Ternary Bi-Cu-Ni alloys – thermodynamics, characterization, mechanical and electrical properties
Talijan, Nadežda M.
Article (Published version)
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The Bi–Cu–Ni ternary system belongs to the group of potential Cu-Ni-based advanced lead-free solder materials for high temperature application. The paper shows results of the thermodynamic calculations using general solution model along the line with the molar ratio of Cu: Ni = 1:1. The experimental part shows thermal, structural, electrical and mechanical properties based on differential scanning calorimetry (DSC), scanning electron microscopy with energy dispersive spectrometry (SEM-EDS), electroconductivity and hardness measurements of the alloys selected in the section from bismuth corner with molar ratio Cu: Ni = 1:1, Cu: Ni = 3:1, and Cu: Ni = 1:3.
Keywords:Bi-Cu-Ni ternary alloys / lead-free solders / thermodynamic calculations / characterization
Source:Metallurgical & Materials Engineering, 2017, 23, 3, 241-254
- Serbia : Association of Metallurgical Engineers of Serbia