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dc.creatorNikolić, Nebojša D.
dc.creatorPopov, Konstantin I.
dc.creatorPavlović, Ljubica J.
dc.creatorPavlović, Miomir
dc.date.accessioned2021-01-14T22:07:20Z
dc.date.available2021-01-14T22:07:20Z
dc.date.issued2006
dc.identifier.issn0257-8972
dc.identifier.urihttps://cer.ihtm.bg.ac.rs/handle/123456789/4079
dc.description.abstractMorphologies of copper deposits obtained at overpotentials belonging to the plateau of the limiting diffusion current density and at higher overpotentials were examined by the scanning electron microscopy (SEM) technique. Copper dendrites are formed at overpotentials belonging to the plateau of the limiting diffusion current density. The shape of copper dendrites depends on the electrodeposition overpotential. At higher overpotentials (800 and 1000 mV) and larger values of current densities, porous and very disperse copper deposits were obtained. These morphologies were a consequence of a very vigorous hydrogen evolution at these electrodeposition overpotentials. Also, the obtained copper structures consisted of agglomerates of copper grains. The size of copper grains is a function of the overpotential of electrodeposition, thus approaching to nano-sized dimensions is achieved when the electrodeposition overpotential is increased.sr
dc.language.isoensr
dc.publisherElseviersr
dc.rightsrestrictedAccesssr
dc.sourceSurface and Coatings Technologysr
dc.subjectElectroplatingsr
dc.subjectScanning electron microscopy (SEM)sr
dc.subjectCoppersr
dc.subjectThe hydrogen evolutionsr
dc.titleMorphologies of copper deposits obtained by the electrodeposition at high overpotentialssr
dc.typearticlesr
dc.rights.licenseARRsr
dcterms.abstractПавловић, Миомир Г.; Павловић, Љубица Ј.; Попов, Константин; Николић, Небојша;
dc.citation.volume201
dc.citation.issue3-4
dc.citation.spage560
dc.citation.epage566
dc.citation.rankM21
dc.identifier.doi10.1016/j.surfcoat.2005.12.004
dc.identifier.scopus2-s2.0-33748414039
dc.identifier.wos000244477300008
dc.type.versionpublishedVersionsr


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