This paper presents design, fabrication and experimental results of multipurpose thermopile based sensor which is compatible with technological processes already developed at IHTM-IMTM for fabrication of pressure sensors. Thermal isolation is assured using back etching of bulk silicon. Thermopiles have multilayer structure and sandwich membrane consists of layer of residual n-Si and sputtered oxide. Post-etching technique was developed and functional structures with membranes below 3 mu m were fabricated. Steady state and transient behaviour of fabricated structures were anticipated by applying two-zone 1D analytical model and FEA Comsol simulation. Sensors were tested as ac-dc transfer devices, gas flow meters and vacuum detectors.
Keywords:
thermopile / micromachining / analytical and FEA modelling / thermal converter / flow meter / vacuum detector
Source:
Sensors and Actuators, A: Physical, 2008, 141, 2, 404-413
TY - JOUR
AU - Randjelović, Danijela
AU - Petropoulos, Anastasios
AU - Kaltsas, Grigoris
AU - Stojanovic, Milos
AU - Lazić, Žarko
AU - Đurić, Zoran G.
AU - Matic, Milan
PY - 2008
UR - https://cer.ihtm.bg.ac.rs/handle/123456789/401
AB - This paper presents design, fabrication and experimental results of multipurpose thermopile based sensor which is compatible with technological processes already developed at IHTM-IMTM for fabrication of pressure sensors. Thermal isolation is assured using back etching of bulk silicon. Thermopiles have multilayer structure and sandwich membrane consists of layer of residual n-Si and sputtered oxide. Post-etching technique was developed and functional structures with membranes below 3 mu m were fabricated. Steady state and transient behaviour of fabricated structures were anticipated by applying two-zone 1D analytical model and FEA Comsol simulation. Sensors were tested as ac-dc transfer devices, gas flow meters and vacuum detectors.
PB - Elsevier Science Sa, Lausanne
T2 - Sensors and Actuators, A: Physical
T1 - Multipurpose MEMS thermal sensor based on thermopiles
VL - 141
IS - 2
SP - 404
EP - 413
DO - 10.1016/j.sna.2007.10.043
ER -
@article{
author = "Randjelović, Danijela and Petropoulos, Anastasios and Kaltsas, Grigoris and Stojanovic, Milos and Lazić, Žarko and Đurić, Zoran G. and Matic, Milan",
year = "2008",
abstract = "This paper presents design, fabrication and experimental results of multipurpose thermopile based sensor which is compatible with technological processes already developed at IHTM-IMTM for fabrication of pressure sensors. Thermal isolation is assured using back etching of bulk silicon. Thermopiles have multilayer structure and sandwich membrane consists of layer of residual n-Si and sputtered oxide. Post-etching technique was developed and functional structures with membranes below 3 mu m were fabricated. Steady state and transient behaviour of fabricated structures were anticipated by applying two-zone 1D analytical model and FEA Comsol simulation. Sensors were tested as ac-dc transfer devices, gas flow meters and vacuum detectors.",
publisher = "Elsevier Science Sa, Lausanne",
journal = "Sensors and Actuators, A: Physical",
title = "Multipurpose MEMS thermal sensor based on thermopiles",
volume = "141",
number = "2",
pages = "404-413",
doi = "10.1016/j.sna.2007.10.043"
}
Randjelović, D., Petropoulos, A., Kaltsas, G., Stojanovic, M., Lazić, Ž., Đurić, Z. G.,& Matic, M.. (2008). Multipurpose MEMS thermal sensor based on thermopiles. in Sensors and Actuators, A: Physical
Elsevier Science Sa, Lausanne., 141(2), 404-413.
https://doi.org/10.1016/j.sna.2007.10.043
Randjelović D, Petropoulos A, Kaltsas G, Stojanovic M, Lazić Ž, Đurić ZG, Matic M. Multipurpose MEMS thermal sensor based on thermopiles. in Sensors and Actuators, A: Physical. 2008;141(2):404-413.
doi:10.1016/j.sna.2007.10.043 .
Randjelović, Danijela, Petropoulos, Anastasios, Kaltsas, Grigoris, Stojanovic, Milos, Lazić, Žarko, Đurić, Zoran G., Matic, Milan, "Multipurpose MEMS thermal sensor based on thermopiles" in Sensors and Actuators, A: Physical, 141, no. 2 (2008):404-413,
https://doi.org/10.1016/j.sna.2007.10.043 . .
