In this paper we present a contactless technique for thickness measurement of chemically etched Si membranes. This technique is based on low-coherence interferometry performed by single-mode fiber-optic sensing configuration. We are able to measure the thickness of Si membranes with accuracy of about 40 run. We used the proposed technique for the fast measurement of thickness uniformity of central position of Si membranes with overall dimensions of 2x2 mm(2) all around one 3 inch (100) Si wafer with starting thickness of 380 Iim. Additionally, we measured the thickness uniformity of several membranes with central boss by scanning. The accuracy of the technique is about 100 nm.
Source:
26th International Conference on Microelectronics, Vols 1 and 2, Proceedings, 2008, 321-
Publisher:
Institute of Electrical and Electronics Engineers Inc.
TY - CONF
AU - Đinović, Zoran
AU - Tomić, Miloš
AU - Manojlović, Lazo
AU - Lazić, Žarko
AU - Smiljanić, Milče
PY - 2008
UR - https://cer.ihtm.bg.ac.rs/handle/123456789/422
AB - In this paper we present a contactless technique for thickness measurement of chemically etched Si membranes. This technique is based on low-coherence interferometry performed by single-mode fiber-optic sensing configuration. We are able to measure the thickness of Si membranes with accuracy of about 40 run. We used the proposed technique for the fast measurement of thickness uniformity of central position of Si membranes with overall dimensions of 2x2 mm(2) all around one 3 inch (100) Si wafer with starting thickness of 380 Iim. Additionally, we measured the thickness uniformity of several membranes with central boss by scanning. The accuracy of the technique is about 100 nm.
PB - Institute of Electrical and Electronics Engineers Inc.
C3 - 26th International Conference on Microelectronics, Vols 1 and 2, Proceedings
T1 - Non-contact measurement of thickness uniformity of chemically etched Si membranes by fiber-optic low-coherence interferometry
SP - 321
DO - 10.1109/ICMEL.2008.4559286
ER -
@conference{
author = "Đinović, Zoran and Tomić, Miloš and Manojlović, Lazo and Lazić, Žarko and Smiljanić, Milče",
year = "2008",
abstract = "In this paper we present a contactless technique for thickness measurement of chemically etched Si membranes. This technique is based on low-coherence interferometry performed by single-mode fiber-optic sensing configuration. We are able to measure the thickness of Si membranes with accuracy of about 40 run. We used the proposed technique for the fast measurement of thickness uniformity of central position of Si membranes with overall dimensions of 2x2 mm(2) all around one 3 inch (100) Si wafer with starting thickness of 380 Iim. Additionally, we measured the thickness uniformity of several membranes with central boss by scanning. The accuracy of the technique is about 100 nm.",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
journal = "26th International Conference on Microelectronics, Vols 1 and 2, Proceedings",
title = "Non-contact measurement of thickness uniformity of chemically etched Si membranes by fiber-optic low-coherence interferometry",
pages = "321",
doi = "10.1109/ICMEL.2008.4559286"
}
Đinović, Z., Tomić, M., Manojlović, L., Lazić, Ž.,& Smiljanić, M.. (2008). Non-contact measurement of thickness uniformity of chemically etched Si membranes by fiber-optic low-coherence interferometry. in 26th International Conference on Microelectronics, Vols 1 and 2, Proceedings
Institute of Electrical and Electronics Engineers Inc.., 321.
https://doi.org/10.1109/ICMEL.2008.4559286
Đinović Z, Tomić M, Manojlović L, Lazić Ž, Smiljanić M. Non-contact measurement of thickness uniformity of chemically etched Si membranes by fiber-optic low-coherence interferometry. in 26th International Conference on Microelectronics, Vols 1 and 2, Proceedings. 2008;:321.
doi:10.1109/ICMEL.2008.4559286 .
Đinović, Zoran, Tomić, Miloš, Manojlović, Lazo, Lazić, Žarko, Smiljanić, Milče, "Non-contact measurement of thickness uniformity of chemically etched Si membranes by fiber-optic low-coherence interferometry" in 26th International Conference on Microelectronics, Vols 1 and 2, Proceedings (2008):321,
https://doi.org/10.1109/ICMEL.2008.4559286 . .
