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Synergetic effect of additives on the hardness and adhesion of thin electrodeposited copper films

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2017
2204.pdf (663.7Kb)
Authors
Mladenović, Ivana
Lamovec, Jelena
Jović, Vesna
Radojević, Vesna
Article (Published version)
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Abstract
Thin copper films were electrodeposited on a polycrystalline cold-rolled copper substrate. The composition of the laboratory-made copper sulphate electrolyte was changed by the addition of various additives. The influence of chloride ion (Cl-), polyethylene glycol (PEG) and 3-mercapto-1-propane sulfonic acid (MPSA) on mechanical and adhesion properties of the electrodeposited copper films was investigated using Vickers microindentation technique. Calculations of the film hardness and adhesion were carried out using composite hardness models of Korsunsky and Chen-Gao. The hardness of the composite system is influenced by the adhesion of the copper film to the substrate. Increasing adhesion corresponds to increasing values of the calculated adhesion parameter b, named the critical reduced depth. When additives are added to a plating solution, the copper deposition mechanism is changed and fine-grained microstructure without the formation of microscopic nodules is obtained.
Keywords:
Adhesion / Composite microhardness / Critical reduced depth / Electrodeposition / MPS / PEG
Source:
Serbian Journal of Electrical Engineering, 2017, 14, 1, 1-11
Publisher:
  • Faculty of Technical Sciences in Cacak
Funding / projects:
  • Micro- Nanosystems and Sensors for Electric Power and Process Industry and Environmental Protection (RS-32008)
  • Predefined functional properties polymer composite materials processes and equipment development (RS-34011)
  • Synthesis, processing and applications of nanostructured multifunctional materials with defined properties (RS-45019)

DOI: 10.2298/SJEE1701001M

ISSN: 1451-4869

Scopus: 2-s2.0-85018904412
[ Google Scholar ]
URI
https://cer.ihtm.bg.ac.rs/handle/123456789/2206
Collections
  • Radovi istraživača / Researchers' publications
Institution/Community
IHTM
TY  - JOUR
AU  - Mladenović, Ivana
AU  - Lamovec, Jelena
AU  - Jović, Vesna
AU  - Radojević, Vesna
PY  - 2017
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/2206
AB  - Thin copper films were electrodeposited on a polycrystalline cold-rolled copper substrate. The composition of the laboratory-made copper sulphate electrolyte was changed by the addition of various additives. The influence of chloride ion (Cl-), polyethylene glycol (PEG) and 3-mercapto-1-propane sulfonic acid (MPSA) on mechanical and adhesion properties of the electrodeposited copper films was investigated using Vickers microindentation technique. Calculations of the film hardness and adhesion were carried out using composite hardness models of Korsunsky and Chen-Gao. The hardness of the composite system is influenced by the adhesion of the copper film to the substrate. Increasing adhesion corresponds to increasing values of the calculated adhesion parameter b, named the critical reduced depth. When additives are added to a plating solution, the copper deposition mechanism is changed and fine-grained microstructure without the formation of microscopic nodules is obtained.
PB  - Faculty of Technical Sciences in Cacak
T2  - Serbian Journal of Electrical Engineering
T1  - Synergetic effect of additives on the hardness and adhesion of thin electrodeposited copper films
VL  - 14
IS  - 1
SP  - 1
EP  - 11
DO  - 10.2298/SJEE1701001M
ER  - 
@article{
author = "Mladenović, Ivana and Lamovec, Jelena and Jović, Vesna and Radojević, Vesna",
year = "2017",
abstract = "Thin copper films were electrodeposited on a polycrystalline cold-rolled copper substrate. The composition of the laboratory-made copper sulphate electrolyte was changed by the addition of various additives. The influence of chloride ion (Cl-), polyethylene glycol (PEG) and 3-mercapto-1-propane sulfonic acid (MPSA) on mechanical and adhesion properties of the electrodeposited copper films was investigated using Vickers microindentation technique. Calculations of the film hardness and adhesion were carried out using composite hardness models of Korsunsky and Chen-Gao. The hardness of the composite system is influenced by the adhesion of the copper film to the substrate. Increasing adhesion corresponds to increasing values of the calculated adhesion parameter b, named the critical reduced depth. When additives are added to a plating solution, the copper deposition mechanism is changed and fine-grained microstructure without the formation of microscopic nodules is obtained.",
publisher = "Faculty of Technical Sciences in Cacak",
journal = "Serbian Journal of Electrical Engineering",
title = "Synergetic effect of additives on the hardness and adhesion of thin electrodeposited copper films",
volume = "14",
number = "1",
pages = "1-11",
doi = "10.2298/SJEE1701001M"
}
Mladenović, I., Lamovec, J., Jović, V.,& Radojević, V.. (2017). Synergetic effect of additives on the hardness and adhesion of thin electrodeposited copper films. in Serbian Journal of Electrical Engineering
Faculty of Technical Sciences in Cacak., 14(1), 1-11.
https://doi.org/10.2298/SJEE1701001M
Mladenović I, Lamovec J, Jović V, Radojević V. Synergetic effect of additives on the hardness and adhesion of thin electrodeposited copper films. in Serbian Journal of Electrical Engineering. 2017;14(1):1-11.
doi:10.2298/SJEE1701001M .
Mladenović, Ivana, Lamovec, Jelena, Jović, Vesna, Radojević, Vesna, "Synergetic effect of additives on the hardness and adhesion of thin electrodeposited copper films" in Serbian Journal of Electrical Engineering, 14, no. 1 (2017):1-11,
https://doi.org/10.2298/SJEE1701001M . .

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