CER - Central Repository
Institute of Chemistry, Technology and Metallurgy
    • English
    • Српски
    • Српски (Serbia)
  • English 
    • English
    • Serbian (Cyrillic)
    • Serbian (Latin)
  • Login
View Item 
  •   CER
  • IHTM
  • Radovi istraživača / Researchers' publications
  • View Item
  •   CER
  • IHTM
  • Radovi istraživača / Researchers' publications
  • View Item
JavaScript is disabled for your browser. Some features of this site may not work without it.

Glass Micromachining with Sputtered Silicon as a Masking Layer

Authorized Users Only
2014
Authors
Lazić, Žarko
Smiljanić, Milče
Rašljić, Milena
Conference object (Published version)
Metadata
Show full item record
Abstract
In this work we present the not so commonly use of RF sputtered silicon as a masking layer for glass wet etching. The main advantages of this technique are low deposition temperature of silicon layer compared to PECVD and LPCVD processes, simplicity to use and low cost. Si layers were sputtered on 2.5x2.5cm(2) Pyrex 7740 substrates. The measured thickness of deposited silicon layer was 2.2 mu m. Silicon layer was patterned using lift-off technique. Etching was done in undilluted HF (49%) with estimated etch rate of similar to 8 mu m/min. Good quality of the glass surface without pinholes and notch defects on the glass etched edges suggests that using sp-Si layer as a masking material for glass etching is feasible.
Source:
Proceedings of the International Conference on Microelectronics, ICM, 2014, 175-178
Publisher:
  • Institute of Electrical and Electronics Engineers Inc.

DOI: 10.1109/MIEL.2014.6842114

ISSN: 2159-1660

WoS: 000360788600034

Scopus: 2-s2.0-84904689658
[ Google Scholar ]
1
1
URI
https://cer.ihtm.bg.ac.rs/handle/123456789/1449
Collections
  • Radovi istraživača / Researchers' publications
Institution/Community
IHTM
TY  - CONF
AU  - Lazić, Žarko
AU  - Smiljanić, Milče
AU  - Rašljić, Milena
PY  - 2014
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/1449
AB  - In this work we present the not so commonly use of RF sputtered silicon as a masking layer for glass wet etching. The main advantages of this technique are low deposition temperature of silicon layer compared to PECVD and LPCVD processes, simplicity to use and low cost. Si layers were sputtered on 2.5x2.5cm(2) Pyrex 7740 substrates. The measured thickness of deposited silicon layer was 2.2 mu m. Silicon layer was patterned using lift-off technique. Etching was done in undilluted HF (49%) with estimated etch rate of similar to 8 mu m/min. Good quality of the glass surface without pinholes and notch defects on the glass etched edges suggests that using sp-Si layer as a masking material for glass etching is feasible.
PB  - Institute of Electrical and Electronics Engineers Inc.
C3  - Proceedings of the International Conference on Microelectronics, ICM
T1  - Glass Micromachining with Sputtered Silicon as a Masking Layer
SP  - 175
EP  - 178
DO  - 10.1109/MIEL.2014.6842114
ER  - 
@conference{
author = "Lazić, Žarko and Smiljanić, Milče and Rašljić, Milena",
year = "2014",
abstract = "In this work we present the not so commonly use of RF sputtered silicon as a masking layer for glass wet etching. The main advantages of this technique are low deposition temperature of silicon layer compared to PECVD and LPCVD processes, simplicity to use and low cost. Si layers were sputtered on 2.5x2.5cm(2) Pyrex 7740 substrates. The measured thickness of deposited silicon layer was 2.2 mu m. Silicon layer was patterned using lift-off technique. Etching was done in undilluted HF (49%) with estimated etch rate of similar to 8 mu m/min. Good quality of the glass surface without pinholes and notch defects on the glass etched edges suggests that using sp-Si layer as a masking material for glass etching is feasible.",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
journal = "Proceedings of the International Conference on Microelectronics, ICM",
title = "Glass Micromachining with Sputtered Silicon as a Masking Layer",
pages = "175-178",
doi = "10.1109/MIEL.2014.6842114"
}
Lazić, Ž., Smiljanić, M.,& Rašljić, M.. (2014). Glass Micromachining with Sputtered Silicon as a Masking Layer. in Proceedings of the International Conference on Microelectronics, ICM
Institute of Electrical and Electronics Engineers Inc.., 175-178.
https://doi.org/10.1109/MIEL.2014.6842114
Lazić Ž, Smiljanić M, Rašljić M. Glass Micromachining with Sputtered Silicon as a Masking Layer. in Proceedings of the International Conference on Microelectronics, ICM. 2014;:175-178.
doi:10.1109/MIEL.2014.6842114 .
Lazić, Žarko, Smiljanić, Milče, Rašljić, Milena, "Glass Micromachining with Sputtered Silicon as a Masking Layer" in Proceedings of the International Conference on Microelectronics, ICM (2014):175-178,
https://doi.org/10.1109/MIEL.2014.6842114 . .

DSpace software copyright © 2002-2015  DuraSpace
About CeR – Central Repository | Send Feedback

re3dataOpenAIRERCUB
 

 

All of DSpaceInstitutions/communitiesAuthorsTitlesSubjectsThis institutionAuthorsTitlesSubjects

Statistics

View Usage Statistics

DSpace software copyright © 2002-2015  DuraSpace
About CeR – Central Repository | Send Feedback

re3dataOpenAIRERCUB