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Analysis of the influence of structure on mechanical properties of multilayer Ni/Cu thin films for use in microelectronic technologies / Analiza uticaja strukture na mehanička svojstva višeslojnih tankih filmova Ni/Cu za primenu u mikroelektronskim tehnologijama
(Savez inženjera i tehničara Srbije, 2015)
Multilayer Ni/Cu thin films were produced by dual-bath electrodeposition technique (DBT) on polycrystalline cold-rolled Cu substrate. Different Ni/Cu multilayer structures were realized by changing of process parameters ...