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Effect of codeposition of polymer on the morphology of electrodeposited copper

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1979
Authors
Despić, Aleksandar R.
Maglić, G S
Jaćović, M
Article (Published version)
,
Chapman and Hall Ltd. 1979
Metadata
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Abstract
Poly(4-vinyl pyridine-co-methyl methacrylate), which is soluble in water in its protonated form and insoluble as a neutral molecule, has been synthesized and introduced into an acid bath for copper deposition. Potential-sweep investigations have shown that the copolymer affects the electrocrystallization of copper on graphite by delaying nucleation even before conditions for codeposition of the polymer are reached. At overpotentials at which the diffusion limiting current of copper is reached and hydrogen evolution starts, alkalinity at the electrode surface causes precipitation of the polymer. This is found to affect the resistivity of the deposit. Electron microscopy revealed that under such conditions copper is deposited in the form of globular particles, the size of the globules being in the micron range and decreasing with increasing overpotential. © 1979 Chapman and Hall Ltd.
Keywords:
Polymers / Composite materials / Copper and Alloys / Electrodeposition
Source:
Journal of Applied Electrochemistry, 1979, 9, 2, 147-153
Publisher:
  • Kluwer Academic Publishers
Projects:
  • Research Fund of Serbia
  • NSF (USA)

DOI: 10.1007/BF00616084

ISSN: 0021-891X

Scopus: 2-s2.0-0018440812
[ Google Scholar ]
3
URI
http://cer.ihtm.bg.ac.rs/handle/123456789/2749
Collections
  • Radovi istraživača / Researchers' publications
Institution
IHTM
TY  - JOUR
AU  - Despić, Aleksandar R.
AU  - Maglić, G S
AU  - Jaćović, M
PY  - 1979
UR  - http://cer.ihtm.bg.ac.rs/handle/123456789/2749
AB  - Poly(4-vinyl pyridine-co-methyl methacrylate), which is soluble in water in its protonated form and insoluble as a neutral molecule, has been synthesized and introduced into an acid bath for copper deposition. Potential-sweep investigations have shown that the copolymer affects the electrocrystallization of copper on graphite by delaying nucleation even before conditions for codeposition of the polymer are reached. At overpotentials at which the diffusion limiting current of copper is reached and hydrogen evolution starts, alkalinity at the electrode surface causes precipitation of the polymer. This is found to affect the resistivity of the deposit. Electron microscopy revealed that under such conditions copper is deposited in the form of globular particles, the size of the globules being in the micron range and decreasing with increasing overpotential. © 1979 Chapman and Hall Ltd.
PB  - Kluwer Academic Publishers
T2  - Journal of Applied Electrochemistry
T1  - Effect of codeposition of polymer on the morphology of electrodeposited copper
VL  - 9
IS  - 2
SP  - 147
EP  - 153
DO  - 10.1007/BF00616084
ER  - 
@article{
author = "Despić, Aleksandar R. and Maglić, G S and Jaćović, M",
year = "1979",
url = "http://cer.ihtm.bg.ac.rs/handle/123456789/2749",
abstract = "Poly(4-vinyl pyridine-co-methyl methacrylate), which is soluble in water in its protonated form and insoluble as a neutral molecule, has been synthesized and introduced into an acid bath for copper deposition. Potential-sweep investigations have shown that the copolymer affects the electrocrystallization of copper on graphite by delaying nucleation even before conditions for codeposition of the polymer are reached. At overpotentials at which the diffusion limiting current of copper is reached and hydrogen evolution starts, alkalinity at the electrode surface causes precipitation of the polymer. This is found to affect the resistivity of the deposit. Electron microscopy revealed that under such conditions copper is deposited in the form of globular particles, the size of the globules being in the micron range and decreasing with increasing overpotential. © 1979 Chapman and Hall Ltd.",
publisher = "Kluwer Academic Publishers",
journal = "Journal of Applied Electrochemistry",
title = "Effect of codeposition of polymer on the morphology of electrodeposited copper",
volume = "9",
number = "2",
pages = "147-153",
doi = "10.1007/BF00616084"
}
Despić AR, Maglić GS, Jaćović M. Effect of codeposition of polymer on the morphology of electrodeposited copper. Journal of Applied Electrochemistry. 1979;9(2):147-153
Despić, A. R., Maglić, G. S.,& Jaćović, M. (1979). Effect of codeposition of polymer on the morphology of electrodeposited copper.
Journal of Applied ElectrochemistryKluwer Academic Publishers., 9(2), 147-153.
https://doi.org/10.1007/BF00616084
Despić Aleksandar R., Maglić G S, Jaćović M, "Effect of codeposition of polymer on the morphology of electrodeposited copper" 9, no. 2 (1979):147-153,
https://doi.org/10.1007/BF00616084 .

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