CER - Central Repository
Institute of Chemistry, Technology and Metallurgy
    • English
    • Српски
    • Српски (Serbia)
  • English 
    • English
    • Serbian (Cyrillic)
    • Serbian (Latin)
  • Login
View Item 
  •   CER
  • IHTM
  • Radovi istraživača / Researchers' publications
  • View Item
  •   CER
  • IHTM
  • Radovi istraživača / Researchers' publications
  • View Item
JavaScript is disabled for your browser. Some features of this site may not work without it.

Intelligent thermal vacuum sensors based on multipurpose thermopile MEMS chips

Authorized Users Only
2014
Authors
Randjelović, Danijela
Frantlović, Miloš
Miljkovic, Budimir L.
Popović, Bogdan
Jakšić, Zoran
Article (Published version)
Metadata
Show full item record
Abstract
Realization of intelligent thermal vacuum sensors based on multipurpose thermopile micro-electromechanical (MEMS) chips is presented in this work. These vacuum sensors satisfy the main requirements for contemporary sensors, they are cost-effective in both fabrication and operation, and simple to use. Intelligent devices based on two types of thermal sensors, A-type with Al heater, and Ptype with p(+)Si heater, were developed. Both types have two thermopiles with 30 p(+)Si/Al thermocouples each. Thermal and electrical isolation is provided by a sandwich membrane (residual n-Si and sputtered oxide). The intelligent functionality is achieved by using a signal processing unit the authors developed earlier for pressure sensing based on their proprietary Si piezoresistive pressure sensing elements. The main issues which were of key importance for realization of intelligent vacuum sensors are addressed in this work: design and fabrication of the intelligent vacuum sensors, adaptation of the s...oftware module, linearization of the input signal using digital signal processing and temperature compensation. A three-udstage test procedure is presented. The A-type sensor, with a thinner membrane, achieved 19 times better thermopile voltage-pressure sensitivity compared with the P-type sensor, with a thicker membrane. Since the estimated noise level of the measuring system is comparable with the useful signal of the Ptype device, the improved voltage-pressure sensitivity provides a better resolution and signal to noise ratio of the intelligent vacuum measuring system.

Keywords:
Thermopile / Vacuum sensor / Intelligent sensor / Pressure measurement / Digital signal processing
Source:
Vacuum, 2014, 101, 118-124
Publisher:
  • Oxford : Pergamon-Elsevier Science Ltd
Funding / projects:
  • Micro- Nanosystems and Sensors for Electric Power and Process Industry and Environmental Protection (RS-32008)
  • Reinforcement of Regional Microsystems and Nanosystems Centre (EU-205533)

