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dc.creatorMarkovic, B.
dc.creatorŽivković, Dragana
dc.creatorManasijević, Dragan
dc.creatorSokic, M.
dc.creatorMinic, D.
dc.creatorTalijan, Nadežda M.
dc.creatorStajić-Trošić, Jasna
dc.date.accessioned2019-01-30T17:41:13Z
dc.date.available2019-01-30T17:41:13Z
dc.date.issued2014
dc.identifier.issn1733-3490
dc.identifier.urihttp://cer.ihtm.bg.ac.rs/handle/123456789/1514
dc.description.abstractThe Bi-Cu-Ni ternary system belongs to the group of potential Cu-Ni-based advanced lead-free solder materials for high temperature application. In this study microstructure investigation of the slow-cooled Bi-Cu-Ni samples was done using SEM-EDS analysis. The samples compositions were chosen along three cross-sections with molar ratio Cu:Ni=1:3, 1:1 and 3:1. The experimentally obtained phase structure was compared with the results of thermodynamic calculation according to CALPHAD method. Also, new results regarding thermal and electrical properties investigations of these alloys are presented in this paper, based on DSC and electroconductivity measurements.en
dc.publisherPolish Acad Sciences Committee Metallurgy, Krakow
dc.relationinfo:eu-repo/grantAgreement/MESTD/Basic Research (BR or ON)/172037/RS//
dc.relationCOST Action - MP 0602
dc.rightsopenAccess
dc.sourceArchives of Metallurgy and Materials
dc.subjectBi-Cu-Ni alloysen
dc.subjectlead-free soldersen
dc.subjectcharacterizationen
dc.titleThermal, structural and electrical properties of some bi-cu-ni alloysen
dc.typearticle
dc.rights.licenseARR
dc.citation.volume59
dc.citation.issue1
dc.citation.spage117
dc.citation.epage120
dc.citation.other59(1): 117-120
dc.citation.rankM22
dc.identifier.doi10.2478/amm-2014-0018
dc.identifier.rcubConv_3138
dc.identifier.fulltexthttp://cer.ihtm.bg.ac.rs//bitstream/id/7985/1512.pdf
dc.identifier.scopus2-s2.0-84898607931
dc.identifier.wos000333983900018
dc.type.versionpublishedVersion


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