Effect of temperature on the electrodeposition of disperse copper deposits
Uticaj temperature na elektrohemijsko taloženje disperznih taloga bakra
Apstrakt
The effect of temperature on the electrodeposition of copper at overpotentials belonging to the plateau of the limiting diffusion current density and higher was examined by the determination of the average current efficiency of hydrogen evolution and by scanning electron microscopic (SEM) analysis of the morphology of the formed copper deposits. Increasing the temperature of the solution led to a shift of both the beginning and the end of the plateau of the limiting diffusion current density towards lower electrodeposition overpotentials. Also, higher temperatures led to the formation of morphological forms of copper deposits characteristic for electrodeposition of copper at some higher overpotentials. The unexpected trend in the development of copper structures electrodeposited at an overpotential of 800 mV is discussed in terms of the effect of temperature on the viscosity and surface tension of the electroplating solution.
Uticaj temperature na elektrohemijsko taloženje bakra na prenapetostima koje pripadaju platoima granične difuzione gustine struje, kao i na višim prenapetostima je ispitan određivanjem srednjeg iskorišćenja struje reakcije izdvajanja vodonika i analizom morfologija taloga bakra tehnikom skenirajuće elektronske mikroskopije. Povećanje temperature rastvora dovelo je do pomeranja i početka i kraja platoa granične difuzione gustine struje ka nižim prenapetostima. Takođe, povećanje temperature dovelo je do formiranja morfoloških formi taloga bakra karakterističnih za elektrohemijsko taloženje na nekim višim prenapetostima. Neočekivani trend u razvoju struktura bakra dobijenih na prenapetosti od 800 mV je bio diskutovan na osnovu uticaja temperature na viskoznost i površinski napon rastvora za elektrohemijsko taloženje bakra.
Ključne reči:
electrodeposition / copper / hydrogen evolution / temperature / viscosity / surface tensionIzvor:
Journal of the Serbian Chemical Society, 2007, 72, 12, 1369-1381Izdavač:
- Serbian Chemical Society
Finansiranje / projekti:
- Taloženje ultrafinih prahova metala i legura i nanostrukturiranih površina elektrohemijskim postupcima (RS-142032)
DOI: 10.2298/JSC0712369N
ISSN: 0352-5139
WoS: 000252412100021
Scopus: 2-s2.0-36949035155
Institucija/grupa
IHTMTY - JOUR AU - Nikolić, Nebojša D. AU - Pavlović, Ljubica AU - Pavlović, Miomir AU - Popov, Konstantin I. PY - 2007 UR - https://cer.ihtm.bg.ac.rs/handle/123456789/331 AB - The effect of temperature on the electrodeposition of copper at overpotentials belonging to the plateau of the limiting diffusion current density and higher was examined by the determination of the average current efficiency of hydrogen evolution and by scanning electron microscopic (SEM) analysis of the morphology of the formed copper deposits. Increasing the temperature of the solution led to a shift of both the beginning and the end of the plateau of the limiting diffusion current density towards lower electrodeposition overpotentials. Also, higher temperatures led to the formation of morphological forms of copper deposits characteristic for electrodeposition of copper at some higher overpotentials. The unexpected trend in the development of copper structures electrodeposited at an overpotential of 800 mV is discussed in terms of the effect of temperature on the viscosity and surface tension of the electroplating solution. AB - Uticaj temperature na elektrohemijsko taloženje bakra na prenapetostima koje pripadaju platoima granične difuzione gustine struje, kao i na višim prenapetostima je ispitan određivanjem srednjeg iskorišćenja struje reakcije izdvajanja vodonika i analizom morfologija taloga bakra tehnikom skenirajuće elektronske mikroskopije. Povećanje temperature rastvora dovelo je do pomeranja i početka i kraja platoa granične difuzione gustine struje ka nižim prenapetostima. Takođe, povećanje temperature dovelo je do formiranja morfoloških formi taloga bakra karakterističnih za elektrohemijsko taloženje na nekim višim prenapetostima. Neočekivani trend u razvoju struktura bakra dobijenih na prenapetosti od 800 mV je bio diskutovan na osnovu uticaja temperature na viskoznost i površinski napon rastvora za elektrohemijsko taloženje bakra. PB - Serbian Chemical Society T2 - Journal of the Serbian Chemical Society T1 - Effect of temperature on the electrodeposition of disperse copper deposits T1 - Uticaj temperature na elektrohemijsko taloženje disperznih taloga bakra VL - 72 IS - 12 SP - 1369 EP - 1381 DO - 10.2298/JSC0712369N ER -
@article{ author = "Nikolić, Nebojša D. and Pavlović, Ljubica and Pavlović, Miomir and Popov, Konstantin I.", year = "2007", abstract = "The effect of temperature on the electrodeposition of copper at overpotentials belonging to the plateau of the limiting diffusion current density and higher was examined by the determination of the average current efficiency of hydrogen evolution and by scanning electron microscopic (SEM) analysis of the morphology of the formed copper deposits. Increasing the temperature of the solution led to a shift of both the beginning and the end of the plateau of the limiting diffusion current density towards lower electrodeposition overpotentials. Also, higher temperatures led to the formation of morphological forms of copper deposits characteristic for electrodeposition of copper at some higher overpotentials. The unexpected trend in the development of copper structures electrodeposited at an overpotential of 800 mV is discussed in terms of the effect of temperature on the viscosity and surface tension of the electroplating solution., Uticaj temperature na elektrohemijsko taloženje bakra na prenapetostima koje pripadaju platoima granične difuzione gustine struje, kao i na višim prenapetostima je ispitan određivanjem srednjeg iskorišćenja struje reakcije izdvajanja vodonika i analizom morfologija taloga bakra tehnikom skenirajuće elektronske mikroskopije. Povećanje temperature rastvora dovelo je do pomeranja i početka i kraja platoa granične difuzione gustine struje ka nižim prenapetostima. Takođe, povećanje temperature dovelo je do formiranja morfoloških formi taloga bakra karakterističnih za elektrohemijsko taloženje na nekim višim prenapetostima. Neočekivani trend u razvoju struktura bakra dobijenih na prenapetosti od 800 mV je bio diskutovan na osnovu uticaja temperature na viskoznost i površinski napon rastvora za elektrohemijsko taloženje bakra.", publisher = "Serbian Chemical Society", journal = "Journal of the Serbian Chemical Society", title = "Effect of temperature on the electrodeposition of disperse copper deposits, Uticaj temperature na elektrohemijsko taloženje disperznih taloga bakra", volume = "72", number = "12", pages = "1369-1381", doi = "10.2298/JSC0712369N" }
Nikolić, N. D., Pavlović, L., Pavlović, M.,& Popov, K. I.. (2007). Effect of temperature on the electrodeposition of disperse copper deposits. in Journal of the Serbian Chemical Society Serbian Chemical Society., 72(12), 1369-1381. https://doi.org/10.2298/JSC0712369N
Nikolić ND, Pavlović L, Pavlović M, Popov KI. Effect of temperature on the electrodeposition of disperse copper deposits. in Journal of the Serbian Chemical Society. 2007;72(12):1369-1381. doi:10.2298/JSC0712369N .
Nikolić, Nebojša D., Pavlović, Ljubica, Pavlović, Miomir, Popov, Konstantin I., "Effect of temperature on the electrodeposition of disperse copper deposits" in Journal of the Serbian Chemical Society, 72, no. 12 (2007):1369-1381, https://doi.org/10.2298/JSC0712369N . .