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Thermal, structural and electrical properties of some bi-cu-ni alloys

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2014
1512.pdf (467.2Kb)
Authors
Markovic, B.
Živković, Dragana
Manasijević, Dragan
Sokic, M.
Minic, D.
Talijan, Nadežda M.
Stajić-Trošić, Jasna
Article (Published version)
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Abstract
The Bi-Cu-Ni ternary system belongs to the group of potential Cu-Ni-based advanced lead-free solder materials for high temperature application. In this study microstructure investigation of the slow-cooled Bi-Cu-Ni samples was done using SEM-EDS analysis. The samples compositions were chosen along three cross-sections with molar ratio Cu:Ni=1:3, 1:1 and 3:1. The experimentally obtained phase structure was compared with the results of thermodynamic calculation according to CALPHAD method. Also, new results regarding thermal and electrical properties investigations of these alloys are presented in this paper, based on DSC and electroconductivity measurements.
Keywords:
Bi-Cu-Ni alloys / lead-free solders / characterization
Source:
Archives of Metallurgy and Materials, 2014, 59, 1, 117-120
Publisher:
  • Polish Acad Sciences Committee Metallurgy, Krakow
Projects:
  • Advanced multicomponent metal systems and nanostructured materials with diverse functional properties (RS-172037)
  • COST Action - MP 0602

DOI: 10.2478/amm-2014-0018

ISSN: 1733-3490

WoS: 000333983900018

Scopus: 2-s2.0-84898607931
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URI
http://cer.ihtm.bg.ac.rs/handle/123456789/1514
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IHTM

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