Lead-free solders with copper are considered as a possible substitution for standard lead-tin solders. Ternary Bi-Cu-In system is a potential soldering material based on copper. For a more complete characterization of the ternary Bi-Cu-In system, alloys from the three vertical sections were investigated using microstructural analysis as well as by electrical conductivity and Brinell hardness measurements. The microstructures of the alloys were investigated at room temperature by application of scanning electron microscopy combined with energy dispersive spectrometry and optical microscopy. Isolines of electrical conductivity and hardness for the entire Bi-Cu-In system were calculated using regression models. In addition, a thermodynamic assessment of the system has been carried out by calculation of the isothermal section at 25 A degrees C and description of the liquidus surface using the CALPHAD method. Experimental and analytical results were found to be in a good agreement.
TY - JOUR
AU - Minić, Duško
AU - Premović, Milena
AU - Kolarevic, Milan
AU - Ćosović, Vladan
AU - Manasijević, Dragan
AU - Živković, Dragana
PY - 2013
UR - https://cer.ihtm.bg.ac.rs/handle/123456789/1202
AB - Lead-free solders with copper are considered as a possible substitution for standard lead-tin solders. Ternary Bi-Cu-In system is a potential soldering material based on copper. For a more complete characterization of the ternary Bi-Cu-In system, alloys from the three vertical sections were investigated using microstructural analysis as well as by electrical conductivity and Brinell hardness measurements. The microstructures of the alloys were investigated at room temperature by application of scanning electron microscopy combined with energy dispersive spectrometry and optical microscopy. Isolines of electrical conductivity and hardness for the entire Bi-Cu-In system were calculated using regression models. In addition, a thermodynamic assessment of the system has been carried out by calculation of the isothermal section at 25 A degrees C and description of the liquidus surface using the CALPHAD method. Experimental and analytical results were found to be in a good agreement.
PB - Springer, New York
T2 - Journal of Materials Engineering and Performance
T1 - Description of the Liquidus Surface and Characterization of Alloys of the Ternary Bi-Cu-In System
VL - 22
IS - 8
SP - 2343
EP - 2350
DO - 10.1007/s11665-013-0493-3
ER -
@article{
author = "Minić, Duško and Premović, Milena and Kolarevic, Milan and Ćosović, Vladan and Manasijević, Dragan and Živković, Dragana",
year = "2013",
abstract = "Lead-free solders with copper are considered as a possible substitution for standard lead-tin solders. Ternary Bi-Cu-In system is a potential soldering material based on copper. For a more complete characterization of the ternary Bi-Cu-In system, alloys from the three vertical sections were investigated using microstructural analysis as well as by electrical conductivity and Brinell hardness measurements. The microstructures of the alloys were investigated at room temperature by application of scanning electron microscopy combined with energy dispersive spectrometry and optical microscopy. Isolines of electrical conductivity and hardness for the entire Bi-Cu-In system were calculated using regression models. In addition, a thermodynamic assessment of the system has been carried out by calculation of the isothermal section at 25 A degrees C and description of the liquidus surface using the CALPHAD method. Experimental and analytical results were found to be in a good agreement.",
publisher = "Springer, New York",
journal = "Journal of Materials Engineering and Performance",
title = "Description of the Liquidus Surface and Characterization of Alloys of the Ternary Bi-Cu-In System",
volume = "22",
number = "8",
pages = "2343-2350",
doi = "10.1007/s11665-013-0493-3"
}
Minić, D., Premović, M., Kolarevic, M., Ćosović, V., Manasijević, D.,& Živković, D.. (2013). Description of the Liquidus Surface and Characterization of Alloys of the Ternary Bi-Cu-In System. in Journal of Materials Engineering and Performance
Springer, New York., 22(8), 2343-2350.
https://doi.org/10.1007/s11665-013-0493-3
Minić D, Premović M, Kolarevic M, Ćosović V, Manasijević D, Živković D. Description of the Liquidus Surface and Characterization of Alloys of the Ternary Bi-Cu-In System. in Journal of Materials Engineering and Performance. 2013;22(8):2343-2350.
doi:10.1007/s11665-013-0493-3 .
Minić, Duško, Premović, Milena, Kolarevic, Milan, Ćosović, Vladan, Manasijević, Dragan, Živković, Dragana, "Description of the Liquidus Surface and Characterization of Alloys of the Ternary Bi-Cu-In System" in Journal of Materials Engineering and Performance, 22, no. 8 (2013):2343-2350,
https://doi.org/10.1007/s11665-013-0493-3 . .
