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dc.creatorKozlov, A.G.
dc.creatorRanđelović, Danijela
dc.date.accessioned2019-01-30T17:33:29Z
dc.date.available2019-01-30T17:33:29Z
dc.date.issued2012
dc.identifier.urihttp://cer.ihtm.bg.ac.rs/handle/123456789/1144
dc.description.abstractThe paper presents a modelling of temperature distribution in the sandwich thermally isolated structures used in thermal microsensors. The two cases are considered: 1) the temperature distribution along the thickness of a thermally isolated structure; 2) the temperature distribution over the area of a thermally isolated structure. The basis for modeling is the eigenfunction method which is modified for the structure including several regions with homogeneous parameters. The model is applied to the concrete microsensors with sandwich thermally isolated structure. The relative error in determining the temperature distribution in replacing the two-layer structure (Si/SiO 2) by the structure with homogeneous parameters is evaluated. The temperature distributions in the regions with the thermopiles and heater and along the line of disposition of hot thermojunctions of the thermopile are determined.en
dc.relationinfo:eu-repo/grantAgreement/MESTD/Technological Development (TD or TR)/32008/RS//
dc.rightsrestrictedAccess
dc.source13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microele
dc.titleModelling of temperature distribution in thermal microsensors on sandwich thermally isolated structuresen
dc.typeconferenceObject
dc.rights.licenseARR
dcterms.abstractКозлов, A.Г.; Ранђеловић, Данијела;
dc.citation.other
dc.identifier.doi10.1109/ESimE.2012.6191765
dc.identifier.rcubConv_4284
dc.identifier.scopus2-s2.0-84861412720
dc.type.versionpublishedVersion


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