages in the electrodeposition of thin (...up to 10 μm) layers of Cu–Cd alloys could be established. Combined ALSV–PPT was found to be more sensitive than either of the other methods employed. MST/1206.

Keywords:
anodic linear sweep voltammetry / Electrochemistry / Copper Cadmium Alloys / potentiostatic pulse technique / Electrodeposition
Source:
Materials Science and Technology, 1991, 7, 11, 1021-1030
Publisher:
  • USA :Taylor & Francis INC

DOI: 10.1179/mst.1991.7.11.1021

ISSN: 0267-0836; 1743-2847

Scopus: 2-s2.0-0026258978
[ Google Scholar ]
25
URI
https://cer.ihtm.bg.ac.rs/handle/123456789/4363
Collections
  • Radovi istraživača / Researchers' publications
Institution/Community
IHTM
TY  - JOUR
AU  - Jović, Vladimir D.
AU  - Spaić, Savo
AU  - Despić, Aleksandar R.
AU  - Stevanović, Jasmina S.
AU  - Pristavec, Matjaž
PY  - 1991
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/4363
AB  - An attempt was made to analyse the phase structure of thin layers of electrodeposited Cu–Cd alloys using anodic linear sweep voltammetry combined with a potentiostatic pulse technique (ALSV–PPT). The results were compared with data obtained using conventional techniques for phase structure analysis. It was found that application of the conventional X-ray technique (Guinier analysis) is limited, because the grain size of the alloy constituents is too small for compounds to be revealed by X-ray peaks. Electrodeposited alloys could be successfully analysed using that method only after subsequent thermal treatment. Diffraction patterns from transmission electron micrographs of very thin foils (of the order of 20–50 nm) of electrodeposited 75Cd–25Cu (at.-%) alloy revealed the presence of CuCd3 intermetallic compound having a grain size of ~20 nm. By comparing all the results, the distribution of the various intermetallic compounds present at various stages in the electrodeposition of thin (up to 10 μm) layers of Cu–Cd alloys could be established. Combined ALSV–PPT was found to be more sensitive than either of the other methods employed. MST/1206.
PB  - USA :Taylor & Francis INC
T2  - Materials Science and Technology
T1  - Identification of intermetallic compounds in thin layers of electrodeposited Cu–Cd alloys using electrochemical techniques
VL  - 7
IS  - 11
SP  - 1021
EP  - 1030
DO  - 10.1179/mst.1991.7.11.1021
ER  - 
@article{
author = "Jović, Vladimir D. and Spaić, Savo and Despić, Aleksandar R. and Stevanović, Jasmina S. and Pristavec, Matjaž",
year = "1991",
abstract = "An attempt was made to analyse the phase structure of thin layers of electrodeposited Cu–Cd alloys using anodic linear sweep voltammetry combined with a potentiostatic pulse technique (ALSV–PPT). The results were compared with data obtained using conventional techniques for phase structure analysis. It was found that application of the conventional X-ray technique (Guinier analysis) is limited, because the grain size of the alloy constituents is too small for compounds to be revealed by X-ray peaks. Electrodeposited alloys could be successfully analysed using that method only after subsequent thermal treatment. Diffraction patterns from transmission electron micrographs of very thin foils (of the order of 20–50 nm) of electrodeposited 75Cd–25Cu (at.-%) alloy revealed the presence of CuCd3 intermetallic compound having a grain size of ~20 nm. By comparing all the results, the distribution of the various intermetallic compounds present at various stages in the electrodeposition of thin (up to 10 μm) layers of Cu–Cd alloys could be established. Combined ALSV–PPT was found to be more sensitive than either of the other methods employed. MST/1206.",
publisher = "USA :Taylor & Francis INC",
journal = "Materials Science and Technology",
title = "Identification of intermetallic compounds in thin layers of electrodeposited Cu–Cd alloys using electrochemical techniques",
volume = "7",
number = "11",
pages = "1021-1030",
doi = "10.1179/mst.1991.7.11.1021"
}
Jović, V. D., Spaić, S., Despić, A. R., Stevanović, J. S.,& Pristavec, M.. (1991). Identification of intermetallic compounds in thin layers of electrodeposited Cu–Cd alloys using electrochemical techniques. in Materials Science and Technology
USA :Taylor & Francis INC., 7(11), 1021-1030.
https://doi.org/10.1179/mst.1991.7.11.1021
Jović VD, Spaić S, Despić AR, Stevanović JS, Pristavec M. Identification of intermetallic compounds in thin layers of electrodeposited Cu–Cd alloys using electrochemical techniques. in Materials Science and Technology. 1991;7(11):1021-1030.
doi:10.1179/mst.1991.7.11.1021 .
Jović, Vladimir D., Spaić, Savo, Despić, Aleksandar R., Stevanović, Jasmina S., Pristavec, Matjaž, "Identification of intermetallic compounds in thin layers of electrodeposited Cu–Cd alloys using electrochemical techniques" in Materials Science and Technology, 7, no. 11 (1991):1021-1030,
https://doi.org/10.1179/mst.1991.7.11.1021 . .

DSpace software copyright © 2002-2015  DuraSpace
About CeR – Central Repository | Send Feedback

re3dataOpenAIRERCUB
 

 

All of DSpaceInstitutions/communitiesAuthorsTitlesSubjectsThis institutionAuthorsTitlesSubjects

Statistics

View Usage Statistics

DSpace software copyright © 2002-2015  DuraSpace
About CeR – Central Repository | Send Feedback

re3dataOpenAIRERCUB