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dc.creatorLamovec, Jelena
dc.creatorJović, Vesna
dc.creatorMladenović, Ivana
dc.creatorSarajlić, Milija
dc.creatorRadojević, Vesna
dc.date.accessioned2019-01-30T17:39:50Z
dc.date.available2019-01-30T17:39:50Z
dc.date.issued2014
dc.identifier.issn2159-1660
dc.identifier.urihttp://cer.ihtm.bg.ac.rs/handle/123456789/1447
dc.description.abstractNickel and copper thin films were alternately electrodeposited from sulphamate and sulphate-based electrolytes respectively, on different substrates: polycrystalline cold rolled copper, single crystal (111)-oriented Si and 100 mu m-thick electrodeposited nickel films. Electrodeposition of layers at a very narrow spacing contribute to high strength of the composites. The influence of the substrate and plating conditions on the mechanical properties of these composite structures were investigated by Vickers microhardness testing for different loads. Composite hardness models were applied to the experimental data in order to obtaine absolute film hardness.en
dc.publisherInstitute of Electrical and Electronics Engineers Inc.
dc.relationinfo:eu-repo/grantAgreement/MESTD/Technological Development (TD or TR)/32008/RS//
dc.rightsrestrictedAccess
dc.sourceProceedings of the International Conference on Microelectronics, ICM
dc.titleAssessment of the Composite Behavior of Different Ni/Cu Multilayer Composite Systemsen
dc.typeconferenceObject
dc.rights.licenseARR
dcterms.abstractМладеновић, Ивана; Ламовец, Јелена; Радојевиц, В.; Јовић, Весна; Сарајлић, Милија;
dc.citation.spage183
dc.citation.epage186
dc.citation.other: 183-186
dc.identifier.doi10.1109/MIEL.2014.6842116
dc.identifier.rcubConv_3407
dc.identifier.scopus2-s2.0-84904645814
dc.identifier.wos000360788600036
dc.type.versionpublishedVersion


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