Nickel and copper thin films were alternately electrodeposited from sulphamate and sulphate-based electrolytes respectively, on different substrates: polycrystalline cold rolled copper, single crystal (111)-oriented Si and 100 mu m-thick electrodeposited nickel films. Electrodeposition of layers at a very narrow spacing contribute to high strength of the composites. The influence of the substrate and plating conditions on the mechanical properties of these composite structures were investigated by Vickers microhardness testing for different loads. Composite hardness models were applied to the experimental data in order to obtaine absolute film hardness.
Source:
Proceedings of the International Conference on Microelectronics, ICM, 2014, 183-186
Publisher:
Institute of Electrical and Electronics Engineers Inc.
TY - CONF
AU - Lamovec, Jelena
AU - Jović, Vesna
AU - Mladenović, Ivana
AU - Sarajlić, Milija
AU - Radojević, Vesna
PY - 2014
UR - https://cer.ihtm.bg.ac.rs/handle/123456789/1447
AB - Nickel and copper thin films were alternately electrodeposited from sulphamate and sulphate-based electrolytes respectively, on different substrates: polycrystalline cold rolled copper, single crystal (111)-oriented Si and 100 mu m-thick electrodeposited nickel films. Electrodeposition of layers at a very narrow spacing contribute to high strength of the composites. The influence of the substrate and plating conditions on the mechanical properties of these composite structures were investigated by Vickers microhardness testing for different loads. Composite hardness models were applied to the experimental data in order to obtaine absolute film hardness.
PB - Institute of Electrical and Electronics Engineers Inc.
C3 - Proceedings of the International Conference on Microelectronics, ICM
T1 - Assessment of the Composite Behavior of Different Ni/Cu Multilayer Composite Systems
SP - 183
EP - 186
DO - 10.1109/MIEL.2014.6842116
ER -
@conference{
author = "Lamovec, Jelena and Jović, Vesna and Mladenović, Ivana and Sarajlić, Milija and Radojević, Vesna",
year = "2014",
abstract = "Nickel and copper thin films were alternately electrodeposited from sulphamate and sulphate-based electrolytes respectively, on different substrates: polycrystalline cold rolled copper, single crystal (111)-oriented Si and 100 mu m-thick electrodeposited nickel films. Electrodeposition of layers at a very narrow spacing contribute to high strength of the composites. The influence of the substrate and plating conditions on the mechanical properties of these composite structures were investigated by Vickers microhardness testing for different loads. Composite hardness models were applied to the experimental data in order to obtaine absolute film hardness.",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
journal = "Proceedings of the International Conference on Microelectronics, ICM",
title = "Assessment of the Composite Behavior of Different Ni/Cu Multilayer Composite Systems",
pages = "183-186",
doi = "10.1109/MIEL.2014.6842116"
}
Lamovec, J., Jović, V., Mladenović, I., Sarajlić, M.,& Radojević, V.. (2014). Assessment of the Composite Behavior of Different Ni/Cu Multilayer Composite Systems. in Proceedings of the International Conference on Microelectronics, ICM
Institute of Electrical and Electronics Engineers Inc.., 183-186.
https://doi.org/10.1109/MIEL.2014.6842116
Lamovec J, Jović V, Mladenović I, Sarajlić M, Radojević V. Assessment of the Composite Behavior of Different Ni/Cu Multilayer Composite Systems. in Proceedings of the International Conference on Microelectronics, ICM. 2014;:183-186.
doi:10.1109/MIEL.2014.6842116 .
Lamovec, Jelena, Jović, Vesna, Mladenović, Ivana, Sarajlić, Milija, Radojević, Vesna, "Assessment of the Composite Behavior of Different Ni/Cu Multilayer Composite Systems" in Proceedings of the International Conference on Microelectronics, ICM (2014):183-186,
https://doi.org/10.1109/MIEL.2014.6842116 . .
