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dc.creatorFrantlović, Miloš
dc.creatorJokić, Ivana
dc.creatorSavu, Veronica
dc.creatorXie, Shenqi
dc.creatorBrugger, Juergen
dc.date.accessioned2019-01-30T17:33:15Z
dc.date.available2019-01-30T17:33:15Z
dc.date.issued2012
dc.identifier.issn0167-9317
dc.identifier.urihttp://cer.ihtm.bg.ac.rs/handle/123456789/1133
dc.description.abstractWe report for the first time the results of tensile stress testing of thin film conductive structures patterned by stencil lithography on a PI substrate. The goal of this investigation is to determine the effects that mechanical deformation occurring in real applications can have on electrical parameters of metal interconnects in flexible electronic circuits. The thickness of thin film gold conductors is of the order of 10 nm. while their lateral dimensions are in the micrometer range. Electrical parameters of thin film conductors are measured under uniaxial tensile stress and in the relaxed state after subjecting them to a number of stretching and relaxation cycles. SEM imaging of the test structures was used for observing of possible changes in thin film surface morphology caused by the applied tensile stress.en
dc.publisherElsevier Science Bv, Amsterdam
dc.relationinfo:eu-repo/grantAgreement/EC/FP7/205533/EU//
dc.relationinfo:eu-repo/grantAgreement/MESTD/Technological Development (TD or TR)/32008/RS//
dc.rightsrestrictedAccess
dc.sourceMicroelectronic Engineering
dc.subjectFlexible electronicsen
dc.subjectStencil lithographyen
dc.subjectPolymer substrateen
dc.subjectFlexible interconnectsen
dc.subjectResistivityen
dc.subjectTensile stressen
dc.titleEffects of tensile stress on electrical parameters of thin film conductive wires fabricated on a flexible substrate using stencil lithographyen
dc.typearticle
dc.rights.licenseARR
dcterms.abstractБруггер, Јуерген; Саву, Вероница; Xие, Схенqи; Франтловић, Милош; Јокић, Ивана;
dc.citation.volume98
dc.citation.spage230
dc.citation.epage233
dc.citation.other98: 230-233
dc.citation.rankM22
dc.identifier.doi10.1016/j.mee.2012.07.016
dc.identifier.rcubConv_2866
dc.identifier.scopus2-s2.0-84865597276
dc.identifier.wos000309497200048
dc.type.versionpublishedVersion


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