Copper-Nickel heterometallic multilayer composites for plasmonic applications
Аутори
Mladenović, IvanaJakšić, Zoran
Obradov, Marko
Vuković, Slobodan M.
Isić, Goran
Lamovec, Jelena
Конференцијски прилог (Објављена верзија)
Метаподаци
Приказ свих података о документуАпстракт
Plasmonics and optical metamaterials offer possibilities for numerous applications in different fields, from transformation optics and chemical sensing to merging the beneficial properties of electronic and optical circuits. Crucial for their function are interfaces between materials of which one has to exhibit negative value of relative dielectric permittivity due to the existence of free electron plasma. However, the choice of convenient materials is rather limited and their performance is severely impaired by strong absorption losses. This is the reason why alternative plasmonic media are currently of an increasing interest. In this contribution we consider one such medium, the heterometallic multilayer consisting of copper and
nickel. Copper is an excellent plasmonic material, but needs protection against surface oxidation, a role fulfilled by nickel layers which simultaneously form interfaces supporting surface waves. We describe our proposed heterometallics and consider their el...ectromagnetic properties and experimental fabrication. Ab initio numerical simulations were done using the finite element method for Cu-Ni multilayers on a copper substrate. Laminate composite structures of alternately electrodeposited nanocrystalline Ni and Cu films on cold-rolled polycrystalline copper substrates were fabricated. Highly-densified parallel interfaces can be obtained by depositing layers at a very narrow
spacing. Our results show that Cu-Ni pairs are a viable
alternative to conventional plasmonic media, while the
electrodeposition approach offers acceptable structural and electromagnetic parameters with large area and good uniformity at a low cost.
Кључне речи:
Plasmonics / Heterometallics / Optical Multilayers / Copper-Nickel Films / ElectrodepositionИзвор:
Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, IcETRAN 2017, Kladovo, Serbia, 2017, MOI3.1.1-MOI3.1.5Издавач:
- Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering
Финансирање / пројекти:
- Микро, нано-системи и сензори за примену у електропривреди, процесној индустрији и заштити животне средине (RS-MESTD-Technological Development (TD or TR)-32008)
- Генерисање и карактеризација нанофотонских функционалних структура у биомедицини и информатици (RS-MESTD-Integrated and Interdisciplinary Research (IIR or III)-45016)
- Физика уређених наноструктура и нових материјала у фотоници (RS-MESTD-Basic Research (BR or ON)-171005)
- Qatar National Research Fund (NPRP 08-128-1-001)
- COST action MP1402 HERALD
URI
https://www.etran.rs/2017/IcETRAN/Conference_Proceedings/https://cer.ihtm.bg.ac.rs/handle/123456789/3826
Институција/група
IHTMTY - CONF AU - Mladenović, Ivana AU - Jakšić, Zoran AU - Obradov, Marko AU - Vuković, Slobodan M. AU - Isić, Goran AU - Lamovec, Jelena PY - 2017 UR - https://www.etran.rs/2017/IcETRAN/Conference_Proceedings/ UR - https://cer.ihtm.bg.ac.rs/handle/123456789/3826 AB - Plasmonics and optical metamaterials offer possibilities for numerous applications in different fields, from transformation optics and chemical sensing to merging the beneficial properties of electronic and optical circuits. Crucial for their function are interfaces between materials of which one has to exhibit negative value of relative dielectric permittivity due to the existence of free electron plasma. However, the choice of convenient materials is rather limited and their performance is severely impaired by strong absorption losses. This is the reason why alternative plasmonic media are currently of an increasing interest. In this contribution we consider one such medium, the heterometallic multilayer consisting of copper and nickel. Copper is an excellent plasmonic material, but needs protection against surface oxidation, a role fulfilled by nickel layers which simultaneously form interfaces supporting surface waves. We describe our proposed heterometallics and consider their electromagnetic properties and experimental fabrication. Ab initio numerical simulations were done using the finite element method for Cu-Ni multilayers on a copper substrate. Laminate composite structures of alternately electrodeposited nanocrystalline Ni and Cu films on cold-rolled polycrystalline copper substrates were fabricated. Highly-densified parallel interfaces can be obtained by depositing layers at a very narrow spacing. Our results show that Cu-Ni pairs are a viable alternative to conventional plasmonic media, while the electrodeposition approach offers acceptable structural and electromagnetic parameters with large area and good uniformity at a low cost. PB - Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering C3 - Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, IcETRAN 2017, Kladovo, Serbia T1 - Copper-Nickel heterometallic multilayer composites for plasmonic applications SP - MOI3.1.1 EP - MOI3.1.5 UR - https://hdl.handle.net/21.15107/rcub_cer_3826 ER -
@conference{ author = "Mladenović, Ivana and Jakšić, Zoran and Obradov, Marko and Vuković, Slobodan M. and Isić, Goran and Lamovec, Jelena", year = "2017", abstract = "Plasmonics and optical metamaterials offer possibilities for numerous applications in different fields, from transformation optics and chemical sensing to merging the beneficial properties of electronic and optical circuits. Crucial for their function are interfaces between materials of which one has to exhibit negative value of relative dielectric permittivity due to the existence of free electron plasma. However, the choice of convenient materials is rather limited and their performance is severely impaired by strong absorption losses. This is the reason why alternative plasmonic media are currently of an increasing interest. In this contribution we consider one such medium, the heterometallic multilayer consisting of copper and nickel. Copper is an excellent plasmonic material, but needs protection against surface oxidation, a role fulfilled by nickel layers which simultaneously form interfaces supporting surface waves. We describe our proposed heterometallics and consider their electromagnetic properties and experimental fabrication. Ab initio numerical simulations were done using the finite element method for Cu-Ni multilayers on a copper substrate. Laminate composite structures of alternately electrodeposited nanocrystalline Ni and Cu films on cold-rolled polycrystalline copper substrates were fabricated. Highly-densified parallel interfaces can be obtained by depositing layers at a very narrow spacing. Our results show that Cu-Ni pairs are a viable alternative to conventional plasmonic media, while the electrodeposition approach offers acceptable structural and electromagnetic parameters with large area and good uniformity at a low cost.", publisher = "Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering", journal = "Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, IcETRAN 2017, Kladovo, Serbia", title = "Copper-Nickel heterometallic multilayer composites for plasmonic applications", pages = "MOI3.1.1-MOI3.1.5", url = "https://hdl.handle.net/21.15107/rcub_cer_3826" }
Mladenović, I., Jakšić, Z., Obradov, M., Vuković, S. M., Isić, G.,& Lamovec, J.. (2017). Copper-Nickel heterometallic multilayer composites for plasmonic applications. in Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, IcETRAN 2017, Kladovo, Serbia Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering., MOI3.1.1-MOI3.1.5. https://hdl.handle.net/21.15107/rcub_cer_3826
Mladenović I, Jakšić Z, Obradov M, Vuković SM, Isić G, Lamovec J. Copper-Nickel heterometallic multilayer composites for plasmonic applications. in Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, IcETRAN 2017, Kladovo, Serbia. 2017;:MOI3.1.1-MOI3.1.5. https://hdl.handle.net/21.15107/rcub_cer_3826 .
Mladenović, Ivana, Jakšić, Zoran, Obradov, Marko, Vuković, Slobodan M., Isić, Goran, Lamovec, Jelena, "Copper-Nickel heterometallic multilayer composites for plasmonic applications" in Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, IcETRAN 2017, Kladovo, Serbia (2017):MOI3.1.1-MOI3.1.5, https://hdl.handle.net/21.15107/rcub_cer_3826 .