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Hardness and assessment of adhesion of monolayer and multilayer nickel thin films electrochemically deposited on silicon substrates with and without the ultrasonic agitation | 218 |
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Hardness and assessment of adhesion of monolayer and multilayer nickel thin films electrochemically deposited on silicon substrates with and without the ultrasonic agitation | 0 | 1 | 3 | 2 | 1 | 1 | 1 |
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