In industrial processes, as well as in many other fields from vehicles to healthcare, temperature and pressure are the most common parameters to be measured and monitored. Silicon microelectromechanical (MEMS) piezoresistive pressure sensors are the first and the most successful MEMS sensors, widely used in the industry in various measurement configurations. The inherent temperature dependence of the output signal of such sensors adversely affects their pressure measurement performance. However, it can be utilized for temperature measurement, thus enabling new sensor applications. In this paper a method is presented for temperature measurement using MEMS piezoresistive pressure sensors.
Source:
Proceedings of the International Conference on Microelectronics, ICM, 2014, 159-161
Publisher:
Institute of Electrical and Electronics Engineers Inc.
TY - CONF
AU - Frantlović, Miloš
AU - Jokić, Ivana
AU - Lazić, Žarko
AU - Vukelic, B.
AU - Obradov, Marko
AU - Vasiljević-Radović, Dana
PY - 2014
UR - https://cer.ihtm.bg.ac.rs/handle/123456789/1452
AB - In industrial processes, as well as in many other fields from vehicles to healthcare, temperature and pressure are the most common parameters to be measured and monitored. Silicon microelectromechanical (MEMS) piezoresistive pressure sensors are the first and the most successful MEMS sensors, widely used in the industry in various measurement configurations. The inherent temperature dependence of the output signal of such sensors adversely affects their pressure measurement performance. However, it can be utilized for temperature measurement, thus enabling new sensor applications. In this paper a method is presented for temperature measurement using MEMS piezoresistive pressure sensors.
PB - Institute of Electrical and Electronics Engineers Inc.
C3 - Proceedings of the International Conference on Microelectronics, ICM
T1 - Temperature Measurement Using Silicon Piezoresistive MEMS Pressure Sensors
SP - 159
EP - 161
DO - 10.1109/MIEL.2014.6842110
ER -
@conference{
author = "Frantlović, Miloš and Jokić, Ivana and Lazić, Žarko and Vukelic, B. and Obradov, Marko and Vasiljević-Radović, Dana",
year = "2014",
abstract = "In industrial processes, as well as in many other fields from vehicles to healthcare, temperature and pressure are the most common parameters to be measured and monitored. Silicon microelectromechanical (MEMS) piezoresistive pressure sensors are the first and the most successful MEMS sensors, widely used in the industry in various measurement configurations. The inherent temperature dependence of the output signal of such sensors adversely affects their pressure measurement performance. However, it can be utilized for temperature measurement, thus enabling new sensor applications. In this paper a method is presented for temperature measurement using MEMS piezoresistive pressure sensors.",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
journal = "Proceedings of the International Conference on Microelectronics, ICM",
title = "Temperature Measurement Using Silicon Piezoresistive MEMS Pressure Sensors",
pages = "159-161",
doi = "10.1109/MIEL.2014.6842110"
}
Frantlović, M., Jokić, I., Lazić, Ž., Vukelic, B., Obradov, M.,& Vasiljević-Radović, D.. (2014). Temperature Measurement Using Silicon Piezoresistive MEMS Pressure Sensors. in Proceedings of the International Conference on Microelectronics, ICM
Institute of Electrical and Electronics Engineers Inc.., 159-161.
https://doi.org/10.1109/MIEL.2014.6842110
Frantlović M, Jokić I, Lazić Ž, Vukelic B, Obradov M, Vasiljević-Radović D. Temperature Measurement Using Silicon Piezoresistive MEMS Pressure Sensors. in Proceedings of the International Conference on Microelectronics, ICM. 2014;:159-161.
doi:10.1109/MIEL.2014.6842110 .
Frantlović, Miloš, Jokić, Ivana, Lazić, Žarko, Vukelic, B., Obradov, Marko, Vasiljević-Radović, Dana, "Temperature Measurement Using Silicon Piezoresistive MEMS Pressure Sensors" in Proceedings of the International Conference on Microelectronics, ICM (2014):159-161,
https://doi.org/10.1109/MIEL.2014.6842110 . .
