Intelligent thermal vacuum sensors based on multipurpose thermopile MEMS chips
Abstract
Realization of intelligent thermal vacuum sensors based on multipurpose thermopile micro-electromechanical (MEMS) chips is presented in this work. These vacuum sensors satisfy the main requirements for contemporary sensors, they are cost-effective in both fabrication and operation, and simple to use. Intelligent devices based on two types of thermal sensors, A-type with Al heater, and Ptype with p(+)Si heater, were developed. Both types have two thermopiles with 30 p(+)Si/Al thermocouples each. Thermal and electrical isolation is provided by a sandwich membrane (residual n-Si and sputtered oxide). The intelligent functionality is achieved by using a signal processing unit the authors developed earlier for pressure sensing based on their proprietary Si piezoresistive pressure sensing elements. The main issues which were of key importance for realization of intelligent vacuum sensors are addressed in this work: design and fabrication of the intelligent vacuum sensors, adaptation of the s...oftware module, linearization of the input signal using digital signal processing and temperature compensation. A three-udstage test procedure is presented. The A-type sensor, with a thinner membrane, achieved 19 times better thermopile voltage-pressure sensitivity compared with the P-type sensor, with a thicker membrane. Since the estimated noise level of the measuring system is comparable with the useful signal of the Ptype device, the improved voltage-pressure sensitivity provides a better resolution and signal to noise ratio of the intelligent vacuum measuring system.
Keywords:
Thermopile / Vacuum sensor / Intelligent sensor / Pressure measurement / Digital signal processingSource:
Vacuum, 2014, 101, 118-124Publisher:
- Oxford : Pergamon-Elsevier Science Ltd
Funding / projects:
- Micro- Nanosystems and Sensors for Electric Power and Process Industry and Environmental Protection (RS-32008)
- Reinforcement of Regional Microsystems and Nanosystems Centre (EU-205533)
DOI: 10.1016/j.vacuum.2013.07.044
ISSN: 0042-207X
WoS: 000330143000022
Scopus: 2-s2.0-84883860148
Collections
Institution/Community
IHTMTY - JOUR AU - Randjelović, Danijela AU - Frantlović, Miloš AU - Miljkovic, Budimir L. AU - Popović, Bogdan AU - Jakšić, Zoran PY - 2014 UR - https://cer.ihtm.bg.ac.rs/handle/123456789/1533 AB - Realization of intelligent thermal vacuum sensors based on multipurpose thermopile micro-electromechanical (MEMS) chips is presented in this work. These vacuum sensors satisfy the main requirements for contemporary sensors, they are cost-effective in both fabrication and operation, and simple to use. Intelligent devices based on two types of thermal sensors, A-type with Al heater, and Ptype with p(+)Si heater, were developed. Both types have two thermopiles with 30 p(+)Si/Al thermocouples each. Thermal and electrical isolation is provided by a sandwich membrane (residual n-Si and sputtered oxide). The intelligent functionality is achieved by using a signal processing unit the authors developed earlier for pressure sensing based on their proprietary Si piezoresistive pressure sensing elements. The main issues which were of key importance for realization of intelligent vacuum sensors are addressed in this work: design and fabrication of the intelligent vacuum sensors, adaptation of the software module, linearization of the input signal using digital signal processing and temperature compensation. A three-udstage test procedure is presented. The A-type sensor, with a thinner membrane, achieved 19 times better thermopile voltage-pressure sensitivity compared with the P-type sensor, with a thicker membrane. Since the estimated noise level of the measuring system is comparable with the useful signal of the Ptype device, the improved voltage-pressure sensitivity provides a better resolution and signal to noise ratio of the intelligent vacuum measuring system. PB - Oxford : Pergamon-Elsevier Science Ltd T2 - Vacuum T1 - Intelligent thermal vacuum sensors based on multipurpose thermopile MEMS chips VL - 101 SP - 118 EP - 124 DO - 10.1016/j.vacuum.2013.07.044 ER -
@article{ author = "Randjelović, Danijela and Frantlović, Miloš and Miljkovic, Budimir L. and Popović, Bogdan and Jakšić, Zoran", year = "2014", abstract = "Realization of intelligent thermal vacuum sensors based on multipurpose thermopile micro-electromechanical (MEMS) chips is presented in this work. These vacuum sensors satisfy the main requirements for contemporary sensors, they are cost-effective in both fabrication and operation, and simple to use. Intelligent devices based on two types of thermal sensors, A-type with Al heater, and Ptype with p(+)Si heater, were developed. Both types have two thermopiles with 30 p(+)Si/Al thermocouples each. Thermal and electrical isolation is provided by a sandwich membrane (residual n-Si and sputtered oxide). The intelligent functionality is achieved by using a signal processing unit the authors developed earlier for pressure sensing based on their proprietary Si piezoresistive pressure sensing elements. The main issues which were of key importance for realization of intelligent vacuum sensors are addressed in this work: design and fabrication of the intelligent vacuum sensors, adaptation of the software module, linearization of the input signal using digital signal processing and temperature compensation. A three-udstage test procedure is presented. The A-type sensor, with a thinner membrane, achieved 19 times better thermopile voltage-pressure sensitivity compared with the P-type sensor, with a thicker membrane. Since the estimated noise level of the measuring system is comparable with the useful signal of the Ptype device, the improved voltage-pressure sensitivity provides a better resolution and signal to noise ratio of the intelligent vacuum measuring system.", publisher = "Oxford : Pergamon-Elsevier Science Ltd", journal = "Vacuum", title = "Intelligent thermal vacuum sensors based on multipurpose thermopile MEMS chips", volume = "101", pages = "118-124", doi = "10.1016/j.vacuum.2013.07.044" }
Randjelović, D., Frantlović, M., Miljkovic, B. L., Popović, B.,& Jakšić, Z.. (2014). Intelligent thermal vacuum sensors based on multipurpose thermopile MEMS chips. in Vacuum Oxford : Pergamon-Elsevier Science Ltd., 101, 118-124. https://doi.org/10.1016/j.vacuum.2013.07.044
Randjelović D, Frantlović M, Miljkovic BL, Popović B, Jakšić Z. Intelligent thermal vacuum sensors based on multipurpose thermopile MEMS chips. in Vacuum. 2014;101:118-124. doi:10.1016/j.vacuum.2013.07.044 .
Randjelović, Danijela, Frantlović, Miloš, Miljkovic, Budimir L., Popović, Bogdan, Jakšić, Zoran, "Intelligent thermal vacuum sensors based on multipurpose thermopile MEMS chips" in Vacuum, 101 (2014):118-124, https://doi.org/10.1016/j.vacuum.2013.07.044 . .