Assessment of the Composite Behavior of Different Ni/Cu Multilayer Composite Systems
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2014
Konferencijski prilog (Objavljena verzija)

Metapodaci
Prikaz svih podataka o dokumentuApstrakt
Nickel and copper thin films were alternately electrodeposited from sulphamate and sulphate-based electrolytes respectively, on different substrates: polycrystalline cold rolled copper, single crystal (111)-oriented Si and 100 mu m-thick electrodeposited nickel films. Electrodeposition of layers at a very narrow spacing contribute to high strength of the composites. The influence of the substrate and plating conditions on the mechanical properties of these composite structures were investigated by Vickers microhardness testing for different loads. Composite hardness models were applied to the experimental data in order to obtaine absolute film hardness.
Izvor:
Proceedings of the International Conference on Microelectronics, ICM, 2014, 183-186Izdavač:
- Institute of Electrical and Electronics Engineers Inc.
Finansiranje / projekti:
DOI: 10.1109/MIEL.2014.6842116
ISSN: 2159-1660
WoS: 000360788600036
Scopus: 2-s2.0-84904645814
Institucija/grupa
IHTMTY - CONF AU - Lamovec, Jelena AU - Jović, Vesna AU - Mladenović, Ivana AU - Sarajlić, Milija AU - Radojević, Vesna PY - 2014 UR - https://cer.ihtm.bg.ac.rs/handle/123456789/1447 AB - Nickel and copper thin films were alternately electrodeposited from sulphamate and sulphate-based electrolytes respectively, on different substrates: polycrystalline cold rolled copper, single crystal (111)-oriented Si and 100 mu m-thick electrodeposited nickel films. Electrodeposition of layers at a very narrow spacing contribute to high strength of the composites. The influence of the substrate and plating conditions on the mechanical properties of these composite structures were investigated by Vickers microhardness testing for different loads. Composite hardness models were applied to the experimental data in order to obtaine absolute film hardness. PB - Institute of Electrical and Electronics Engineers Inc. C3 - Proceedings of the International Conference on Microelectronics, ICM T1 - Assessment of the Composite Behavior of Different Ni/Cu Multilayer Composite Systems SP - 183 EP - 186 DO - 10.1109/MIEL.2014.6842116 ER -
@conference{ author = "Lamovec, Jelena and Jović, Vesna and Mladenović, Ivana and Sarajlić, Milija and Radojević, Vesna", year = "2014", abstract = "Nickel and copper thin films were alternately electrodeposited from sulphamate and sulphate-based electrolytes respectively, on different substrates: polycrystalline cold rolled copper, single crystal (111)-oriented Si and 100 mu m-thick electrodeposited nickel films. Electrodeposition of layers at a very narrow spacing contribute to high strength of the composites. The influence of the substrate and plating conditions on the mechanical properties of these composite structures were investigated by Vickers microhardness testing for different loads. Composite hardness models were applied to the experimental data in order to obtaine absolute film hardness.", publisher = "Institute of Electrical and Electronics Engineers Inc.", journal = "Proceedings of the International Conference on Microelectronics, ICM", title = "Assessment of the Composite Behavior of Different Ni/Cu Multilayer Composite Systems", pages = "183-186", doi = "10.1109/MIEL.2014.6842116" }
Lamovec, J., Jović, V., Mladenović, I., Sarajlić, M.,& Radojević, V.. (2014). Assessment of the Composite Behavior of Different Ni/Cu Multilayer Composite Systems. in Proceedings of the International Conference on Microelectronics, ICM Institute of Electrical and Electronics Engineers Inc.., 183-186. https://doi.org/10.1109/MIEL.2014.6842116
Lamovec J, Jović V, Mladenović I, Sarajlić M, Radojević V. Assessment of the Composite Behavior of Different Ni/Cu Multilayer Composite Systems. in Proceedings of the International Conference on Microelectronics, ICM. 2014;:183-186. doi:10.1109/MIEL.2014.6842116 .
Lamovec, Jelena, Jović, Vesna, Mladenović, Ivana, Sarajlić, Milija, Radojević, Vesna, "Assessment of the Composite Behavior of Different Ni/Cu Multilayer Composite Systems" in Proceedings of the International Conference on Microelectronics, ICM (2014):183-186, https://doi.org/10.1109/MIEL.2014.6842116 . .