Synergetic effect of additives on the hardness and adhesion of thin electrodeposited copper films
Abstract
Thin copper films were electrodeposited on a polycrystalline cold-rolled copper substrate. The composition of the laboratory-made copper sulphate electrolyte was changed by the addition of various additives. The influence of chloride ion (Cl-), polyethylene glycol (PEG) and 3-mercapto-1-propane sulfonic acid (MPSA) on mechanical and adhesion properties of the electrodeposited copper films was investigated using Vickers microindentation technique. Calculations of the film hardness and adhesion were carried out using composite hardness models of Korsunsky and Chen-Gao. The hardness of the composite system is influenced by the adhesion of the copper film to the substrate. Increasing adhesion corresponds to increasing values of the calculated adhesion parameter b, named the critical reduced depth. When additives are added to a plating solution, the copper deposition mechanism is changed and fine-grained microstructure without the formation of microscopic nodules is obtained.
Keywords:
Adhesion / Composite microhardness / Critical reduced depth / Electrodeposition / MPS / PEGSource:
Serbian Journal of Electrical Engineering, 2017, 14, 1, 1-11Publisher:
- Faculty of Technical Sciences in Cacak
Projects:
- Micro- Nanosystems and Sensors for Electric Power and Process Industry and Environmental Protection (RS-32008)
- Predefined functional properties polymer composite materials processes and equipment development (RS-34011)
- Synthesis, processing and applications of nanostructured multifunctional materials with defined properties (RS-45019)