The Bi–Cu–Ni ternary system belongs to the group of potential Cu-Ni-based advanced lead-free solder materials for high temperature application. The paper shows results of the thermodynamic calculations using general solution model along the line with the molar ratio of Cu: Ni = 1:1. The experimental part shows thermal, structural, electrical and mechanical properties based on differential scanning calorimetry (DSC), scanning electron microscopy with energy dispersive spectrometry (SEM-EDS), electroconductivity and hardness measurements of the alloys selected in the section from bismuth corner with molar ratio Cu: Ni = 1:1, Cu: Ni = 3:1, and Cu: Ni = 1:3.
TY - JOUR
AU - Marković, Branislav
AU - Manasijević, Dragan
AU - Talijan, Nadežda M.
AU - Sokić, Miroslav
AU - Štrbac, Nada
AU - Patarić, Aleksandra
AU - Bugarčić, Mladen
PY - 2017
UR - https://cer.ihtm.bg.ac.rs/handle/123456789/3884
AB - The Bi–Cu–Ni ternary system belongs to the group of potential Cu-Ni-based advanced lead-free solder materials for high temperature application. The paper shows results of the thermodynamic calculations using general solution model along the line with the molar ratio of Cu: Ni = 1:1. The experimental part shows thermal, structural, electrical and mechanical properties based on differential scanning calorimetry (DSC), scanning electron microscopy with energy dispersive spectrometry (SEM-EDS), electroconductivity and hardness measurements of the alloys selected in the section from bismuth corner with molar ratio Cu: Ni = 1:1, Cu: Ni = 3:1, and Cu: Ni = 1:3.
PB - Serbia : Association of Metallurgical Engineers of Serbia
T2 - Metallurgical & Materials Engineering
T1 - Ternary Bi-Cu-Ni alloys – thermodynamics, characterization, mechanical and electrical properties
VL - 23
IS - 3
SP - 241
EP - 254
DO - 10.30544/316
ER -
@article{
author = "Marković, Branislav and Manasijević, Dragan and Talijan, Nadežda M. and Sokić, Miroslav and Štrbac, Nada and Patarić, Aleksandra and Bugarčić, Mladen",
year = "2017",
abstract = "The Bi–Cu–Ni ternary system belongs to the group of potential Cu-Ni-based advanced lead-free solder materials for high temperature application. The paper shows results of the thermodynamic calculations using general solution model along the line with the molar ratio of Cu: Ni = 1:1. The experimental part shows thermal, structural, electrical and mechanical properties based on differential scanning calorimetry (DSC), scanning electron microscopy with energy dispersive spectrometry (SEM-EDS), electroconductivity and hardness measurements of the alloys selected in the section from bismuth corner with molar ratio Cu: Ni = 1:1, Cu: Ni = 3:1, and Cu: Ni = 1:3.",
publisher = "Serbia : Association of Metallurgical Engineers of Serbia",
journal = "Metallurgical & Materials Engineering",
title = "Ternary Bi-Cu-Ni alloys – thermodynamics, characterization, mechanical and electrical properties",
volume = "23",
number = "3",
pages = "241-254",
doi = "10.30544/316"
}
Marković, B., Manasijević, D., Talijan, N. M., Sokić, M., Štrbac, N., Patarić, A.,& Bugarčić, M.. (2017). Ternary Bi-Cu-Ni alloys – thermodynamics, characterization, mechanical and electrical properties. in Metallurgical & Materials Engineering
Serbia : Association of Metallurgical Engineers of Serbia., 23(3), 241-254.
https://doi.org/10.30544/316
Marković B, Manasijević D, Talijan NM, Sokić M, Štrbac N, Patarić A, Bugarčić M. Ternary Bi-Cu-Ni alloys – thermodynamics, characterization, mechanical and electrical properties. in Metallurgical & Materials Engineering. 2017;23(3):241-254.
doi:10.30544/316 .
, 