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Hardness response and adhesion of thin copper films on alloy substrates
(Belgrade: ETRAN – Society for electronics, telecommunication, computing, automatics and nuclear engineering, 2017)
Microhardness test is the most commonly used
method for assessing the mechanical properties of thin films.This testing method uses controlled contact at a single point of an indenter and chosen material which induces the ...
Preparation and mechanical characterization of copper thin films with additives on alloy substrates
(Belgrade : Institute of Chemistry, Technology and Metallurgy, 2017)
Thin copper films have various application in the electronic industry for the fabrication of
contacts in integrated circuits. Copper electroplating has been widely employed for
fabricating the wires of printed circuit ...