Direct electroplating of copper coatings onto aluminum

Abstract

The deposition of copper coatings has been done by direct electrochemical deposition from the solution: CuSO4 (55 g/dm3) + CH2 NH2 - CH2OH (100 g/dm3) + (NH4)2SO4 (30 g/dm3) + Na2SO4*10H2O (75 g/dm3) + Na2CO3 (3 g/dm3), room temperature, j = 0.3 - 0.8 A/dm2, pH = 10.3. The coatings obtained from this electrolyte have very good adhesion if they are followed by quality chemical preparation of the surface. The removal of the oxide film from the aluminum surface has been chemically done in solutions 1 - 4. The influence of current density and deposition time on the structure of copper coatings has been also examined. The morphology and the structural characteristics of copper coatings on aluminum were examined by scanning electron microscopy (SEM).

Taloženje prevlaka bakra na aluminijumu i njegovim legurama vršeno je neposredno elektrohemijskim putem iz rastvora: CuSO4 (55g/dm3) + CH2 NH2 CH2OH (100g/dm3) + (NH4)2SO4 (30g/dm3) + Na2SO4*10H2O (75g/dm3) + Na2CO3 (3g/dm3), temperatura sobna, gustina struje j = 0.3 A/dm2, pH = 10.3. Prevlake bakra dobijene iz ovog elektrolita, uz kvalitetnu hemijsku pripremu površine, imaju dobru adheziju. Uklanjanje oksidne opne sa površine aluminijuma vršeno je hemijskim putem u rastvorima 1-4. Takođe je ispitivan i uticaj gustine struje i vremena taloženja na strukturu prevlaka bakra. Morfologija i strukturne karakteristike prevlaka bakra na aluminijumu ispitivane su skenirajućim elektronskim mikroskopom (SEM).