DOI: 10.1016/j.vacuum.2013.07.044

ISSN: 0042-207X

WoS: 000330143000022

Scopus: 2-s2.0-84883860148
[ Google Scholar ]
20
17
URI
https://cer.ihtm.bg.ac.rs/handle/123456789/1533
Collections
  • Radovi istraživača / Researchers' publications
Institution/Community
IHTM
TY  - JOUR
AU  - Randjelović, Danijela
AU  - Frantlović, Miloš
AU  - Miljkovic, Budimir L.
AU  - Popović, Bogdan
AU  - Jakšić, Zoran
PY  - 2014
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/1533
AB  - Realization of intelligent thermal vacuum sensors based on multipurpose thermopile micro-electromechanical (MEMS) chips is presented in this work. These vacuum sensors satisfy the main requirements for contemporary sensors, they are cost-effective in both fabrication and operation, and simple to use. Intelligent devices based on two types of thermal sensors, A-type with Al heater, and Ptype with p(+)Si heater, were developed. Both types have two thermopiles with 30 p(+)Si/Al thermocouples each. Thermal and electrical isolation is provided by a sandwich membrane (residual n-Si and sputtered oxide). The intelligent functionality is achieved by using a signal processing unit the authors developed earlier for pressure sensing based on their proprietary Si piezoresistive pressure sensing elements. The main issues which were of key importance for realization of intelligent vacuum sensors are addressed in this work: design and fabrication of the intelligent vacuum sensors, adaptation of the software module, linearization of the input signal using digital signal processing and temperature compensation. A three-udstage test procedure is presented. The A-type sensor, with a thinner membrane, achieved 19 times better thermopile voltage-pressure sensitivity compared with the P-type sensor, with a thicker membrane. Since the estimated noise level of the measuring system is comparable with the useful signal of the Ptype device, the improved voltage-pressure sensitivity provides a better resolution and signal to noise ratio of the intelligent vacuum measuring system.
PB  - Oxford : Pergamon-Elsevier Science Ltd
T2  - Vacuum
T1  - Intelligent thermal vacuum sensors based on multipurpose thermopile MEMS chips
VL  - 101
SP  - 118
EP  - 124
DO  - 10.1016/j.vacuum.2013.07.044
ER  - 
@article{
author = "Randjelović, Danijela and Frantlović, Miloš and Miljkovic, Budimir L. and Popović, Bogdan and Jakšić, Zoran",
year = "2014",
abstract = "Realization of intelligent thermal vacuum sensors based on multipurpose thermopile micro-electromechanical (MEMS) chips is presented in this work. These vacuum sensors satisfy the main requirements for contemporary sensors, they are cost-effective in both fabrication and operation, and simple to use. Intelligent devices based on two types of thermal sensors, A-type with Al heater, and Ptype with p(+)Si heater, were developed. Both types have two thermopiles with 30 p(+)Si/Al thermocouples each. Thermal and electrical isolation is provided by a sandwich membrane (residual n-Si and sputtered oxide). The intelligent functionality is achieved by using a signal processing unit the authors developed earlier for pressure sensing based on their proprietary Si piezoresistive pressure sensing elements. The main issues which were of key importance for realization of intelligent vacuum sensors are addressed in this work: design and fabrication of the intelligent vacuum sensors, adaptation of the software module, linearization of the input signal using digital signal processing and temperature compensation. A three-udstage test procedure is presented. The A-type sensor, with a thinner membrane, achieved 19 times better thermopile voltage-pressure sensitivity compared with the P-type sensor, with a thicker membrane. Since the estimated noise level of the measuring system is comparable with the useful signal of the Ptype device, the improved voltage-pressure sensitivity provides a better resolution and signal to noise ratio of the intelligent vacuum measuring system.",
publisher = "Oxford : Pergamon-Elsevier Science Ltd",
journal = "Vacuum",
title = "Intelligent thermal vacuum sensors based on multipurpose thermopile MEMS chips",
volume = "101",
pages = "118-124",
doi = "10.1016/j.vacuum.2013.07.044"
}
Randjelović, D., Frantlović, M., Miljkovic, B. L., Popović, B.,& Jakšić, Z.. (2014). Intelligent thermal vacuum sensors based on multipurpose thermopile MEMS chips. in Vacuum
Oxford : Pergamon-Elsevier Science Ltd., 101, 118-124.
https://doi.org/10.1016/j.vacuum.2013.07.044
Randjelović D, Frantlović M, Miljkovic BL, Popović B, Jakšić Z. Intelligent thermal vacuum sensors based on multipurpose thermopile MEMS chips. in Vacuum. 2014;101:118-124.
doi:10.1016/j.vacuum.2013.07.044 .
Randjelović, Danijela, Frantlović, Miloš, Miljkovic, Budimir L., Popović, Bogdan, Jakšić, Zoran, "Intelligent thermal vacuum sensors based on multipurpose thermopile MEMS chips" in Vacuum, 101 (2014):118-124,
https://doi.org/10.1016/j.vacuum.2013.07.044 . .

DSpace software copyright © 2002-2015  DuraSpace
About CeR – Central Repository | Send Feedback

re3dataOpenAIRERCUB
 

 

All of DSpaceInstitutions/communitiesAuthorsTitlesSubjectsThis institutionAuthorsTitlesSubjects

Statistics

View Usage Statistics

DSpace software copyright © 2002-2015  DuraSpace
About CeR – Central Repository | Send Feedback

re3dataOpenAIRERCUB