Non-contact measurement of thickness uniformity of chemically etched Si membranes by fiber-optic low-coherence interferometry
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In this paper we present a contactless technique for thickness measurement of chemically etched Si membranes. This technique is based on low-coherence interferometry performed by single-mode fiber-optic sensing configuration. We are able to measure the thickness of Si membranes with accuracy of about 40 run. We used the proposed technique for the fast measurement of thickness uniformity of central position of Si membranes with overall dimensions of 2x2 mm(2) all around one 3 inch (100) Si wafer with starting thickness of 380 Iim. Additionally, we measured the thickness uniformity of several membranes with central boss by scanning. The accuracy of the technique is about 100 nm.
Source:26th International Conference on Microelectronics, Vols 1 and 2, Proceedings, 2008, 321-
- Institute of Electrical and Electronics Engineers Inc.
- Austrian Science Fund (FWF) - L139-N02
- Integrated Microsystems Austria
- IMA GmbH