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dc.creatorRanđelović, Danijela
dc.creatorFrantlović, Miloš
dc.creatorMiljkovic, Budimir L.
dc.creatorPopović, Bogdan
dc.creatorJakšić, Zoran
dc.date.accessioned2019-01-30T17:41:39Z
dc.date.available2019-01-30T17:41:39Z
dc.date.issued2014
dc.identifier.issn0042-207X
dc.identifier.urihttp://cer.ihtm.bg.ac.rs/handle/123456789/1533
dc.description.abstractRealization of intelligent thermal vacuum sensors based on multipurpose thermopile micro-electromechanical (MEMS) chips is presented in this work. These vacuum sensors satisfy the main requirements for contemporary sensors, they are cost-effective in both fabrication and operation, and simple to use. Intelligent devices based on two types of thermal sensors, A-type with Al heater, and Ptype with p(+)Si heater, were developed. Both types have two thermopiles with 30 p(+)Si/Al thermocouples each. Thermal and electrical isolation is provided by a sandwich membrane (residual n-Si and sputtered oxide). The intelligent functionality is achieved by using a signal processing unit the authors developed earlier for pressure sensing based on their proprietary Si piezoresistive pressure sensing elements. The main issues which were of key importance for realization of intelligent vacuum sensors are addressed in this work: design and fabrication of the intelligent vacuum sensors, adaptation of the software module, linearization of the input signal using digital signal processing and temperature compensation. A three-udstage test procedure is presented. The A-type sensor, with a thinner membrane, achieved 19 times better thermopile voltage-pressure sensitivity compared with the P-type sensor, with a thicker membrane. Since the estimated noise level of the measuring system is comparable with the useful signal of the Ptype device, the improved voltage-pressure sensitivity provides a better resolution and signal to noise ratio of the intelligent vacuum measuring system.en
dc.publisherPergamon-Elsevier Science Ltd, Oxford
dc.relationinfo:eu-repo/grantAgreement/MESTD/Technological Development (TD or TR)/32008/RS//
dc.relationinfo:eu-repo/grantAgreement/EC/FP7/205533/EU//
dc.rightsrestrictedAccess
dc.sourceVacuum
dc.subjectThermopileen
dc.subjectVacuum sensoren
dc.subjectIntelligent sensoren
dc.subjectPressure measurementen
dc.subjectDigital signal processingen
dc.titleIntelligent thermal vacuum sensors based on multipurpose thermopile MEMS chipsen
dc.typearticle
dc.rights.licenseARR
dcterms.abstractПоповић, Богдан; Миљковиц, Будимир Л.; Ранђеловић, Данијела; Јакшић, Зоран; Франтловић, Милош;
dc.citation.volume101
dc.citation.spage118
dc.citation.epage124
dc.citation.other101: 118-124
dc.citation.rankM22
dc.identifier.doi10.1016/j.vacuum.2013.07.044
dc.identifier.rcubConv_3103
dc.identifier.scopus2-s2.0-84883860148
dc.identifier.wos000330143000022
dc.type.versionpublishedVersion


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