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dc.creatorDespić, Aleksandar R.
dc.creatorMaglić, G S
dc.creatorJaćović, M
dc.date.accessioned2019-04-27T15:34:46Z
dc.date.available2019-04-27T15:34:46Z
dc.date.issued1979
dc.identifier.issn0021-891X
dc.identifier.urihttp://cer.ihtm.bg.ac.rs/handle/123456789/2749
dc.description.abstractPoly(4-vinyl pyridine-co-methyl methacrylate), which is soluble in water in its protonated form and insoluble as a neutral molecule, has been synthesized and introduced into an acid bath for copper deposition. Potential-sweep investigations have shown that the copolymer affects the electrocrystallization of copper on graphite by delaying nucleation even before conditions for codeposition of the polymer are reached. At overpotentials at which the diffusion limiting current of copper is reached and hydrogen evolution starts, alkalinity at the electrode surface causes precipitation of the polymer. This is found to affect the resistivity of the deposit. Electron microscopy revealed that under such conditions copper is deposited in the form of globular particles, the size of the globules being in the micron range and decreasing with increasing overpotential. © 1979 Chapman and Hall Ltd.en
dc.publisherKluwer Academic Publishers
dc.relationResearch Fund of Serbia
dc.relationNSF (USA)
dc.rightsrestrictedAccess
dc.sourceJournal of Applied Electrochemistry
dc.subjectPolymers
dc.subjectComposite materials
dc.subjectCopper and Alloys
dc.subjectElectrodeposition
dc.titleEffect of codeposition of polymer on the morphology of electrodeposited copperen
dc.typearticleen
dc.rights.licenseARR
dcterms.abstractМаглић, Г С; Јаћовић, М; Деспић, A Р;
dc.rights.holderChapman and Hall Ltd. 1979
dc.citation.volume9
dc.citation.issue2
dc.citation.spage147
dc.citation.epage153
dc.identifier.doi10.1007/BF00616084
dc.identifier.scopus2-s2.0-0018440812
dc.type.versionpublishedVersion


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